A heat dissipating device includes a thermosyphon, a first liquid cooling tube and a first heat dissipating fin set. The thermosyphon has an evaporation portion and a condensation portion. The first liquid cooling tube is sleeved on the condensation portion. The first heat dissipating fin set is sleeved on the first liquid cooling tube.

A multi-channel cold plate for cooling chip wherein a first set of cooling channels function as main cooling channels and a second set of cooling channels function as a secondary and/or backup cooling channels. The two sets of cooling channels are fluidly isolated from each other, such that cooling fluid from one sent of channels cannot flow or intermix with the cooling fluid of the other cooling channel. The secondary cooling channels can be operated when demand for heat removal is increased or when the main cooling channels is unable to manage the thermal condition of the chip properly.

Systems and methods for cooling an electronic device via interface of a heat-transfer conduit of the electronic device to a cold plate assembly are disclosed. According to an aspect, a system includes an electronic device including one or more electronic components. Further, the electronic device includes a heat-transfer conduit including a first end and a second end. The first end of the heat-transfer conduit is positioned to receive heat from the electronic component(s). The heat-transfer conduit is configured to conduct heat from the first end to the second end. Further, the system includes a cold plate assembly including a cold plate and a mechanism configured to permit movement of the cold plate. At the first position, the cold plate may contact the second end for receipt of heat from the heat-transfer conduit at the second end. At the second position, the cold plate is apart from the second end.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a refrigerant distribution unit (RDU) distributes first refrigerant from a refrigerant reservoir to one or more cold plates to extract heat from at least one computing device and also interfaces between a first refrigerant cooling loop having a first refrigerant and a second refrigerant cooling loop, so that a second refrigerant cooling loop uses second refrigerant to dissipate at least part of such heat through a second condenser unit to an ambient environment.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a refrigerant-to-refrigerant heat exchanger (R2RHX) interfaces between a first refrigerant cooling loop and a second refrigerant cooling loop to enable transfer of heat from a cold plate of a first refrigerant cooling loop to a second refrigerant cooling loop using a first condenser unit, and so that a second refrigerant cooling loop enables dissipation of heat to an ambient environment from a second condenser unit.

A cooling plate module includes a first cooling plate layer having a single phase area within and a second cooling plate layer having a phase change area within. The first cooling plate layer includes a first liquid inlet port to receive a first cooling liquid into the single phase area and a first liquid outlet port to expel the first cooling liquid from the single phase area. The second cooling plate layer includes a second liquid inlet port to receive a second cooling liquid into the phase change and a vapor outlet port to expel the second cooling liquid in a vapor state from the phase change area, where the first cooling plate layer is in thermal contact with the second cooling plate layer, and the first cooling plate layer is in thermal contact with IT components to be cooled.

An electronic apparatus including at least one heat generating component and an immersion cooling system is provided. The immersion cooling system includes a box body and a condensation module. The box body is adapted to accommodate a coolant, and the heat generating component is disposed in the box body to be immersed in the coolant in a liquid state. The condensation module includes a pipeline and a condensate, and the pipeline passes through the box body and is adapted for the condensate to flow. At least one parameter of the condensate may be changed to lower a boiling point of the coolant to a predetermined value by lowering the temperature in the box body with the condensate. In addition, an operating method of the electronic apparatus is also provided.

An immersion cooling system including a rack and at least one immersion cooling module is provided. The immersion cooling module includes a chassis and a condensation pipeline. The chassis is slidably disposed on the rack and is adapted to accommodate a coolant. At least one heat generating component is adapted to be disposed in the chassis to be immersed in the liquid coolant. The condensation pipeline is disposed in the chassis and is located above the liquid coolant. In addition, an electronic apparatus having the immersion cooling system is also provided.

Thermal management for modular electronic devices is provided. In one embodiment, a modular electronic device comprises: a primary electronics assembly comprising a least one module bay configured to receive a pluggable electronics module, wherein the pluggable electronics module comprises at least one heat conduction riser that protrudes from the pluggable electronics module; a heat management mechanism coupled to the primary electronics assembly, wherein the heat management mechanism includes at least one floating heat sink thermally coupled to the heat conduction riser of the pluggable electronic module by a heat pipe that defines a direct thermal conductive heat path between the pluggable electronics module and the floating heat sink. The heat pipe is mounted to the primary electronics assembly by a spring loaded floating heat pipe interface that applies a clamping force against the heat pipe, and maintains contact between the interface and the heat conduction riser.

A system and method for cooling an electronic datacenter component using a two-phase thermal management system with dynamic thermoelectric regulation. The system includes a thermoelectric cooler to transfer heat to a hot conduit of the thermal management system and initialize or maintain a natural convective flow of working fluid by maintaining a temperature difference between a hot and cold conduit.