A dual redundant cooling system for a container is provided. The dual redundant cooling system includes a first cooling unit and a second cooling unit. The first cooling unit is positioned in a first cabinet attached to the container. The first cooling unit includes a first controller operating a first cooling loop to cool an interior of the container. The second cooling unit is positioned in a second cabinet attached to the container and adjacent the first cabinet. The second cooling unit includes a second controller operating a second cooling loop to cool the interior of the container. The first cooling unit and the first cooling loop are separate from the second cooling unit and the second cooling loop. The first controller and the second controller communicate a switch signal between each other so that either the first cooling unit is a primary cooling unit operating the first cooling loop or the second cooling unit is the primary cooling unit operating the second cooling loop. The switch signal switching the primary cooling unit.

An adaptive airflow flapper assembly may be configured to when present in a first chassis bay adjacent to a second chassis bay unpopulated with a another information handling resource module, close to a closed position relative to the enclosure such that, due to non-overlap of the enclosure airflow openings relative to the flapper airflow openings, the adaptive airflow flapper assembly prevents airflow between the interior and the exterior of an enclosure, and when present in the first chassis bay adjacent to the second chassis bay populated with the second information handling resource module, open to an open position relative to the enclosure to allow airflow between the interior and the exterior of the enclosure.

Cooling systems of one or more electronic racks in a cluster or point of deliver (PoD) are disclosed. A data center system includes an array of electronic racks. Each electronic rack contains a number of server chassis. The system further includes a number of rear cooling doors respectively connected to the electronic racks. Each rear cooling door cools warm/hot air exhaust from a corresponding electronic rack. The system further includes a number of airflow distributors. Each airflow distributor attaches to a side of an electronic rack to supply and distribute a cool/cold airflow to the electronic rack. The distributor either assembled in the PoD or pre-attached with the racks. The system further includes a containment to direct the cooled air towards the airflow distributors.

An electronic device including a housing that accommodates a circuit board and a first electronic component connected to the circuit board, and that has an opening portion that opens upward; a cover that is provided on an upper portion of the housing, that at least partially covers the opening portion, and that has a second electronic component mounted thereon; a connecting wire that connects the second electronic component to the circuit board; and an opening/closing mechanism that can open and close the cover in a state in which the second electronic component and the circuit board are connected by the connecting wire.

Apparatuses and methods are provided for blocking removal of an air-moving assembly from a housing when in operational state. The apparatus includes a protective louver assembly having a louver(s) and an interlock element(s). The louver(s) is disposed at an air inlet or an air outlet of the air-moving assembly, and pivots between an operational and a quiesced orientation, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The interlock element(s) is associated with the louver(s) to pivot with the louver(s) between the operational orientation and the quiesced orientation. In the operational orientation, the interlock element(s) blocks, at least in part, access to at least one fastener securing the air-moving assembly within the housing, and thereby prevents removal of the air-moving assembly from the chassis when in the operational state.

Technologies for switching network traffic include a network switch. The network switch includes one or more processors and communication circuitry coupled to the one or more processors. The communication circuity is capable of switching network traffic of multiple link layer protocols. Additionally, the network switch includes one or more memory devices storing instructions that, when executed, cause the network switch to receive, with the communication circuitry through an optical connection, network traffic to be forwarded, and determine a link layer protocol of the received network traffic. The instructions additionally cause the network switch to forward the network traffic as a function of the determined link layer protocol. Other embodiments are also described and claimed.

A fan module includes a fan body and metal plates. The fan body has a fan seat, and the fan seat is provided with coupling holes. The metal plates enclose the fan body and expose an outlet side. The position assembly includes a position frame and position members. The position frame has an air outlet and is fixed on the outlet side. The airflow shielding structure includes shutter plates and a connection rod. One side of the shutter plates are pivoted at the position frame, and the shuttle plates are capable of turning simultaneously for opening and closing the air outlet so as to maintain the normal operation of the server fan.

A tray for accommodating electronic components is disclosed. The tray has a body that defines a storage space for accepting electronic components in a side-by-side configuration. The body also defines a first airflow channel for guiding airflow from the storage space towards the outside of the body. The body has air inlets and air outlets for providing fluid communication with the storage space. The component bodies of the electronic components are configured to at least partially define a second airflow channel in the storage space for guiding, in use, the airflow from the air inlets to the air outlets, and has been selected for increasing a surface area of the first electronic component being in contact, in use, with the airflow in the storage space.

A component-level cooling system for cooling components in a chassis includes a fan in a housing positioned on a circuit board. The housing has a fan inlet on a side, a first fan outlet on one end and a second fan outlet on a second end opposite the first end. The first fan outlet may direct a first airflow in a first direction to a vent on a first panel of the chassis. The second fan outlet may direct a second airflow in a second direction opposite the first direction. A duct comprises a duct inlet for receiving the second airflow, an elbow for redirecting the second airflow in a third direction to avoid the second airflow from colliding with a main airflow to reduce acoustic noise, and a duct outlet located to avoid heated air exiting the duct from re-entering the fan inlet.

A computer chassis can include an airflow channel for permitting airflow specifically to cool one or more power supply units (PSUs) within respective power supply receiving space(s). The chassis can include a baffle device positioned between the power supply receiving space and the airflow channel for directing airflow through the PSU into the airflow channel. The airflow channel can be located between first and second spaces of the chassis, each containing computing components. The baffle device can include a cable passthrough that receives a cable that facilitates communication between component(s) in the first space and component(s) in the second space. The baffle device can include one or more ribs that stop the PSU from being fully inserted into the power supply receiving space when the PSU is inserted in an incorrect orientation, thus signaling to the user to remove the PSU and re-insert it in a correct orientation.