H05K7/20727

APPARATUS INCLUDING THERMAL MANAGEMENT MECHANISM AND METHODS OF MANUFACTURING THE SAME
20220338378 · 2022-10-20 ·

An apparatus including a heat sink having two or more sections of parallel fins that define colinear channels is disclosed herein. The colinear channels are configured to direct flow of air or coolant across the heat sink and have wider channel widths closer to an inlet for the air or coolant and narrower widths closer to an outlet for the air or coolant.

COOLING COMPUTING MODULES OF A RACK-MOUNTABLE TRAY
20220338386 · 2022-10-20 ·

An information handling system, including a plurality of computing modules; a rack-mountable tray including: a plurality of bays, each bay including a cold fluid intake and a warm fluid return, wherein each computing module of the plurality of computing modules is engaged with the cold fluid intake and the warm fluid return of one or more of the bays of the plurality of bays; and a fluid circulation system positioned within the tray and coupled to the cold fluid intake and the warm fluid return of each of the bays, the fluid circulation system introducing, for each bay that a respective computing module is engaged with, fluid within the computing module via the cold fluid intake of each bay and returning warm fluid via the warm fluid return of each bay to transfer heat from the computing modules.

Multiple phase multiple system architecture
11627687 · 2023-04-11 · ·

A multiple phase cooling system is described for an electronic rack, a cluster of servers, and for a data centers. An inlet of a 3-way flow control valve (FCV) is coupled to a main coolant source. A first outlet of the FCV is coupled to a single-phase cooling system and a second outlet of the FCV is coupled to a two-phase cooling system. The FCV is configured to adjust an amount of coolant between the single-phase cooling system and the two-phase cooling system. Upon detecting a rise in vapor pressure in a return line of the two-phase cooling system, the FCV can be adjusted to direct more coolant to the two-phase cooling system and less coolant to the single-phase system. The FCV can continuously monitor the vapor pressure and adjust the amount of coolant to each cooling system accordingly.

MOUNTING STRUCTURE FOR PREVENTING INCORRECT MOUNTING AND INSTALLATION OF COOLING FAN, ELECTRONIC DEVICE, AND SERVER
20230141410 · 2023-05-11 ·

A structure for mounting a cooling fan easily and conveniently and in the correct orientation only includes a chassis and at least one fan module. The chassis has a block, a first nut, and a second nut. The fan module has at least one accessory. The block is mounted on the first nut or the second nut. When the block is fixed on the first nut, the fan module can only be placed and installed so as to blow air into the chassis, and when the block is fixed on the second nut, the fan module can only be installed so as to extract air out of the chassis, thereby ensuring the correct mode of operation. An electronic device and a server using the structure is also disclosed.

Pivotable removable fan module for a rackmount network device chassis

A fan tray, for a fan module of a network device chassis, may include an inner assembly that includes an inner cassette, one or more fans connected to the inner cassette, a first latch connected to the inner cassette and configured to removably connect to an outer assembly of the fan tray, and a fan controller connected to the inner cassette and configured to control operation of the one or more fans. The outer assembly may be configured to receive and retain the inner assembly, and may include an outer cassette with one or more openings configured to communicate with the one or more fans, a second latch connected to the outer cassette and configured to removably connect to a rear portion of the network device chassis, and an adaptor connected to the outer cassette and configured to connect and provide power to the fan controller.

Server constructed with trays for hard disk modules

A server containing hard disk modules which can be slid into place and which allow connection at the front and at the rear of a housing. The server includes the housing which defines an opening, the hard disk modules, and a plurality of trays. Receiving channels communicating with the opening are defined in the housing, the receiving channels are isolated and arranged side by side and each channel can receive one tray. A hard disk module is positioned in one tray, a front end and a rear end of the housing defines front connection port and rear connection port for cable connections to each hard disk module.

Liquid manifold for replacing air mover module in hybrid cooling applications

An information handling system may include an information handling resource, at least one fluidic conduit thermally coupled to the information handling resource and configured to convey a cooling liquid proximate to the information handling resource in order to cool the information handling resource, an air mover support infrastructure comprising a plurality of bays, each bay of the plurality of bays configured to receive an air mover for cooling components of the information handling system, and a liquid manifold sized and shaped to be received in at least one of the plurality of bays and received in a first bay of the plurality of bays and configured to enable at least one fluidic conduit to fluidically couple to an external cooling system, wherein the external cooling system is configured to deliver cooled cooling liquid to the information handling system, receive warmed cooling liquid from the information handling system, and cool the warmed cooling liquid.

SLED MOUNTED PROCESSING NODES FOR AN INFORMATION HANDLING SYSTEM

A sled mounted processing node apparatus includes a first processing node sled. A first printed circuit board (PCB) is coupled to the processing node sled. Electronic components, including at least one processor, are coupled to the PCB. The apparatus includes a second processing node sled having a second PCB connected to the second processing node sled and a second set of electronic components, including at least one second processor, coupled to the second PCB. The at least one processor and second processor collectively enables increased processing density within a single server chassis. Each processing node sled is configured to be slideably inserted and removed from a server chassis that accommodates concurrent insertion of multiple processing node sleds in respective sled bays of the server chassis.

Techniques to configure physical compute resources for workloads via circuit switching

Embodiments are generally directed apparatuses, methods, techniques and so forth to select two or more processing units of the plurality of processing units to process a workload, and configure a circuit switch to link the two or more processing units to process the workload, the two or more processing units each linked to each other via paths of communication and the circuit switch.

COOLING FAN ASSEMBLY AND GUIDANCE TRACK FOR INSTALLING AND REMOVING A COOLING FAN

An apparatus includes a fan having a fan housing with guidance members extending from opposing sides of the housing, wherein the fan housing has a depth that is less than a height and width. A handle is pivotably coupled to the fan housing, and guidance tracks are positioned on opposing sides of an open channel. Each of the guidance tracks has a first track portion extending from a first face of a chassis in a first direction into the chassis and a second track portion extending from the first track portion in a second direction. The guidance members move along the corresponding guidance tracks, wherein the fan housing moves along the first track portion in a sideways orientation and reaches an operating orientation in the second track portion.