An immersion cooling system including a rack and at least one immersion cooling module is provided. The immersion cooling module includes a chassis and a condensation pipeline. The chassis is slidably disposed on the rack and is adapted to accommodate a coolant. At least one heat generating component is adapted to be disposed in the chassis to be immersed in the liquid coolant. The condensation pipeline is disposed in the chassis and is located above the liquid coolant. In addition, an electronic apparatus having the immersion cooling system is also provided.

A system and method for controlling a cooling system for an electronic datacenter component using a two-phase thermal management system with dynamic thermoelectric regulation. The system includes a thermoelectric cooler to transfer heat to a hot conduit of the thermal management system and initialize or maintain a natural convective flow of working fluid by maintaining a temperature difference between a hot and cold conduit.

A vapor chamber includes a main body, a first vertical structure, and an enhanced boiling surface. The main body has a first surface and defines a first portion of an interior volume. The first vertical structure protrudes transverse to the main body and defines a second portion of the interior volume. The enhanced boiling surface is on at least a portion of the first vertical structure.

A processing unit. The processing unit includes a printed circuit board (PCB) including a lidless integrated circuit, a heatsink, and a damper system. The heatsink is coupled to the PCB and in thermal communication with the lidless integrated circuit via a thermal interface material. The damper system is compressed between the PCB and the heatsink and surrounding the lidless integrated circuit to absorb a portion of kinetic energy imparted to the lidless integrated circuit by an impact to the processing unit.

Examples of the disclosure relate to a cooling system for cooling one or more electronic components. The cooling system comprises at least one two-phase cooling system configured to cool one or more electronic components that are thermally coupled to the at least one two-phase cooling system and at least one air-cooling system configured to cool one or more electronic components. The at least one air-cooling system comprises at least one heat exchanger within the at least one air-cooling system wherein the at least one heat exchanger is coupled to a two-phase cooling system or a liquid phase cooling system. The at least one air-cooling system also comprises recirculation means configured to re-circulate air through the at least one air-cooling system to the one or more electronic components.

An immersion cooling system includes an immersion tank and one or more information technology (IT) equipment, the IT equipment is configured to provide IT services and is at least partially submerged within a first phase change liquid within the immersion tank, where, when the IT equipment provides the IT services, the IT equipment generates heat that is transferred to the first phase change liquid thereby causing at least some of the first phase change liquid to turn into vapor phase. The cooling system includes a condenser unit having a second phase change liquid circulating at the condenser unit. The condenser unit includes a vacuum port, a sealing valve at the vacuum port. The cooling system includes a heat exchange core, coupling within the immersion tank connecting with the condenser unit to carry heat from the first phase change liquid to the second phase change liquid.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate includes an evaporator to remove heat from at least one computing device using a two-phase fluid and using a buffer to perform flow stabilization represented by different volumes or different flow rates of a two-phase fluid that is enabled to flow between an evaporator and a condensing or compressor unit located external to a cold plate.

A multiple phase cooling system is described for an electronic rack, a cluster of servers, and for a data centers. An inlet of a 3-way flow control valve (FCV) is coupled to a main coolant source. A first outlet of the FCV is coupled to a single-phase cooling system and a second outlet of the FCV is coupled to a two-phase cooling system. The FCV is configured to adjust an amount of coolant between the single-phase cooling system and the two-phase cooling system. Upon detecting a rise in vapor pressure in a return line of the two-phase cooling system, the FCV can be adjusted to direct more coolant to the two-phase cooling system and less coolant to the single-phase system. The FCV can continuously monitor the vapor pressure and adjust the amount of coolant to each cooling system accordingly.

An electronic device configured to be connected to external heat dissipation device and including chassis, heat source and heat dissipation assembly. The heat source is disposed on the chassis. The heat dissipation assembly includes evaporator and condenser. The evaporator is in thermal contact with the heat source. The condenser is disposed on the chassis and comprises first thermally conductive plate, second thermally conductive plate and third thermally conductive plate that are stacked on one another. A condensation space is formed between the first thermally conductive plate and the second thermally conductive plate. A first liquid-cooling space is formed between the second thermally conductive plate and the third thermally conductive plate. The condensation space is in fluid communication with the evaporator. The first liquid-cooling space is not in fluid communication with the condensation space and is configured to be in fluid communication with the external heat dissipation device.

A thermosiphon includes a condenser; an evaporator that includes a fluid channel and a heat transfer surface, the heat transfer surface defining a plurality of fluid pathways in the fluid channel that extend through the fluid channel, the evaporator configured to thermally couple to one or more heat-generating electronic devices; and a transport member that fluidly couples the condenser and the evaporator, the transport member including a liquid conduit that extends through the transport member to deliver a liquid phase of a working fluid into the fluid pathways, the transport member further including a surface to vertically enclose the plurality of fluid pathways.