The present invention includes a cartridge and system utilizing the cartridge that cools a computer. The cartridge first within a server stand and urges forced fluid into the computer.

An electronic device is disclosed. The electronic device includes a chassis and at least one plugin unit mounted in the chassis. The plugin unit includes a substrate, a heat receiving member, a radiator, and a heat transfer member. The substrate mounts a first electronic component and a second electronic component having a higher heat release value than the first electronic component. The heat receiving member receives heat by contacting the second electronic component. The radiator is shaped as a duct. The heat transfer member transfers the heat from the heat receiving member to the radiator. The chassis includes a fan that generates air-current inside the radiator and on one or more component mounting surfaces of the substrate.

Custom cooling strategies may be implemented for different regions in computers, servers, and other information handling systems. Chassis architecture may have multiple cooling fans, with each fan cooling a different region via dedicated duct work. A user or administrator may thus implement different cooling strategies for internal components, based on different thermal curves defined for each different region.

The present application discloses a sound absorbing device to be placed in an airflow that is in a first direction. The sound absorbing device includes a housing; a plurality of sound absorbing units disposed in the housing to be passed by the airflow, the plurality of sound absorbing units being arranged in a direction perpendicular to the first direction, any two adjacent sound absorbing units being separated by a gap; and a plurality of supports fixed in the housing. The plurality of sound absorbing units are fixed to the housing through the plurality of supports.

A cooling system for use with a liquid to cool a computing device. The cooling system includes a first internal heat exchanger positioned within an enclosure of the computing device. The first internal heat exchanger is configured to receive a first portion of the liquid, flow the first portion through the first internal heat exchanger to dissipate heat from air flowing over the first internal heat exchanger, and discharge the first portion. The cooling system further includes a first fan operable to recirculate air through the enclosure to absorb heat produced by a plurality of components of the computing device and flow the heated air over the first internal heat exchanger to dissipate the heat.

A fan tray, for a fan module of a network device chassis, may include an inner assembly that includes an inner cassette, one or more fans connected to the inner cassette, a first latch connected to the inner cassette and configured to removably connect to an outer assembly of the fan tray, and a fan controller connected to the inner cassette and configured to control operation of the one or more fans. The outer assembly may be configured to receive and retain the inner assembly, and may include an outer cassette with one or more openings configured to communicate with the one or more fans, a second latch connected to the outer cassette and configured to removably connect to a rear portion of the network device chassis, and an adaptor connected to the outer cassette and configured to connect and provide power to the fan controller.

An information handling system includes a chassis having multiples sleds and an embedded controller. The embedded controller retrieves relative impedances for all of the sleds, and calculates a maximum available airflow for the first sled based the relative impedances of all other sleds. A baseboard management controller (BMC) of a first sled requests a boot operation for the first sled. The BMC collects configuration information for the first sled, and determines an airflow impedance of the first sled based on the configuration information. The BMC provides the airflow impedance and a power allocation request to the embedded controller. The BMC compares the maximum available airflow to a minimum airflow requirement for the first sled. If the maximum available airflow is less than the minimum airflow requirement, the BMC implements power limits for processors in the first sled to prevent overheating of components within the first sled.

A fan cage is at least adapted to a first fan and a second fan smaller than the first fan. The fan cage includes a cage body and an adjustment member. The cage body defines a first accommodation portion in a size fitting the first fan. The adjustment member is movably disposed on the cage body and switchable between a laid down status and an upright status within the first accommodation portion. When the adjustment member is in the upright status, the adjustment member is upright in the first accommodation portion so that the adjustment member and the cage body together define part of the first accommodation portion as a second accommodation portion in a size fitting the second fan.

A cooling system is described. The cooling system includes a support structure, a cooling element, and drive electronics. The cooling element has a central axis and is supported by the support structure at the central axis. First and second portions of the cooling element are on first and second sides of the central axis and unpinned. The first and second portions of the cooling element undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The cooling element further has first and second piezoelectrics having opposite polarizations. The first piezoelectric is part of the first portion of the cooling element. The second piezoelectric is part of the second portion of the cooling element. The drive electronics drive the first and second portions of the cooling element using a single drive signal.

Example field replaceable fan assemblies for peripheral processing units and related systems and methods are disclosed. An example apparatus includes a temperature sensor; a fan having a base; at least one memory; machine readable instructions; and processor circuitry to execute operations corresponding to the machine readable instructions to determine a first temperature based on an output of the temperature sensor; and cause the base of the fan to move based on the first temperature.