A computing device comprises a housing, a heat-generating electronic component, at least one additional electronic component, and a liquid cooling module. The heat-generating component, the at least one additional electronic component, and the liquid cooling module are all positioned inside the housing. The liquid cooling module is configured to cool the heat-generating electronic component, and includes at least one movable radiator. The at least one movable radiator is configured to move between a first position and a second position. When the at least one movable radiator is in the first position tank, the at least one movable radiator blocks access to the at least one additional electronic component within the housing. When the at least one movable radiator is in the second position, the at least one movable radiator allows access to the at least one additional electronic component within the housing.

A multiple phase cooling system is described for an electronic rack, a cluster of servers, and for a data centers. An inlet of a 3-way flow control valve (FCV) is coupled to a main coolant source. A first outlet of the FCV is coupled to a single-phase cooling system and a second outlet of the FCV is coupled to a two-phase cooling system. The FCV is configured to adjust an amount of coolant between the single-phase cooling system and the two-phase cooling system. Upon detecting a rise in vapor pressure in a return line of the two-phase cooling system, the FCV can be adjusted to direct more coolant to the two-phase cooling system and less coolant to the single-phase system. The FCV can continuously monitor the vapor pressure and adjust the amount of coolant to each cooling system accordingly.

Cooling systems of one or more electronic racks in a cluster or point of deliver (PoD) are disclosed. A data center system includes an array of electronic racks. Each electronic rack contains a number of server chassis. The system further includes a number of rear cooling doors respectively connected to the electronic racks. Each rear cooling door cools warm/hot air exhaust from a corresponding electronic rack. The system further includes a number of airflow distributors. Each airflow distributor attaches to a side of an electronic rack to supply and distribute a cool/cold airflow to the electronic rack. The distributor either assembled in the PoD or pre-attached with the racks. The system further includes a containment to direct the cooled air towards the airflow distributors.

A fan management system includes a chassis housing a storage fan system, a storage system cooled by the storage fan system, computing fan subsystems, and computing devices cooled by respective ones of the computing fan subsystems. Each of the computing devices detects a multi-computing-device configuration that includes the computing devices and, in response, determines a computing device chassis location for that computing device. Each computing device then receives fan inventory information that describes the storage fan system and the computing fan subsystems, distinguishes between the storage fan system and the computing fan subsystems based on the fan inventory information, identifies the computing fan subsystem that is configured to cool that computing device based on the computing device chassis location for that computing device, manages the computing fan subsystem that is configured to cool that computing device, and ignores the others of the computing fan subsystems.

A server comprises a cabinet, a computing node and a plurality of hard disk assemblies. The cabinet is provided with a computing node accommodating slot and a plurality of hard disk accommodating slots. The computing node is assembled in the computing node accommodating slot, wherein the computing node is not provided with any hard disk. The hard disk assemblies are respectively assembled in the hard disk accommodating slots, wherein each of the hard disk assemblies has a plurality of hard disks, and the plurality of hard disk is electrically connected to the computing node.

A thermal management system for cooling a computing device includes a cold aisle, a hot aisle, a radiator, and a plurality of source heat sinks thermally conductively connected to the radiator. The radiator connects the cold aisle to the hot aisle and flows a cooling fluid through an interior volume of the radiator. Each source heat sink is configured to connect to a heat-generating electronic component to thermally conductively connect the heat-generating component to a surface of the radiator.

A server device includes a casing, an electronic assembly, a cover, and a heat dissipation device. The electronic assembly includes a circuit board and at least one heat source. The circuit board is disposed on the casing, and the heat source is disposed on the circuit board. The cover is removably disposed on the casing. The heat dissipation device includes at least one air cooling heat exchanger and at least one liquid cooling heat exchanger. The air cooling heat exchanger is fixed on and thermally coupled with the heat source. The liquid cooling heat exchanger is fixed on the cover and thermally coupled with the air cooling heat exchanger.

An electronic device configured to be connected to external heat dissipation device and including chassis, heat source and heat dissipation assembly. The heat source is disposed in the chassis. The heat dissipation assembly includes evaporator, condenser and fin assembly. The evaporator is in thermal contact with the heat source. The condenser has outer surface, condensation space and liquid-cooling space. The outer surface faces away from the condensation space and the liquid-cooling space. The condensation space and the liquid-cooling space are not in fluid communication with each other. The condensation space is in fluid communication with the evaporator. The liquid-cooling space is configured to be in fluid communication with the external heat dissipation device. The fin assembly is in thermal contact with the condenser and protrudes from the outer surface of the condenser along direction away from the condensation space or the liquid-cooling space.

A server device includes a casing, an electronic assembly, a cover, and a heat dissipation device. The electronic assembly includes a circuit board and at least one heat source. The circuit board is disposed on the casing, and the heat source is disposed on the circuit board. The cover is slidably disposed on the casing. The heat dissipation device includes at least one air cooling heat exchanger and at least one liquid cooling heat exchanger. The air cooling heat exchanger is fixed on and thermally coupled with the heat source. The liquid cooling heat exchanger is fixed on the cover and thermally coupled with the air cooling heat exchanger.

In some examples, a controller for air and liquid cooling of electrical equipment is provided. The controller can include a cooling profile assignment module to assign a hybrid cooling profile based on temperature readings of electrical equipment; an air cooling control module to control a forced airflow cooling system for the electrical equipment in accordance with the assigned hybrid cooling profile; and a liquid cooling control module to control a liquid cooling system for the electrical equipment in accordance with the assigned hybrid cooling profile. The assigned hybrid cooling profile can indicate that the forced airflow cooling system is to be used as a primary cooling system for the electrical equipment unless temperature readings indicate that a heat profile of the electrical equipment is above a thermal threshold.