An adapter plate and a fastening system for fastening a manifold to a rack in a datacenter is disclosed. The adapter plate is associated with the manifold and has holes to receive buttons in configurable positions. The configurable positions enable the buttons to mate with keyholes of a bracket of the rack in order to fasten the manifold to the bracket.

Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Fluid replacement structures used in immersion cooling tanks can include various enhancements to make them functional beyond simply taking up space. For example, the density of fluid replacement structures can be variable to assist with buoyancy control. As another example, fluid replacement structures can be designed to enable vaporized working fluid to be directed to a desired location. As another example, fluid replacement structures can include emergency cooling features, such as different substances that cause an endothermic reaction to occur when they are mixed together. The substances can be separated by a membrane that melts when the temperature reaches a certain point. As another example, a fluid replacement structure can provide structural support for an immersion cooling tank when negative pressure operations are performed. Fluid replacement structures can also include alignment features, lifting features, locking features, mating guides, fiducial markers, or the like.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a plurality of in-rack coolant distribution units (IRCDUs) include a first IRCDU and a second IRCDU that are interchangeable within a rack depending on a type of coolant to be provided to a rack from a coolant distribution unit (CDU), so that a first IRCDU that is calibrated to a first coolant can distribute a first coolant and a second IRCDU that is calibrated to a second coolant can distribute a second coolant to a rack manifold of a rack.

In one embodiment, an immersion cooling system includes a container to contain first coolant received from a first cooling source and server chassis at least partially submerged into the first coolant. Each server chassis includes an electronic device and a cooling plate attached thereon to extract at least a portion of heat generated by the electronic device. The cooling plate includes an inlet port to receive second coolant from a second cooling source, a coolant channel to distribute the second coolant, and an outlet port to return the second coolant back to the second cooling source. The cooling system further includes a return manifold to be coupled to the second cooling source, the return manifold having one or more manifold return connectors respectively coupled with the server chassis and to receive and return the second coolant from the server chassis back to the second cooling source.

An immersion cooling system includes an electronic component, a thermally conductive dielectric liquid, and a tank defining a tank interior configured to receive the electronic component and the thermally conductive dielectric liquid for cooling the electronic component. The immersion cooling system also includes a wall positioned external to the tank to coordinate with the tank to define an overflow gap extending between the tank and the wall. The overflow gap is configured to receive an overflow of the thermally conductive dielectric liquid from the tank interior.

Embodiments are disclosed of a cooling apparatus with one or more cold plates, each adapted to be thermally coupled to a heat-generating electronic component on a piece of IT equipment. A fluid control module is mounted to the substrate and fluidly coupled to the cold plates. The fluid control module includes a fluid inlet with an inlet mechanism adapted to enable and disable the fluid inlet; the inlet mechanism enables the fluid inlet when energized and disables the fluid inlet when de-energized. The fluid control module also includes a fluid outlet with an outlet mechanism adapted to enable and disable the fluid outlet; the outlet mechanism enables the fluid outlet when energized and disables the fluid outlet when de-energized. A dedicated power supply is electrically coupled to the inlet mechanism and the outlet mechanism, and when the inlet mechanism is de-energized, the outlet mechanism is also de-energized after a delay.

A coupling member for a blind mate fluid coupling includes a housing and a fluid connector fixed in position relative to the housing for connecting to a fluid conduit of the system. A valve body extends through the housing and is movable relative to the housing. The valve body includes an internal fluid passage that is fluidly connected to the connector, and a valve member opens or closes the internal fluid passage. A carrier is at least partially disposed in the housing and is radially movable relative to the housing. The carrier is configured to cooperate with the valve body to facilitate alignment of the valve body when coupling to another coupling member. The carrier may form a portion of the fluid passage between the connector and valve body, and includes a sealing arrangement that permits radial and/or angular misalignment compensation of the design. Varying diameters of the insertion part or receiving part of the coupling member may be provided for further enhancing misalignment compensation of the design.

Systems and methods for operating a datacenter are disclosed. In at least one embodiment, hybrid cooling unit is disclosed wherein an evaporative cooler is to provide a source of cooled air and a liquid heat exchanger is to provide a source of cooled liquid for cooling one or more electronic components, the hybrid cooling unit further including an air inlet to direct a flow of external air to remove heat from the evaporative cooler and the liquid heat exchanger.

An electronic rack cooling system is disclosed that includes both a two-phase cooling system having a first cooling loop and a single-phase system comprising a second cooling loop. A main coolant source, such as a facility cooling fluid is coupled to a condenser unit of the two-phase cooling system. A branch off of the facility cooling fluid is directed to the single-phase cooling loop. The coolant flow to the single-phase cooling loop is controlled by a flow control value and a coolant pump. The facility cooling fluid is managed between the single-phase loop and phase change loop. A rack management unit in the electronic rack controls facility cooling fluid flow rate using the flow control device and pump.