Disclosed is a server rack system within an enclosed building and a process for directing air through a server facility. Air is channeled within a server rack assembly and then through a closed loop back again into the server rack assembly. Impediments may control the degree of airflow availability.

A modular data center includes a base electrical module having a casing, a controller supported by the casing, and a power distribution unit coupled to the controller. The modular data center further includes an equipment rack having a frame coupled to the base electrical module, with the frame of the equipment rack being configured to receive electronic equipment. The electronic equipment receives power from the base electrical module. The base electrical module is external to the equipment rack.

Embodiments are disclosed of an information technology (IT) rack. The IT rack includes an equipment enclosure with a front, a rear, and one or more partitions, each partition adapted to receive one or more pieces of liquid-cooled information technology (IT) equipment. One or more cooling doors are positioned on the back of the equipment enclosure, each having therein a heat exchanger, the heat exchanger that is fluidly coupled to at least one of the one or more pieces of liquid-cooled IT equipment forming liquid cooling loops. Each of the one or more cooling doors is movable between a first position where the cooling door extends across the back of at least one partition so that air from the interior of the at least one partition flows through the cooling door, and a second position where air from outside the equipment enclosure flows through the cooling door. Fans are used in the middle section of rack or between two enclosures for assisting airflow management. Dedicated space for the fans are designed on the rack.

A cooling system for a plurality of heat-generating components in a chassis of an information handling system includes an array of fans, each fan operable to generate an airflow in a range of airflows, and a control system configured to monitor temperatures for the components and adjust a direction of one or more airflows based on the component temperatures. If a component temperature gets too high for a first fan associated with the component to cool the component, a portion of a second airflow generated by a second fan may be directed to provide additional airflow to the component such that the component is cooled without increasing the fan speed of the first fan. Adjacent fan speeds may also be adjusted to reduce losses due to differences between adjacent airflows.

In one embodiment, a method includes initiating a protection mode at a network device having a protective cover installed to filter airflow entering a network device, reducing one or more of a fan speed, processing functions, or power at the network device, exiting the protection mode upon removal of the protective cover from the network device, and increasing one or more of the fan speed, the processing functions, or the power to resume normal operation at the network device.

An impingement cooling device including a distributor plate, a manifold, and a heat spreader. The distributor plate includes a first side, a second side opposite the first side, a plurality of injection ports extending through the distributor plate from the first side to the second side, and a plurality of extraction ports extending through the distributor plate from the first side to the second side. The manifold is coupled to the distributor plate and includes a partition wall separating the plurality of injection ports and the plurality of extraction ports on the first side. The heat spreader at least partially covers an object to be cooled and includes a top surface configured to oppose the second side of the distributor plate. The heat spreader further includes a surface feature on the top surface configured to increase heat transfer therefrom.

A micro control unit (“MCU”) controls operation of a cooling fan in a compute device. The MCU is responsive to determining that a fan speed of the cooling fan is above a predetermined speed threshold to periodically determine power consumption of the cooling fan. In response to a periodic determination of power consumption exceeding a predetermined power consumption limit, the MCU reduces the fan speed of the cooling fan by a predetermined increment and continues periodically determine power consumption of the cooling fan. Upon determining that the power consumption does not exceed the predetermined power consumption limit, the MCU discontinues any prior reduction of the fan speed.

A cooling assembly for a data center rack includes: a chassis; a heat exchanger connected to the chassis, the heat exchanger being disposed vertically at least in part between upper and lower ends of the chassis, and at least one lower bracket connected to a lower end portion of the chassis. The heat exchanger includes: a cooling coil for circulating a cooling fluid therethrough; and a plurality of fins connected to the cooling coil, the fins being spaced from one another to allow air flow therebetween. Each of the at least one lower bracket is a single piece of sheet metal bent into shape and includes a supporting wall extending frontward from the lower end portion of the chassis, the supporting wall being configured to receive at least in part a lower end of the data center rack thereon.

A rack assembly for a data center includes: a rack frame housing at least one heat-generating component; a heat exchanger defining a first internal fluid conduit; at least one liquid cooling block connected to the at least one heat-generating component, each of the at least one liquid cooling block defining a second internal fluid conduit, the second internal fluid conduit being in thermal connection with the first internal fluid conduit; a cooling loop independent from any sources of cooling fluid external to the rack assembly and comprising the first and second internal fluid conduits, the cooling loop transferring heat from the second internal fluid conduit to the first internal fluid conduit; and a fluid compensation system comprising a reservoir fluidly connected to the cooling loop and an actuating device to force cooling fluid from the reservoir to the cooling loop to compensate for loss of cooling fluid in the cooling loop.

A method for controlling a cooling system of a rack, the rack comprising a heat generating component. The method comprises receiving, by a controller, at least one first temperature indications indicative of temperature variations of at least one heat transfer fluid circulating in at least one respective liquid channel of the cooling system; receiving, by the controller, at least one second temperature indications indicative of a temperature of an air flow of ambient air within the rack, the air flow being generated by at least one fan of the cooling system; and adjusting, based on the at least one first and second temperature indications, a rotational speed of the at least one fan and a rotational speed of at least one pump configured for causing the at least one heat transfer fluid to flow in at least one respective liquid channel.