A fan tray system includes a fan tray base that couples to a chassis and that includes fan system connector(s) for connecting to a fan system. A fan tray side wall includes fan system guide member(s) that align the fan system for connection to the fan system connector(s), and is connected to the fan tray base by a moveable coupling that allows relative movement between the fan tray side wall and the fan tray base. That relative movement allows the fan tray side wall to be positioned in a first orientation when the fan tray base is coupled to the chassis such that the fan tray side wall is positioned adjacent a chassis wall of the chassis and impedes access component(s) in the chassis. That relative movement also allows the fan tray side wall to be moved to a second orientation that allows access to the component(s) in the chassis.

In one embodiment, an electromagnetic interference (EMI) shielding faceplate is configured to mount to a line-card slot of a multi-line-card electronic enclosure having an airflow cooling system. A perforation pattern in the faceplate defines an array of perforations in the faceplate, while a flow control sheet affixed to the faceplate and covering an adjustable percentage of the array of perforations in the faceplate from 0-100%, where an amount of airflow impedance caused by the perforations for the airflow cooling system is based on the percentage of the array of perforations covered by the flow control sheet.

An information handling system includes a vibration source, a vibration sink, and a damping seal. The damping seal includes a top surface and a bottom surface. The top surface may be placed in physical communication with the vibration source. The bottom surface may be placed in physical communication with the vibration sink. The damping seal may be compressed in between the vibration source and the vibration sink. The compression of the damping seal in between the vibration source and the vibration sink may provide an airflow seal within the information handling system. The damping seal may be molded from a semi-rigid material to provide vibration damping from the vibration source to a vibration sensitive component of the information handling system.

Systems and methods for a profile-modeling cable clip for sealing airflow in an Information Handling System (IHS) chassis. In some embodiments, a profile-modeling cable clip for sealing airflow in an IHS chassis may include a base and a plurality of comb teeth coupled to the base via spring elements, where each of the comb teeth is independently compressible.

An information handling system includes a computing component that is sensitive to corrosion; and a chassis in which the computing component is disposed. The chassis receives an airflow used to thermally manage the computing component, and expels the airflow after thermally managing the computing component. The information handling system also includes an environmental control component that reduces a condensation formation propensity of a portion of the airflow that traverses the chassis proximate to the computing component.

A frame assembly for holding cooling fans without the use of screws or rivets includes a bottom plate, a frame on the bottom plate, a slider on the frame, a position pin, and a sliding pin. The frame comprises first and second plates, the first plate defining first and second slots extending in different directions. An end of the sliding pin is connected to the slider, other end of the sliding pin is movable within the second slot, and the slider defines a third slot. The orientation of the second slot is such that pushing the assembly against a spring releases the clamping action of the first and second plates on the assembled fans, and releasing the first and second plates allows the fans in the assembly to be reclamped.

An enclosure of an electronic computing apparatus allows two electronic computing modules, each having a built-in fan, to be mounted in a perpendicular direction, when the two electronic computing modules are inserted, a shutter is at an intermediate position due to an elastic force of pushing a spring cover in a front surface direction, from push rods corresponding to the two electronic computing modules, and when one of the electronic computing modules is removed, the elastic force of pushing the cover from the push rod on the removal is lost, and the shutter moves, around a rotating mechanism, to a side of a housing space on the removal side and shuts off a flow path in the housing space.

A power conversion device includes a housing, a power conversion unit, a fan, and a flexible shutter. The shutter is in a sheet shape. The shutter includes an end portion and a movable portion, the end portion being fixed to at least one of the housing and a frame body, the movable portion being movable with respect to the housing. The shutter is configured to be deformed by wind from the fan in a case where the fan is driven and to form a gap through which the wind passes between the shutter and at least one of the housing and the frame body.

A multiple graphics processing unit (multi-GPU) platform including a cubby chassis and at least one multi-GPU sled. The cubby chassis includes partitions defining a plurality of sled positions. The multi-GPU sled includes a chassis having a vertical sidewall and a horizontal bottom wall with an open top and an open side. A side-plane PCB is mounted to the vertical sidewall and a plurality of dividers are attached to the bottom wall and oriented perpendicular to the side-plane PCB. One or more GPU cards are connected to the side-plane PCB and are supported on the plurality of dividers. The GPU cards include a GPU PCB having a first side facing the bottom wall and an outward facing second side. A cover is coupled to the horizontal bottom wall to enclose the open side of the sled chassis and help direct airflow across the GPU cards.

A rack-mountable computer system enables an airflow that cools components in an upstream portion of the computer system interior to be cooled through mixing with a bypass airflow downstream of the components in the upstream portion. The mixed airflow can cool components in a downstream portion of the interior. The bypass airflow is directed by a bypass plenum that is unencompassed by the separate plenum that directs the airflow to cool the upstream portion components. The bypass plenum can be at least partially established by an external surface the computer system and one or more external structures, including an external surface of an adjacently mounted computer system. Relative flow rates through the separate plenums can be adjusted, via flow control elements, to separately control heat removal from components upstream and downstream of the air mixing, based at least in part upon air temperatures in the separate interior portions.