Provided are a rack mount server system, which has no damage to computation equipment even if a disorder occurs in a cooling device, which is easy to maintain, minimize power consumption, which has a simple structure, and which performs an efficient cooling, and a control method thereof. The system comprises: a rack housing; and a cooling zone which is placed in the rack housing, which stores a server, and which is forcibly cooled. The rack housing comprises a heat exchanger and an evaporator, which cool the cooling zone. The cooling methods of the cooling structure may be different in accordance with the internal temperature of the cooling zone and the external temperature of the cooling zone.

A method of apparatus for immersion cooling electronic equipment including immersing the electronic equipment in a pressure-sealed tank containing a heat transfer fluid and including a vapor space fluidicly coupled to a condenser; operating the electronic equipment to generate heat and evaporate some of the heat transfer fluid, causing heat transfer fluid vapor to enter the condenser; condensing the heat transfer fluid vapor in the condenser to produce a condensate; returning the condensate to the tank; and increasing power consumption to increase heat generated by the electronic equipment and develop an increased pressure of the heat transfer fluid vapor to bring the apparatus into an equilibrium condition.

An electronic device rack includes a plurality of panels surrounding a first space. Moreover, the electronic device rack includes: an electronic-device housing unit disposed in the first space and configured to house electronic devices; a heat exchanger disposed in the first space at a position away from the electronic-device housing unit; a second space provided between the electronic-device housing unit and the heat exchanger and isolated from the rest of the first space; and an air blower configured to circulate air inside the first space through the electronic-device housing unit, the second space, and the heat exchanger in the described order.

A space-saving, high-density modular data pod and a method of cooling a plurality of computer racks are disclosed. The modular data pod includes an enclosure including wall members contiguously joined to one another along at least one edge of each wall member in the shape of a polygon and a data pod covering member. Computer racks arranged within the enclosure form a first volume between the inner surface of the wall members and first sides of the computer racks. A second volume is formed of second sides of the computer racks. A computer rack covering member encloses the second volume and the data pod covering member form a third volume coupling the first volume to the second volume. An air circulator continuously circulates air through the first, second, and third volumes. The method includes circulating air between the first and second volumes via the third volume and the computer racks.

The present disclosure relates to a mobile data center unit, which is adapted to house at least one rack being designed to provide storage space for electronic equipment. The mobile data center unit is equipped with passive cooling means in order to provide dissipation of heat being generated by the electronic equipment.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a liquid-to-air heat exchanger is associated with a fan wall and a refrigerant-based cooling system to provide air cooling and refrigerant-based cooling to cool secondary coolant or fluid received from at least one cold plate.

A server rack cooling arrangement may include a server rack enclosure defining a single undivided interior volume of space and configured to be sealable; two or more open-frame-server-units disposed within the interior volume of space and arranged in a multi-level arrangement, wherein heat-producing-electronic-components may be exposed to environmental conditions of the interior volume of space; a central condenser disposed towards a rear; a coolant reservoir for collecting condensate from the central condenser; at least one nozzle in fluid communication with the coolant reservoir and configured to deliver fine coolant droplets into the interior volume of space for impingement on the heat-producing-electronic-components; and a fan configured to generate an airflow through the two or more open-frame-server-units from a front to the rear in a manner so as to carry coolant vapour generated from impingement of the fine coolant droplets on the heat-producing-electronic-components to the central condenser.

A chassis can include a sliding liquid distributor that has blind mate connectors. The blind mate connectors mate with an IT rack in one direction and one or more electronic devices in an opposite direction. The liquid distributor circulates fluid to-and-from the electronic devices from-and-to the IT rack. Other embodiments are described and claimed.

A thermal management system includes an immersion tank, a cooling fluid, and an air-cooled condenser. The immersion tank devices an immersion chamber, and the cooling fluid is at least partially located in the immersion chamber. The air-cooled condenser is in fluid communication with the immersion chamber to cool the cooling fluid.

A thermal management system for a computing device includes an immersion tank with a cooling fluid therein, a computing device positioned in the cooling fluid in the immersion tank, and a thermal block positioned in the cooling fluid in the immersion tank. The computing device heats the cooling fluid, and the thermal block is configured to receive heat from the cooling fluid. The thermal block includes a fluid management feature to direct flow of the cooling fluid relative to the thermal block and computing device.