A system for immersion cooling computing system equipment includes a container containing a volume of immersion cooling fluid. At least one heat generating computing system equipment component and a liquid-liquid heat exchanger are disposed in the volume of immersion cooling fluid. A manifold system is disposed between the heat generating computing system equipment component and the liquid-liquid heat exchanger to direct a flow of immersion cooling fluid between the heat generating computing system component and the liquid-liquid heat exchanger and to isolate the flow of immersion cooling fluid from a bulk amount of immersion cooling fluid. The flow of immersion cooling fluid and the bulk amount of immersion cooling fluid constitutes the volume of immersion cooling fluid.

The invention concerns an avionics bay (1) for the installation of at least one electrical module (M), comprising a fluid cooling system and a housing (2) that is complementary to the electrical module (M) and that comprises an open front face (21) through which the module (M) can be removably installed inside said housing (2), and a rear face (20) on which there are arranged electrical connectors suitable for being connected to the electrical module (M), characterised in that the fluid cooling system comprises a cold plate (3) that is disposed on the rear face (20) of the housing (2) that is suitable for cooling the electrical module (M) when said electrical module (M) is installed inside the housing (2).

A computer cabinet includes at least one rackable server cooled by a cooling circuit; a cooling circuit supply device including: two cooling modules, each cooling module including: a primary hydraulic circuit; a secondary hydraulic circuit; a heat exchanger; a pump; a controller to control the pump; a central control unit connected to the controller of each of the cooling modules;
the central control unit being capable of activating one of the cooling modules while the other cooling module is inactive.

An electronic device may include a backplane and an electrical connector carried by a front side of the backplane, and a circuit board assembly removably coupled to the electrical connector. Each circuit board assembly may include a circuit board and electronic components carried by the circuit board and generating waste heat, and a cooling fluid arrangement thermally coupled to the electronic components. The electronic device may include a cooling fluid manifold, and a pair of multi-functional tubes that provide alignment, keying, structural rigidity and fluid supply and return capabilities extending between the cooling fluid manifold and the cooling fluid arrangement.

A switch-mode power supply waste heat recovery and utilization system includes a switch-mode power supply unit, an air conditioner and a water storage tank that are all connected with pipes. The switch-mode power supply unit, the air conditioner and the water storage tank are in communication with each other through the pipes. The switch-mode power supply unit includes a cabinet. Fixed plates are fixedly connected to an inner side wall of the cabinet and arranged at equal intervals. A top and a bottom of the cabinet and respective interiors of the fixed plates are formed with cavities. The pipes are in communication with the cavities. A fan is fixedly connected to a side wall of the water storage tank, and is matched with the water storage tank. A filter screen is insertedly connected to an inner side wall of the water storage tank. A filter cotton is horizontally provided under the filter screen.

An uninterruptible power supply (UPS) includes: a housing defining an interior space; a door operatively connected to the housing, the door being configured to be selectively opened and closed for accessing the interior space of the housing; san electrical system enclosed within the housing; at least one liquid cooling device mounted to a target component of the UPS disposed within the housing for cooling thereof, the at least one liquid cooling device defining a fluid conduit for circulating fluid therethrough; and a pumping module including at least one pump fluidly connected to the at least one liquid cooling device for circulating fluid therethrough, each of the at least one pump and the fluid conduit of the at least one liquid cooling device defining in part a liquid cooling circuit, the pumping module being mounted to the door and disposed on an exterior side thereof.

An electronic device may include a backplane and an electrical connector carried by a front side of the backplane, and a circuit board assembly removably coupled to the electrical connector. Each circuit board assembly may include a circuit board and electronic components carried by the circuit board and generating waste heat, and a cooling fluid arrangement thermally coupled to the electronic components. The electronic device may include a cooling fluid manifold, and a pair of multi-functional tubes that provide alignment, keying, structural rigidity and fluid supply and return capabilities extending between the cooling fluid manifold and the cooling fluid arrangement.

Systems and methods for providing an electronic cooling apparatus comprising a chassis having an internal space that is sized/shaped to receive/structurally support circuit card(s). The internal space defined by sidewalls with a channel formed therein in which a coolant is disposed. The coolant is in thermal communication with the circuit card(s) via the sidewall(s) when the circuit card(s) is(are) disposed in the chassis. A refrigerant-based cooling system is disposed in the chassis and comprises an evaporator having inlet/outlet ports coupled to the channel of the chassis to define a first closed-loop channel for the coolant within the chassis. The evaporator facilitates heat transfer from the coolant to a refrigerant flowing through a second closed-loop channel of the chassis at least partially defined by the evaporator. A pump is disposed in the chassis and configured to cause the coolant to flow through the first closed-loop channel.

A serving rack cooling device. The device includes a rack; an enclosure provided inside the rack; a module provided inside the enclosure; a main pipe provided in the rack; a branching tube connected to the main pipe; a cooling unit that cools a heat-generating component mounted on the module; a first connection tube that connects the branching tube with the cooling unit; and a plurality of module connection portions that are provided inside the enclosure and to which the module is connected. The enclosure can slide in a state in which the module is connected to the module connection portion, and the cooling unit and the branching tube are connected by the first connection tube.

A printed circuit board comprises: a network controller; a memory controller; a heterogeneous processor; a field-programmable gate array (FPGA); and a non-volatile-media controller. The memory controller comprises: a fabric controller component configured to communicate with the network controller, the heterogeneous processor, the FPGA, and the non-volatile-media controller; and a media controller component configured to manage access relating to data stored in a volatile memory media. The FPGA is configured to perform computations relating to data stored via the non-volatile-media controller. The heterogeneous processor is configured to perform computation tasks relating to data stored via the memory controller. The printed circuit board is configured to be plugged in to a rack with a plurality of other plugged-in circuit boards.