Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow server fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves utilizing a raised sub-floor design of a data center room.

A cooling arrangement for autonomous cooling of a rack hosting components and fans comprises a closed loop and an open loop. Liquid cooling is used in the closed loop to transfer heat from heat-generating units of the components to a primary side of a liquid-to-liquid heat exchanger. An air-to-liquid cooling unit is used in the open loop to absorb heat expelled from the rack by the fans. A liquid from a cold supply line is first heated to some degree in the air-to-liquid cooling unit before reaching a secondary side of the liquid-to-liquid heat exchanger. The primary side being hotter than the secondary side, heat is transferred from the primary side to the secondary side of the liquid-to-liquid heat exchanger. The liquid is expelled at a higher temperature from the secondary side to a hot return line.

An electronic rack includes an array of server blades arranged in a stack. Each server blade contains one or more servers and each server includes one or more processors to provide data processing services. The electronic rack further includes a coolant distribution unit (CDU) and a rack management unit (RMU). The CDU is configured to supply cooling liquid to the processors and to receive the cooling liquid carrying the heat exchanged from the processors. The CDU includes a liquid pump to pump the cooling liquid and a pump controller to control a pump speed of the liquid pump. The RMU is configured to manage the operations of the components within the electronic rack such as CDU, etc. The RMU includes control logic to determine an optimal pump speed of the liquid pump by optimizing an objective function based on processor power consumption of the processors, cooling power consumption of the CDU, and a benchmark performance measurement of the data processing services and to control the pump speed of the liquid pump based on the optimal pump speed.

Systems and methods for controlling conditions in an enclosed space, such as a data center, or for providing cooling to a device, can include using a Liquid-to-Air Membrane Energy Exchanger (LAMEE) as an evaporative cooler. The LAMEE or exchanger can cool water to the outdoor air wet bulb temperature in a cooling system disposed outside of the enclosed space or device. The reduced-temperature water can be delivered to the enclosed space or device or can cool a coolant that is delivered to the enclosed space or device. The air in the enclosed space, or one or more components in the enclosed space, can be cooled by delivering the reduced-temperature water or coolant to the enclosed space, rather than moving the supply air from the enclosed space to the cooling system. In an example, the cooling system can include one or more cooling coils, upstream or downstream of the LAMEE.

Embodiments are disclosed of an apparatus including a room manifold comprising at least one fluid loop. A plurality of rack manifolds is fluidly coupled to, and projects from, the room manifold. Each rack manifold includes one or more connectors to couple the rack manifold to one or more components within an electronics rack. A plurality of valves is fluidly coupled in the room manifold, and each rack manifold is fluidly coupled to the room manifold between a pair of valves. The pair of valves can be used to terminate flow between the room manifold and each rack manifold.

Disclosed are row cooling units and connecting units with a network of integrated fluid distribution piping that may be interconnected to construct a liquid cooling system to carry way heat generated by servers housed within the server racks used in data centers. The assembly of row cooling units and connecting units may be connected to the supply and return loops of the data center facility to distribute cooling liquid to the electronic components of the servers and to return heated liquid for heat removal. The network of fluid distribution piping integrated into the row cooling units and connecting units enables the configuration of the liquid cooling system to be independent of the fixed infrastructure of the facility, affording ease of scalability, serviceability, maintenance, while increasing efficiency, resiliency, availability and reliability of the liquid cooling system critical to the operation and performance of the data center.

A cooling and heating energy saving system includes a cooling and heating device, a data center, a boiler, a heat exchanger, and a circulating pump. The boiler receives waste heat of the data center and heat generated by the cooling and heating device, and then generates high-temperature heat and transfers the high-temperature heat to an indoor heating device. The heat exchanger receives heat from the cooling and heating device and the data center. The circulating pump receives the heat generated by the data center and transmits the heat to an outdoor cold source, and further transmits the outdoor cold source to an indoor device through the heat exchanger.

A cooling system configured to remove heat from a chimney of a server cabinet. The system includes a first heat exchanger unit in the chimney of the server cabinet. The first heat exchanger has a fluid inlet for receiving a working fluid and a fluid outlet for discharging the working fluid. The first heat exchanger also has an upstream surface receiving waste heat generated by one or more servers and a downstream surface that discharges air cooled by the first heat exchanger. The upstream surface is generally perpendicular to the downstream surface.

Embodiments are disclosed of a cooling system for use in a data center. The cooling system includes an IT region, a ceiling region, and a cooling air plenum sandwiched between the IT region and the ceiling region. The IT region includes one or more IT plenums that are coupled to the cooling air plenum to supply cooling air to the IT region, which can have house a plurality of IT racks that are clustered around the IT plenums and are adapted to house one or more pieces of liquid-cooled or hybrid-cooled information technology (IT) equipment. The ceiling region includes one or more ceiling plenums and one or more sets of heat exchangers, each heat exchanger being cooled by the cooling air delivered to the ceiling plenums. The cooling air plenum is fluidly coupled by a flow control to the one or more IT plenums and is fluidly coupled by a flow control to the one or more ceiling plenums or to the volume of the ceiling region between ceiling plenums.

A cooling system for an electronic rack of a data center, such as an IT rack or PoD, is disclosed. The system includes a coolant distribution unit (CDU) coupled to a rack manifold of the electronic rack through a fluid cooling loop. The CDU supplies cooling fluid that is distributed to the IT rack or PoD, and receives returning warm/hot fluid from the IT rack or PoD. The system further includes an enhancing cooling unit to receive a first part of a first distributed portion of the cooling fluid and to further cool the first part of the first distributed portion of the cooling fluid to a lower temperature value than the one of the supplied cooling fluid through an enhancing cooling loop. The system further includes a first external cooling unit connected to the CDU through a cooling fluid loop to supply the cooling fluid to the CDU. The system further includes an air cooling unit to receive a second distributed portion of the cooling fluid and to use the second distributed portion of the cooling fluid to cool the airflow for IT rack or PoD. The system is arranged in five portions, and fluids and cooling units are shared among the portions within distributing loops.