A device for covering a portion of a server rack includes a main body having a front side, a back side, and a longitudinal axis, a locking element connected to a first longitudinal end of the main body, and an anchor element at a second longitudinal end of the main body. The anchor element is configured to engage with and slide longitudinally relative to the server rack.

Technologies for managing configuration-free platform firmware include a compute device, which further includes a management controller. The management controller is to receive a system configuration request to access a system configuration parameter of the compute device and access the system configuration parameter in response to a receipt of the system configuration request.

A cooling system for an information handling system in a portable chassis comprises a fan housing containing two counterrotating impellers, wherein the axes of rotation of the two impellers are aligned with an axis of orientation relative to a rear surface of the portable chassis. By changing the angle of the axis of orientation, impellers with larger diameters may be positioned in the same fan area for increased volumetric airflow. The shape of the fan housing, the diameter of each impeller and the angle of the axis of orientation may be selected to direct and distribute a greater volumetric airflow for improved cooling of components in the portable chassis.

Several transportable datacenters are described. The transportable datacenters include transport systems allowing them to be transported between an assembly location and an operating location. The transportable datacenters also include a ventilation system for cooling processors positioned in racks in the datacenters. The ventilation system draws cold air from the environment, through processor bays containing the processors and then exhausts the air back to the environment.

The application provides a power supply device comprising two input ports disposed at a front end of the power supply device; at least one fan disposed behind the two input ports and two isolated power supplies connected respectively to the corresponding one of the two input ports and disposed behind the two input ports and the at least one fan. Each of the isolated power supplies comprises a main power circuit having at least one module, and each module comprises a PCB and a magnetic element and/or switching devices. The at least one module includes an isolated circuit module comprises a transformer having windings formed by laying copper in the PCB and the magnetic core fixed on the PCB. And at least one fan is configured for heat dissipation of the at least one module.

The invention relates to a switch cabinet arrangement with at least one IT rack or switch cabinet housing and with at least one cooling device, which has an air-liquid heat exchanger for cooling components accommodated in the IT rack or switch cabinet housing with cooled air, wherein the air-liquid heat exchanger comprises a first flow for cooled liquid and a first return for heated liquid, wherein the cooling device comprises a liquid-liquid heat exchanger, to the second flow of which the first return of the air-liquid heat exchanger is connected. A corresponding method is further described.

A solid state drive apparatus includes a casing including a top plate, a bottom plate, a first sidewall, and a second sidewall. A first substrate is disposed inside the casing. At least one first semiconductor chip is mounted on the first substrate. A second substrate is disposed inside the casing. At least one second semiconductor chip is mounted on the second substrate. A heat dissipation structure is disposed between the first substrate and the second substrate and includes a lower heat dissipation panel contacting the at least one first semiconductor chip. An upper heat dissipation panel contacts the at least one second semiconductor chip. An air passage is provided between the lower heat dissipation panel and the upper heat dissipation panel and extends from the first sidewall of the casing to the second sidewall.

The present invention includes a lateral support member for a server computer constructed to permit advantageous airflow. The present invention can be operated to shunt organized airflow into multiple computer cases and/or organized airflow from multiple computer cases to a dedicated heat reservoir.

A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first radiator, a second radiator, a connecting conduit, and an outlet conduit. The first radiator has a first top tank and a first bottom tank. The first top tank is coupled to the inlet conduit. The second radiator has a second top tank and a second bottom tank. The second radiator is positioned parallel to the first radiator. The first radiator and the second radiator are positioned at an angle relative to a bottom panel of the computing system. The connecting conduit has a first end coupled to the first bottom tank and a second end coupled to the second bottom tank. The outlet conduit is coupled to the second top tank.

According to one embodiment, a cooling system includes a primary condenser, a primary supply line and a primary return line that couples the primary condenser to a cold plate that is arranged to be used for electronics cooling to create a primary heat-transfer loop in which the condenser supplies liquid coolant to the cold plate and receives vapor produced by the cold plate, a secondary condenser, a secondary supply line that couples the secondary condenser to the primary supply line, a secondary return line that couples the secondary condenser to the primary return line, and a primary valve that is coupled to the secondary return line, where, in response to vapor pressure exceeding a pressure threshold, the valve at least partially opens to create a secondary heat-transfer loop in which the secondary condenser condense vapor back into liquid coolant that is supplied to the primary supply line.