A sub-module cooling device of a power transmission system is proposed. Sub-modules may be arranged in a row on each of multiple layers of a frame. Heat generated by the sub-modules may be transferred to a duct through heat pipes, and the heat transferred through the heat pipes may be discharged to the outside while air coming out from an air conditioner passes through the duct. When the heat generated by the sub-modules is discharged in this manner, a cooling fan may not be required to be installed in each of the sub-modules. Air may be flown by the operation of the air conditioner and may absorb the heat generated by the sub-modules and discharge the heat to the outside.

An optical communication system includes a co-packaged optical module and a heatsink mounted to the co-packaged optical module. The co-packaged optical module includes a processor disposed on a substrate and a plurality of light engines disposed at different locations around the processor on the substrate. The processor and the light engines generating different amounts of heat during operation. The heatsink includes a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of heat generated at a location of the processor and respective locations of the different ones of the light engines.

Housing structure for PCI Express expansion electronic boards able to mechanically stabilize said PCI Express expansion electronic boards so as to guarantee the correct functioning, performance and integrity of the electric interconnection between them and the basic electronic board to which they are connected if there are mechanical stresses such as knocks or vibrations, in order to be able to use PCI Express expansion electronic boards in the automotive field, or in scenarios characterized by perturbations of the important mechanical type. The present invention also concerns an assembly method of the housing structure.

An evaporator incorporated into a transportation machine includes: heat exchange units aligned in a horizontal direction in the transportation machine placed on a horizontal surface and whose positions change together; distribution conduits connected respectively to the heat exchange units to supply a working fluid in a liquid phase to the heat exchange units; and valves disposed respectively in the distribution conduits to block passage of the working fluid flowing from the heat exchange units toward the distribution conduits at least when a tilt of the heat exchange units is equal to or greater than a predetermined threshold. Each heat exchange unit includes: an inlet portion connected to the distribution conduit; and a heat exchange portion that includes at least one heat exchange path extending straight upward from the inlet portion and that allows the working fluid passing through the heat exchange path to exchange heat with the heat source.

A server rack thermosiphon system includes a plurality of evaporators, each evaporator including a thermal interface for one or more heat-generating server rack devices; at least one condenser mounted to an external structure of a server rack, the condenser including a fluid-cooled heat transfer module; a liquid conduit that fluidly couples each of the evaporators to the condenser to deliver a liquid phase of a working fluid from the condenser to the evaporators; and a vapor conduit that fluidly couples each of the evaporators to the condenser to deliver a mixed phase of the working fluid from the evaporators to the condenser.

An electronic assembly may include a chassis, and electronic modules mounted within the chassis. Each electronic module may include a printed circuit substrate, heat-generating electronic components mounted on the printed circuit substrate, and a heat sink body mounted to the printed circuit substrate and having a plurality of heat pipe receiving passageways extending between opposing side edges and overlying corresponding heat-generating components. A respective elongate, passive, heat pipe may extend within each heat pipe receiving passageway and be removably fastened to at least one end to the heat sink body for enhanced conductive heat transport.

An electronic assembly may include a chassis, and electronic modules mounted within the chassis. Each electronic module may include a printed circuit substrate, heat-generating electronic components mounted on the printed circuit substrate, and a heat sink body mounted to the printed circuit substrate and having a plurality of heat pipe receiving passageways extending between opposing side edges and overlying corresponding heat-generating components. A respective elongate, passive, heat pipe may extend within each heat pipe receiving passageway and be removably fastened to at least one end to the heat sink body for enhanced conductive heat transport.

An integrated heatsink for a co-packaged optical-electrical module includes a base plate attached on top of a co-packaged optical-electrical module. The integrated heatsink further includes a plurality of fin structures extended upward from the base plate except a central cavity region with missing sections of fins, each fin extended along an axial direction from a front edge to a back edge of the base plate except some trenches shallow in depth across some fin structures and some other trenches deep in depth down to the base plate either along or across some fin structures. Additionally, the integrated heatsink includes multiple heat pipes including shaped portions embedded in the trenches in the plurality of fin structures. At least one bottom horizontal portion per heat pipe is brazed to the base plate in a corresponding region that is superimposed on hot spots of the co-packaged optical-electrical module under the base plate.

Housing structure for PCI Express expansion electronic boards able to mechanically stabilize said PCI Express expansion electronic boards so as to guarantee the correct functioning, performance and integrity of the electric interconnection between them and the basic electronic board to which they are connected if there are mechanical stresses such as knocks or vibrations, in order to be able to use PCI Express expansion electronic boards in the automotive field, or in scenarios characterized by perturbations of the important mechanical type. The present invention also concerns an assembly method of the housing structure.

A cooling unit having two single piece cold plate pipe components is disclosed. The cooling unit has a first pipe operable to transport coolant. A first cold plate has a top surface with a lateral groove to accept a section of the first pipe. The groove includes a first inlet coupled to a first hole in the section of the first pipe. The groove has a first outlet coupled to a second hole in the section of the first pipe. Coolant is circulated from the first inlet through the cold plate to the first outlet. The section of the first pipe is connected to the first cold plate. A second pipe is operable to transport coolant. A second cold plate is located next to the first cold plate. The second cold plate has a groove to accept a section of the second pipe. The groove includes an inlet coupled to a first hole in the section of the second pipe. The groove includes an outlet coupled to a second hole in the section of the second pipe. The coolant is circulated from the second inlet through the second cold plate to the second outlet. The section of the second pipe is connected to the second cold plate.