A cooling system includes a cooling device having a first cooling coil and a second cooling coil, a first heat transfer fluid in fluid communication with the first cooling coil, a second heat transfer fluid in fluid communication with the second cooling coil, a first heat exchanger in fluid communication with the first heat transfer fluid and the second heat transfer fluid, a second heat exchanger in fluid communication with the second heat transfer fluid and a source of external air, a system of fluid control devices in fluid communication with the second heat transfer fluid and configured to minimize a change in a total pressure drop of the second heat transfer fluid when the cooling system switches between operating modes, and a controller configured to selectively control the cooling device and the system of fluid control devices to operate the cooling system in each of the operating modes.

A cooling system includes a first circulation pipeline unit and a second circulation pipeline unit that are configured to circulate a cooling medium. The first circulation pipeline unit includes a first water supply pipe group and a first water return pipe group that are connected to each other. The second circulation pipeline unit includes a second water supply pipe group and a second water return pipe group that are connected to each other. A first end of the first water supply pipe group and a first end of the first water return pipe group each are provided with a first expansion interface.

An system and method for cooling of electronic equipment, for example a computer system, in a subsurface environment including a containment vessel in at least partial contact with subsurface liquid or solid material. The containment vessel may be disposed in a variety of subsurface environments, including boreholes, man-made excavations, subterranean caves, as well as ponds, lakes, reservoirs, oceans, or other bodies of water. The containment vessel may be installed with a subsurface configuration allowing for human access for maintenance and modification. Cooling is achieved by one or more fluids circulating inside and/or outside the containment vessel, with a variety of configurations of electronic devices disposed within the containment vessel. The circulating fluid(s) may be cooled in place by thermal conduction or by active transfer of the fluid(s) out of the containment vessel to an external heat exchange mechanism, then back into the containment vessel.

Cooling arrangement and method for cooling of a heat source. The cooling arrangement comprises a closed loop, a semi-open loop and at least one fan. The closed loop comprises a primary side of a liquid-to-liquid heat exchanger receiving a first cooling fluid heated by the heat source, a first air-to-liquid heat exchanger downstream said primary side, and a first pump returning the first cooling fluid to the heat source. The semi-open loop comprises a tank storing a second cooling fluid, a second pump drawing the second cooling fluid from the tank, a secondary side of the liquid-to-liquid heat exchanger receiving the second cooling fluid from the second pump, an evaporating pad downstream said secondary side, and an inlet fluidly connected to a source of the second cooling fluid. The at least one fan causes an air flow through the evaporating pad and through the first air-to-liquid heat exchanger.

An electronic device configured to be connected to external heat dissipation device and including chassis, heat source and heat dissipation assembly. The heat source is disposed in the chassis. The heat dissipation assembly includes evaporator, condenser and fin assembly. The evaporator is in thermal contact with the heat source. The condenser has outer surface, condensation space and liquid-cooling space. The outer surface faces away from the condensation space and the liquid-cooling space. The condensation space and the liquid-cooling space are not in fluid communication with each other. The condensation space is in fluid communication with the evaporator. The liquid-cooling space is configured to be in fluid communication with the external heat dissipation device. The fin assembly is in thermal contact with the condenser and protrudes from the outer surface of the condenser along direction away from the condensation space or the liquid-cooling space.

An environmental control system is provided. The environmental control system can include a heat absorption device and a heat rejection device positioned in containment areas and a reservoir. The containment areas can contain leaks that may occur in the environmental control system and direct the fluid into the reservoir. The reservoir can include an opening that can allow the environmental control system to operate as a low pressure system.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a hybrid coolant distribution unit (HCDU) provides first stage cooling of secondary coolant returning from at least one cold plate in a liquid to air heat exchanger (L2AHE) and provides second stage cooling in a liquid to liquid heat exchanger (L2LHE) for secondary coolant exiting an L2AHE using varying flow rates of a primary coolant based in part on a residual temperature that is determined for such secondary coolant exiting an L2AHE.

A system includes one or more modular hot aisle cooling units (MHACUs) disposed in a data hall, each MHACU configured to cool one or more servers in the data hall. The system also includes a fluid cooler configured to receive the heated fluid from the one or more MHACUs, cool the heated fluid into cooled fluid, and output the cooled fluid. The system also includes a fluid supply line configured to convey the cooled fluid to the one or more MHACUs in order to cool heated air inside the data hall. The system also includes a pump package configured to control a flow of the heated fluid and the cooled fluid. The fluid cooler, the one or more MHACUs, and the pump package form a single fluid loop.

Systems, methods and non-transitory computer-readable mediums are provided for determining data center resource requirements, such as cooling and power requirements, and for monitoring performance of data center resource systems, such as cooling and power systems, in data centers. At least one aspect provides a system and method that enables a data center operator to determine available data center resources, such as power and cooling, at specific areas and enclosures in a data center to assist in locating new equipment in the data center.

Systems and methods for evaluating cooling characteristics are disclosed. In at least one embodiment, a thermal testing rig for a data center can include one or more pluggable heat-generating elements to direct a heat flux in an upward direction towards one or more thermal distribution elements.