The cooling system comprises: at least one plate member forming a wall of a casing inside which the electronic apparatus to be cooled is accommodated in use, the plate member having a first side facing in use towards the apparatus and a second side opposite to the first side; and a fluid circuit formed in the plate member, wherein the fluid circuit comprises a first duct formed on the first side of the plate member and extending along a first labyrinth path and a second duct formed on the second side of the plate member and extending along a second labyrinth path. The plate member has a first through hole and a second through hole through which the first duct and the second duct are in in fluid communication with each other.

An apparatus for providing immersion cooling in a compact-format circuit card environment comprises a plurality of circuit cards. A plurality of thermal energy transfer devices is provided, each thermal energy transfer device at least partially inducing a respective one of first and second operating temperatures to a corresponding circuit card subassembly. At least one first temperature cooling manifold is in selective fluid communication with at least one first operating temperature thermal energy transfer device. At least one second temperature cooling manifold is in selective fluid communication with at least one second operating temperature thermal energy transfer device. A plurality of manifold interfaces is provided, each manifold interface being in fluid communication with a corresponding thermal energy transfer device. A housing includes first and second operating fluid inlets in fluid communication with first and second operating fluid outlets, respectively.

A system and method for cooling electronic devices disposed within the inner volume of an enclosure. The inner volume of the enclosure contains one or more single phase or multi-phase thermally conductive fluids and may contain solid or sealed hollow structures that displace and direct thermally conductive fluids.

In order to reduce the dimensions of a heat exchanger it is suggested to configure the heat exchanger in such a way that it has a heat exchanging element comprising a condenser unit and an evaporator unit. The evaporator unit comprises a lower end area, an upper end area and a plurality of channels for transporting a refrigerant from the lower end area to the upper end area, said refrigerant comprising liquid and gas. The upper end area is connected to the lower end area by a first line which is configured to transfer only liquid from the upper end area to the lower end area.

According to one embodiment, a thermal management system is provided that includes at least one chassis frame configured to minimize a thermal spreading resistance of the thermal management system. The chassis frame included at least one chassis body, at least one thermal skeleton embedded into the chassis body, and a working fluid contained within the thermal skeleton and used to dissipate heat from the chassis body.

A heat exchanger module includes a condenser unit and an evaporator unit. The evaporator unit includes N pieces of parallel-flow heat exchangers arranged adjacently, and the coolant temperatures reduce gradually from the first to Nth parallel-flow heat exchangers along an air flow direction in the evaporator unit. A counter-current mounting method is adopted in the parallel-flow heat exchangers of the evaporator unit in the heat exchanger module provided by the present invention. The coolant temperature of each parallel-flow heat exchanger is lower than that of the previous one, the temperature difference between air and coolant is relatively uniform by using the counter-current method so as to reach a better heat exchange effect.

A cooling system, in particular for electronics cabinets, is proposed, comprising a casing, wherein the casing comprises at least a cabinet side partitionment, wherein the cooling system comprises a first cooling circuit and a second cooling circuit, wherein the second cooling circuit is an active cooling circuit, wherein the first cooling circuit and the second cooling circuit are thermally coupled, wherein the second cooling circuit is not disposed in the cabinet side partitionment.

The disclosure relates to a cooling device, in particular for cooling components that are housed in a switchgear cabinet, comprising a first cooling fan for blowing air from the switchgear cabinet through a first heat exchanger, and a second cooling fan for blowing ambient air through a second heat exchanger, characterized in that the cooling device further comprises a voltage supply having a step-up and/or step-down converter, which is connected via a rectifier to a wide-range input for single-phase or multiphase AC voltage, and which charges a capacitor to a DC link voltage which is higher or lower than a mains voltage across the wide-range input, a power supply unit of at least one of the two cooling fans being connected in parallel to the capacitor. The disclosure further relates to the use of such a cooling device and to a corresponding method for operating the cooling device.

The cooling system comprises: at least one plate member forming a wall of a casing inside which the electronic apparatus to be cooled is accommodated in use, the plate member having a first side facing in use towards the apparatus and a second side opposite to the first side; and a fluid circuit formed in the plate member, wherein the fluid circuit comprises a first duct formed on the first side of the plate member and extending along a first labyrinth path and a second duct formed on the second side of the plate member and extending along a second labyrinth path. The plate member has a first through hole and a second through hole through which the first duct and the second duct are in in fluid communication with each other.

A system for cooling electronics includes at least two modular thermal energy storage cards stacked in one of a horizontal or a vertical stack, where the stack provides cooling to a portion to electronics. The cards include: a thermally conductive enclosure bounding an interior cavity, a cell wall structure that includes cells disposed within the interior cavity and in thermal communication with the thermally conductive enclosure, a phase change material having a melting point where the phase change material disposed within the cells and in thermal communication with cell walls of the cells, and a thermally conductive interface disposed between the thermally conductive enclosure and a portion of the electronics that includes a heat generating surface. The thermally conductive interface extends from the interior cavity a distance beyond the interior cavity of the enclosure and is in contact with the heat generating surface.