A device and method including a boiling chamber in which boiling occurs in a pool of liquid and condensation occurs in the same chamber to remove the heat from the condensation process of the bubbles generated during the boiling process mainly through submerged condensation are disclosed.

A rack cooling system includes a primary cooling condenser and a secondary cooling condenser. The primary cooling condenser is positioned above servers of a server rack and the secondary cooling condenser is position above the primary cooling condenser. Each of the severs, the primary cooling condenser, and the secondary cooling condenser is connected to a liquid manifold via one of a plurality of liquid ports on the liquid manifold, and to the vapor manifold via one of a plurality of vapor ports on the vapor manifold. A cooling capacity of the rack cooling system can be extended by switching on a vapor flow between the secondary cooling condenser and the primary cooling condenser using a first valve on the vapor manifold. Further, a second valve on a primary cooling loop can be used to control cooling fluid flowing into the secondary cooling condenser after the first valve is trigged open.

The discussion relates to disaggregated computing. One example can monitor multiple two-phase liquid immersion tanks. Individual two-phase liquid immersion tanks can contain multiple components of a single type of component type. The example can receive requests for virtual machines and allocate sets of components from individual two-phase liquid immersion tanks to work together to support the virtual machines requests.

An immersion cooling system includes an immersion tank, a first fluid reservoir, a second fluid reservoir, and a mixing device. The first fluid reservoir contains a first working fluid having a first boiling temperature. The second fluid reservoir contains a second working fluid having a second boiling temperature. The mixing device mixes at least a portion of the first working fluid and at least a portion of the second working fluid into a mixed working fluid, and the mixing device directs the mixed working fluid to the immersion tank.

Embodiments are disclosed of a cooling device. The cooling device includes a housing enclosing an internal volume, the housing having at least a heat transfer contact surface adapted to be thermally coupled to a heat-generating electronic component. A partition is positioned in the internal volume; the partition divides the internal volume into a liquid compartment and a vapor compartment, and the partition has a gap therein to allow fluid movement between the liquid compartment and the vapor compartment. A liquid inlet is fluidly coupled to the liquid compartment; a liquid outlet is fluidly coupled to the vapor compartment; and a vapor outlet is fluidly coupled to with the vapor compartment. Embodiments of cooling systems including design and operation using the cooling device are also disclosed.

Devices, systems, and methods are disclosed for cooling using both air and/or liquid cooling sub circuits. A vapor compression cooling system having both an air and liquid cooling sub circuit designed to service high sensible process heat loads that cannot be solely cooled by either liquid or air is provided.

A flexible two-phase cooling apparatus for cooling microprocessors in servers can include a primary cooling loop, a first bypass, and a second bypass. The primary cooling loop can include a reservoir, a pump, an inlet manifold, an outlet manifold, and flexible cooling lines extending from the inlet manifold to the outlet manifold. The flexible cooling lines can be routable within server housings and can be fluidly connected to two or more series-connected heat sink modules that are mountable on microprocessors of the servers. The flexible cooling lines can be configured to transport low-pressure, two-phase dielectric coolant. The first bypass can include a first pressure regulator configured to regulate a first bypass flow of coolant through the first bypass. The second bypass can include a second pressure regulator configured to regulate a second bypass flow of coolant through the second bypass.

An electronic rack includes one or more servers, where each server is contained within a respective server container, and each server is at least partially submerged in two-phase liquid coolant, where, while the server generates heat that is transferred to the two phase liquid coolant thereby causing some of the two phase liquid coolant to turn into a vapor. The electronic rack includes a condenser container and condensing coils mounted at a top portion of the electronic rack to condense the vapor into the two-phase liquid coolant. The electronic rack includes a vapor manifold along a length of the electronic rack, the vapor manifold coupling the condenser container to a respective server, where the vapor manifold carries the vapor from the servers to the condensing coils. The electronic rack includes a first return line coupled to the condenser container, to return the two-phase liquid coolant to a coolant unit.

The present application discloses a machine cabinet. In one embodiment, the machine cabinet comprises a housing, and an inner chamber, a liquid working medium accommodating area, a heat exchanger and a delivery passage disposed in the housing, wherein the inner chamber is in a vacuum state and configured to accommodate electronic devices to be cooled; the liquid working medium accommodating area is configured to accommodate a liquid working medium, the liquid working medium is converted into a gas working medium to enter the heat exchanger after cooling the electronic devices to be cooled; the heat exchanger is configured to liquefy the gas working medium into a liquid working medium and guide the liquid working medium obtained by liquefying the gas working medium into the delivery passage; and the delivery passage is connected with the heat exchanger and the liquid working medium accommodating area and is configured to guide the liquid working medium obtained by liquefying the gas working medium into the liquid working medium accommodating area. The embodiment eliminates the influence of the humidity, cleanness and the like to the electronic devices due to the air circulation, and thus lengthens the service life of the electronic devices.

Systems and methods to provide a prefabricated module design for heterogeneous data centers are described. An apparatus to provide cooling for an electronic rack of a data center comprises a plurality of lines. A main chassis is coupled to the plurality of lines. The main chassis is configured to be integrated on the electronic rack. An extension chassis is coupled to the main chassis. The extension chassis is configured to move relative to the main chassis. A plurality of connection ports are coupled to the extension chassis to provide connections between the electronic rack and one or more external sources. The plurality of connection ports are configured to move relative to the plurality of lines that are at fixed locations on the electronic rack.