An aircraft with a thermal management system and method of operating the thermal management system within an aircraft includes an avionics unit adapted to store at least one heat generating component, a first interface operably coupled to the avionics unit and thermally coupled to the at least one heat generating component; and a plurality of heat pipes, wherein a first end of the plurality of heat pipes is coupled to the first interface, defining a hot interface, and a second end of the heat pipes is coupled to the at least one of the fuselage, the wing, the skin, or the support structure.

In an example, a node of a telecommunications system includes a first section having one or more passive components; a second section including one or more power amplifier modules and a power supply, wherein the second section is coupled to the first section using fasteners; a distribution unit including a plate and a circuit board, wherein the second section is coupled to the distribution unit using fasteners; a cooling section; a first plurality of heat pipes extending from the one or more power amplifier modules to the cooling section; a second plurality of heat pipes extending from the first section into the second section; and a housing enclosing the first section and the second section.

A heat frame and a processing device are provided. The heat frame includes a plurality of fins and at least one heat pipe extending through a hole provided in each of the plurality of fins. The heat frame is coupled to a cooling chassis. The processing device includes a processing module, a first heat frame, and a second heat frame.

A heat dissipation apparatus is provided, and the apparatus includes an evaporator and a plurality of ribbed plates. The evaporator has a first cavity, and the first cavity is configured to accommodate a working medium for vapor-liquid two-phase conversion. The ribbed plate includes a first side plate and a second side plate, a side that is of the first side plate and that faces the second side plate has a plurality of first protruding parts, a side that is of the second side plate and that faces the first side plate has a plurality of second protruding parts, and each first protruding part is fixedly connected to one corresponding second protruding part, so that a second cavity between the first side plate and the second side plate is divided into channels that are connected to the first cavity. The apparatus is used to effectively dissipate heat for a base station.

A server rack thermosiphon system includes a plurality of evaporators, each evaporator including a thermal interface for one or more heat-generating server rack devices; at least one condenser mounted to an external structure of a server rack, the condenser including a fluid-cooled heat transfer module; a liquid conduit that fluidly couples each of the evaporators to the condenser to deliver a liquid phase of a working fluid from the condenser to the evaporators; and a vapor conduit that fluidly couples each of the evaporators to the condenser to deliver a mixed phase of the working fluid from the evaporators to the condenser.

An aircraft with a thermal management system and method of operating the thermal management system within an aircraft includes an avionics unit adapted to store at least one heat generating component, a first interface operably coupled to the avionics unit and thermally coupled to the at least one heat generating component; and a plurality of heat pipes, wherein a first end of the plurality of heat pipes is coupled to the first interface, defining a hot interface, and a second end of the heat pipes is coupled to the at least one of the fuselage, the wing, the skin, or the support structure.

An electronic chassis for enclosing and cooling electronic equipment is described that includes an oscillating heat pipe (OHP), wherein a first portion of the OHP extends into a rail of the chassis and a second portion of the OHP extends into the side panel on which the rail is located so that at least a portion of heat from operation of electronic equipment on a circuit card assembly (CCA) in contact with the rail passes through the rail to the OHP and from the OHP to a side panel of the chassis on which the rail is located where it is dissipated into an environment. In some instances, the side panel includes cooling fins. Also described is a method for forming such a chassis substantially of metal such as aluminum or its alloys using 3D printing or additive manufacturing.

An electrical equipment cabinet cooling device includes an electrical equipment cabinet having a cabinet outer frame defining an inner perimeter wall. A planar outer cabinet wall is positioned within the inner perimeter wall. A two-phase thermal device includes spaced and opposed first and second transfer walls. An outer perimeter wall connects the first and second transfer walls and defines an interior sealed cavity between the first and second transfer walls. The outer perimeter wall is sized for slidable receipt within the inner perimeter wall. A liquid/vapor retained in the interior sealed cavity acts as a heat transfer medium between the first and second transfer walls. A convective cooling block has a planar end face in direct contact with the second transfer wall. Heat transfers to atmosphere in a path including the outer cabinet wall, the first transfer wall, the liquid/vapor, the second transfer wall, and the cooling block.

A cooling system (100) for equipment is disclosed, the equipment comprising an air ingress (104) and an air egress (106). The cooling system comprises a compression chamber (108) arranged to compress air exiting the equipment from the equipment air egress (106), and a refrigerant circuit (110) comprising a condenser coil (112), an evaporator coil (114) and a conduit (116) arranged to convey refrigerant fluid between the condenser coil (112) and the evaporator coil (114). The evaporator coil (114) is arranged to cool air entering the equipment at the equipment air ingress (104) and the condenser coil (112) is located within the compression chamber (108). Also disclosed are methods (300, 400) and apparatus for cooling equipment.

A fanless cooling system for particularly fail-safe and efficient cooling of electronic modular systems in vehicles, more particularly in rail vehicles, includes a preferably frame-shaped rack or assembly carrier for holding at least one module or assembly, more particularly a processor module having high-performance multi-core processors. A heat transport body can be mounted in a heat-transferring manner on a part or component of the module. The rack has at least one heat distribution body, to which the heat transport body can be fastened in a heat-transferring manner, preferably detachably, when the module having the part coupled to the heat transfer body is held in the rack. At least one heat tube is connected to the heat distribution body in a heat-transferring manner. An electronic modular system with a fanless cooling system is also provided.