An airflow generator (10) having a first plate (12), a second plate (14) where the second plate (14) is spaced from the first plate (12) to define a cavity (28) there between, a joint (30) operably coupled to the first plate (12) and the second plate (14) and joining them together, piezoelectrics (34) located on each of the first plate (12) and the second plate (14) wherein actuation of the piezoelectrics (34) results in movement of the first plate (12) and the second plate (14) to increase the volume of the cavity (28) to draw air in (200) and then decrease the volume of the cavity (28) to push out the drawn in air (202).

An electrical controller includes a housing, wherein the housing has cooling air openings on two different housing sides. A heat sink is arranged inside the housing, in particular so as to be protected against contact, and forms a cooling air channel, wherein the cooling air channel runs between the cooling air openings of the different housing sides. An electrically insulating holding element is designed to mechanically fix the heat sink inside the housing in a manner electrically insulated from the housing. A number of components to be cooled are provided, wherein the components are thermally conductively coupled to the heat sink and are held by the heat sink.

A converter includes a housing having a first interior and a second interior. The first interior is arranged separately from the second interior. Part of the first interior protrudes into the second interior and forms a heat-exchanger duct. A gaseous heat flow circuit is established within the first interior and flows in through an inlet opening of the heat-exchanger duct and flows out through an outlet opening of the heat-exchanger duct. The second interior forms a cooling duct. A gaseous cooling flow flowing through the cooling duct is established and flows around the heat-exchanger duct. The cooling duct is arranged in a region of overlap with the heat-exchanger duct in such a way that a first flow direction of the gaseous heat flow circuit runs substantially perpendicularly or parallel to a second flow direction of the gaseous cooling flow.

A heat sink 7A is disposed on a circuit board, an air duct is disposed on the heat sink, external cooling air is supplied by the fan attached to the sink air inlet of the heat sink and the air duct inlet of the air duct. Cooling air flowing out of the air duct outlet of the air duct comes into contact with the magnetic component mounted on the circuit board.

An apparatus, such as a power routing apparatus, includes an enclosure having first and second compartments having respective first and second opposing walls. A cooling structure is disposed between the first and second compartments and has a coolant passage defined therein configured to support a coolant flow in a direction parallel to the first and second opposing walls. First and second semiconductor switches (e.g., static switches) are disposed on the first and second walls on opposite sides of the coolant passage and are configured to be cooled by the coolant flow.

An electrical controller includes a housing, wherein the housing has cooling air openings on two different housing sides. A heat sink is arranged inside the housing, in particular so as to be protected against contact, and forms a cooling air channel, wherein the cooling air channel runs between the cooling air openings of the different housing sides. An electrically insulating holding element is designed to mechanically fix the heat sink inside the housing in a manner electrically insulated from the housing. A number of components to be cooled are provided, wherein the components are thermally conductively coupled to the heat sink and are held by the heat sink.

A cooler includes a heat radiating member and a cover member that form a coolant flow path. The heat radiating member has a first surface on which an object to be cooled is disposed. The heat radiating member includes multiple fin members protruding into the coolant flow path from a second surface of the heat radiating member. The second surface of the heat radiating member is a part of a surface of the coolant flow path. The cover member includes a trap part in which multiple recesses are formed in a portion of an inner surface of the cover member being another part of the surface of the coolant flow path outside a protruding direction of the fin members.

A filter assembly is disclosed that includes a monolithic filter having a surface and a heat sink coupled to the surface of the monolithic filter. The heat sink includes a layer of thermally conductive material that can have a thickness greater than about 0.02 mm. The heat sink may provide electrical shielding for the monolithic filter. In some embodiments, the filter assembly may include an organic dielectric material, such as liquid crystalline polymer or polyphenyl ether. In some embodiments, the filter assembly may include an additional monolithic filter.

Certain embodiments of the present application relate to a variable frequency drive (VFD) cabin for a pump configuration including a mobile trailer on which the VFD cabin is to be mounted. The VFD cabin generally includes a medium-voltage VFD and a ventilation system. In certain embodiments, the ventilation system is configured to generate an overpressure condition within the cabin to discourage the entry of dust and debris into the cabin. In certain embodiments, one or more components of the medium-voltage VFD are coupled to the floor of the cabin via a vibration damping system. In certain embodiments, the VFD cabin may be directly coupled to a chassis of the mobile trailer without an intervening suspension being provided between the VFD cabin and the chassis.

A power conversion device comprises: a housing having a space formed therein and including a first opening and a second opening; a fan coupled to the second opening and allowing air to flow in a first direction from the first opening toward the second opening; a first electronic component arranged in the space; a heat dissipation member arranged at the rear of the first electronic component with respect to a flow direction of air; a printed circuit board arranged on the heat dissipation member; and a second electronic component arranged under the printed circuit board to be in contact with the upper surface of the heat dissipation member.