A computing system includes a chassis, a circuit board including at least one electronic component, a mounting bracket secured to the chassis, a support bracket pivotably coupled to the mounting bracket, and a cold plate coupled to the support bracket. The support bracket is pivotable between a first configuration and a second configuration. The cold plate is in contact with the at least one electronic component in the first configuration, and the cold plate is removed from contact with the at least one electronic component in the second configuration.

A cold plate for cooling a heat-generating component in a computer system is disclosed. The cold plate includes a lid member with a lower supply manifold housing and a lower collection manifold housing. The cold plate includes a base member having coolant channels defined by fins. Each of the fins have a top section and a bottom section attached to the base member. An interior cavity is defined by an arc-shaped section of the fins, the interior surface of the base, and the lower supply manifold housing. An interior corner is formed by the lower supply manifold housing of the lower manifold housing at the top of the fins to trap debris. An upper inlet manifold has a connector to receive coolant. An upper outlet manifold has a connector to circulate coolant. The upper manifolds are in fluid communication with the collection manifold housings.

An electronic apparatus cooling device is provided with a water-cooling cold plate unit that is disposed in contact with a heat-generating element and that cools the heat-generating element directly by means of a liquid refrigerant that circulates in an inner flow path; an air-cooling fin disposed adjacent or in proximity to the water-cooling cold plate unit and having a fin tube through which the liquid refrigerant is circulated; and a refrigerant supply means that supplies the liquid refrigerant to the inner flow path of the water-cooling cold plate unit and to the fin tube in the air-cooling fin in a distributed manner.

A hot-swappable pump unit (HSPU) and a coolant distribution unit (CDU) using the same are disclosed. The HSPU is connected to a loop inlet element, a loop outlet element and a fixed component of CDU along a matching direction. The HSPU includes a housing, a pump, a pump inlet element, a pump outlet element and a fastening component. The pump inlet element is in communication with the pump by passing through a first lateral wall of the housing. The pump outlet element is in communication with the pump by passing through the first lateral wall. The fastening component is arranged on the housing and configured to engage with the fixed component, to drive the hosing to move along the matching direction. Whereby, the pump inlet element and the loop outlet element are matched and connected, and the pump outlet element and the loop inlet element are matched and connected.

Methods, systems, and devices for designing and implementing power and cooling fluid in a computing environment such as an electronics rack are disclosed. The disclosed methods and systems may provide for a high degree of power distribution and cooling fluid distribution reliability. To provide for a high degree of reliability, the system may include a number of protective features that may reduce the likelihood of connectors used for power and cooling fluid distribution from being damaged. The system may also provide for segregation of power distribution components from cooling fluid distribution components. The rack configurations include codesign of the server and rack to form the physical segregation. The segregation may reduce the chance of these components impacting the operation of other components.

A system for immersion cooling electronic components includes a cylindrical container having a circular cross section, a cooling element disposed in the cylindrical container and containing a first cooling fluid, and a volume of a second cooling fluid disposed in the cylindrical container and in contact with the cooling element for exchange of heat between the second cooling fluid and the first cooling fluid, the second cooling fluid comprising an immersion cooling fluid. A heat generating electronic component is disposed within the cylindrical container and at least partially immersed in the second cooling fluid for exchange of heat between the electronic component and the second cooling fluid, and a fluid circulating device is disposed in the second cooling fluid to direct a flow of the second cooling fluid through the electronic component and over the cooling element.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, flow controllers are associated with cold plates and have direct and bypass ports, so that when direct ports are disabled for removal of a first cold plate, bypass ports are enabled to bypass a first cold plate and to enable a second cold plate to be continuously cooled by a datacenter cooling system.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a sensor string is associated with a first fluid line having a first flow controller and with a second fluid line having a second flow controller, so that sections of such a sensor string are enabled to maintain electrical connectivity there through by a mechanical coupling of a first flow controller and a second flow controller.

A server liquid cooling fluid cutoff system including a server connector module, a leaking sensor, and an electromagnet device is proposed in the current application. In one embodiment, a server connector module is to be mounted on a server chassis, and the server connector module has at least a pair of server blind mating connectors capable of being engaged with or disengaged from at least a pair of rack blind mating connectors of a rack manifold of the electronic rack coupled to an external cooling fluid source. In an embodiment, a leaking sensor is configured to detect leakage of the cooling fluid within the server chassis. In an embodiment, an electromagnet device is coupled to the server connector module and the leaking sensor. In an embodiment, an elastic structure is coupled to the connector module for pushing the connector away.

A cooling plate module includes a first cooling plate layer having a single phase area within and a second cooling plate layer having a phase change area within. The first cooling plate layer includes a first liquid inlet port to receive a first cooling liquid into the single phase area and a first liquid outlet port to expel the first cooling liquid from the single phase area. The second cooling plate layer includes a second liquid inlet port to receive a second cooling liquid into the phase change and a vapor outlet port to expel the second cooling liquid in a vapor state from the phase change area, where the first cooling plate layer is in thermal contact with the second cooling plate layer, and the first cooling plate layer is in thermal contact with IT components to be cooled.