Technology is provided for a data storage server drawer. The server drawer includes a drawer chassis having first and second lateral drive bays separated by a central channel. The drawer chassis includes a front wall including one or more air flow openings, a bottom wall having one or more louvers opening toward the front wall, and a pair of sidewalls. A pair of drawer slides are each disposed on a corresponding one of the pair of sidewalls and configured for attachment to a rack. A first plurality of data storage devices is positioned in the first drive bay and a second plurality of data storage devices is positioned in the second drive bay. At least one data server is disposed in the central channel.

A computer system includes a chassis, one or more hard disk drives coupled to the chassis, and one or more air passages under at least one of the hard disk drives. The air passages include one or more air inlets and one or more air outlets. The inlets direct at least a portion of the air downwardly into the passages. The passages allow air to move from the air inlets to the air outlets.

Example embodiments of the present invention provide a method of manufacture and an apparatus for optimized server design using dense DIMM spacing, wide heatsink, improved routing channels, and improved air delivery to rear devices. The method of manufacture comprise providing a plurality of compliant pin memory sockets on a first side of a circuit board at a pitch less than that specified in a reference layout requiring solder tail memory sockets and providing a plurality of surface mount capacitors on the second side of the circuit board enabling at least one pair of the plurality of compliant pin memory sockets to be provided at the pitch less than that specified in the reference layout.

A blank cartridge includes an impedance portion to control a flow of cooling media through the blank cartridge to a plurality of computing components, and an actuator to change an impedance level of the impedance portion. The actuator receives a control signal to change the impedance level of the impedance portion based on a location of the plurality of computing components relative to the blank cartridge.

A system may include a plurality of temperature sensors configured to sense temperatures at a plurality of locations associated with an information handling system, a cooling subsystem comprising at least one cooling fan configured to generate a cooling airflow in the information handling system, and a thermal manager communicatively coupled to the plurality of temperature sensors and the cooling subsystem. The thermal manager may be configured to, based on at least a power provided to a subsystem of the information handling system, estimate a thermal condition proximate to the subsystem, correlate each of a plurality of components of the subsystem and a linear airflow velocity requirement of the component to a respective speed of the at least one cooling fan required to provide such airflow requirement, and set a speed of the at least one cooling fan based on the respective speeds.

An electronic apparatus includes: a fan which flows cooling air in a flow passage; a plurality of modules which are arranged in the flow passage, the modules including first and second modules, the first and second modules being aligned with a flow direction of the cooling air; and a support member that supports the first module, and makes a portion of the first module protrude further than the second module in a direction approximately orthogonal to the flow direction.

A system may include a plurality of temperature sensors configured to sense temperatures at a plurality of locations associated with an information handling system, a cooling subsystem comprising at least one cooling fan configured to generate a cooling airflow in the information handling system and a thermal manager communicatively coupled to the plurality of temperature sensors and the cooling subsystem. The thermal manager may be configured to, based on at least a power provided to a subsystem of the information handling system, estimate a thermal condition proximate to the subsystem and set a speed of the at least one cooling fan based on the estimated thermal condition and a required linear airflow velocity associated with the subsystem.

A system, a shelf, and a high density platform optimize the physical arrangement of cards to maximize cooling effectiveness and line card pitch while minimizing backplane trace lengths between line interface and switch fabric cards. The shelf and system and associated card arrangement supports scaling to a larger, double-size system that maintains the required length of backplane traces for card communications without compromising card cooling. Advantageously, the shelf and system maintains full NEBS compliance through an arrangement supporting full air intake/outtake through a front and/or back of the shelf or system, i.e. no side ventilation, and includes a false front to ensure all cards (switch fabric and line interface cards) are substantially flush with one another.

An air baffle for optimizing thermal performance of memory components provided in a chassis is disclosed. The air baffle has a body and one or more venting units provided on the body. The body is configured to be removably coupled to the chassis. The body covers the memory components when coupled to the chassis. The one or more venting units direct air flowing through the chassis. Each of the venting units includes vent openings and a corresponding number of adjustable venting plates. The vent openings are each aligned with the memory components when the body is coupled to the chassis. Each of the adjustable venting plates have an open position or a closed position. A respective venting plate of the adjustable venting plates in the open position allows airflow through a respective vent opening of the vent openings. The respective venting plate of the adjustable venting plates in the closed position blocks airflow through the respective vent opening of the vent openings.

Example implementations relate to a fan module assembly. One example fan module assembly includes a basepan housed in a chassis of a computing device. The basepan includes a distal end. The fan module assembly also includes a plurality of pins extending from the basepan. The plurality of pins includes a first pin and a second pin. The first pin and the second pin are staggered with respect to a plane defined by the distal end. The fan module assembly further includes a fan module attached to the basepan via the first pin and the second pin.