Systems and methods for operating a datacenter are disclosed. In at least one embodiment, an apparatus comprises a controller to control a proportion of coolant provided by an air cooling unit and a liquid cooling unit based, at least in part, on temperature of one or more electronic components.

A cooling system including a vaporizer configured to absorb heat due to a liquid-phase refrigerant being vaporized, a condenser configured to discharge heat due to a refrigerant in a gaseous phase state being liquefied, a resistance body provided in a middle of a pipe passage ranging from the vaporizer to the condenser and applying a resistance to the refrigerant, state detection sensors provided in the pipe passage on an upstream and downstream sides of the resistance body and detecting a state of the refrigerant flowing through each side inside the pipe passage, and a flow rate controller configured to detect droplets in the refrigerant flowing through the pipe passage on the basis of a difference between detection values of the state detection sensors which are detected on the upstream and downstream sides of the resistance body, and controls a flow rate of the refrigerant on the basis of detection results.

Conditioning systems and methods for providing cooling to a heat load can include an evaporative cooler arranged in a scavenger plenum with a recovery coil downstream of the evaporative cooler. The conditioning systems can operate in various modes, including an adiabatic mode and an evaporative mode, depending on outdoor air conditions. The systems can operate in a blended mode between the adiabatic mode and the evaporative mode by varying the distribution of return water from the recovery coil into at least partially isolated sections of a storage tank, and selectively directing cold water from the evaporative cooler into the tank. The mix of warm and cold water exiting the tank can be varied to maintain the cold-water supply at or near a set point temperature for the heat load. In an example, the systems can include a pre-cooler in the plenum upstream of the evaporative cooler for pre-conditioning the scavenger air.

A heat-activated pump removes waste heat from electronic components, at a data center, circuit board, or chip level. A set of evaporators receive heat from the electronics, converting a working fluid into vapor. Piping from the evaporators to a shared condenser(s) and back form a fluid circulation system. A pressure-control valve set for a specified electronic operating temperature allows vaporized working fluid to vent into a liquid-piston chamber, where it expands adiabatically, displacing pumped liquid in a pumping stage and expelling it from the chamber through a unidirectional valve to the shared condenser(s). The condenser(s) has a heatsink transferring heat away to a flow of cooler fluid. The pumped liquid returns in a suction cycle to the chamber through another unidirectional valve. An injector valve returns jets of condensed working fluid to the evaporator in successive brief spurts responsive to periodic pressure pulses in the chamber.

This invention relates to systems and methods for redundant data center cooling and electrical systems.

In one embodiment, a cooling system comprises an information technology (IT) cluster layer with multiple immersion tanks, each immersion tanks including electronic components submerged in a two-phase liquid coolant; and a cooling capacity layer that includes a vapor subsystem, a liquid subsystem, and a condensing cooler. The system further includes a distribution layer that include vapor lines for transmitting vapor from each of the immersion tanks to the vapor subsystem, and liquid lines for distributing liquid from the liquid subsystem to each immersion tank in the IT cluster layer. The two subsystems operate independently to maintain proper fluid level in the immersion tanks efficiently.

As air inside a building (e.g., a data center or any building that generates heat) becomes heated, it rises and is received or captured by a heat containment and then expelled from the building. The hot air is not recycle, recirculated, or re-cooled. Hot air being expelled from the building creates a pressure differential in which the pressure at the hot side of the building (where the heat containment is located) is lower than the cool side of the building. To this end, a chilling unit is installed at an opening of a building to supply cooled air at a constant rate. The chilling unit does not have an internal controller. Rather, an air conditioning (AC) unit of the building acts as an external controller. The AC unit is be set to maintain a target temperature and only runs when the temperature inside the building is above the target temperature.

An apparatus for cooling a plurality of rack-mountable servers containing heat generating electronic components in a server room including a dielectric liquid cooling apparatus located inside the tank and a secondary cooling apparatus comprising a remote heat exchanger and at least one pump. The volume of dielectric liquid coolant comprises at least one passage in the tank that is outside of the vertically oriented rack-mountable servers. When the at least one pump is operated to move the dielectric liquid coolant vertically across the heat producing components on the vertically oriented servers, a circuit is formed in which a first portion of dielectric liquid coolant is moved vertically upward across the heat producing components on the vertically oriented servers and then downward outside of the rack mountable servers in the at least one passage, while a second portion of the dielectric liquid coolant flows out of the tank.

A cooling system can include an input channel from which a fluid enters the cooling system and an output channel from which the fluid exits the cooling system. The cooling system can include a vapor buffer and a liquid buffer, and the connections between the two buffers. Vapor buffer valves arranged in fluid channels of the cooling system can be controlled to, in a first mode, disconnect the vapor buffer from an input channel, and, in a second mode, connect the vapor buffer to the input channel and disconnect the vapor buffer from the input of the condenser or the port that is attachable to the input of the condenser.

The embodiments of the present application provide a cooling system for data center based on a hyperbola cooling tower. The cooling system includes a compressor, a condenser, a primary fluorine pump, a secondary fluorine pump, a throttling apparatus, an evaporator, and a server. The server is configured to receive data information uploaded from the compressor, the condenser, the primary fluorine pump, the secondary fluorine pump, the throttling apparatus, and the evaporator, calculates the operation frequency of the compressor based on the data information, and control the condenser, the primary fluorine pump, the secondary fluorine pump and the throttling apparatus to transport the refrigerant to the evaporator.