An apparatus and method for a shielding structure for surface-mount LTCC components and filters to increase the signal isolation from input signal port to output signal port. An LTCC filter device with an increased rejection of undesired frequencies in a stopband and minimal distortion or loss of desired signals in a passband.

A shielding structure and a manufacturing method thereof are provided. The shielding structure includes a metal housing, a plastic member, and a conductive trace. The metal housing has an inner surface and an internal space. The plastic member is disposed on the inner surface and in the internal space and has an accommodating space. The conductive trace is disposed on the plastic member and in the accommodating space, wherein the plastic member is between the conductive trace and the metal housing.

A dual-band filtering switch based on a single quad-mode dielectric resonator (DR) includes: a first printed circuit board (PCB) provided thereon with an input terminal; a second PCB provided thereon with an output terminal; a shielding shell arranged between the first and second PCBs and enclosing a shielding cavity together with the first and second PCBs; and a single quad-mode DR arranged in the shielding cavity. The first and second PCBs each include a feeding layer, a dielectric layer, and a ground layer that are stacked in sequence. The feeding layers of the first and second PCBs each include a microstrip line and a switching circuitry connected to the microstrip line, and the feeding layer is in contact with a surface of the DR to realize a switching function of the filtering switch. The proposed filtering switch feature low loss transmission and high selectivity with dual-band operation, miniaturization with the fewest resonators and friendly-integration, simultaneously.

A heat transfer assembly includes a heat plate coupled to a spring and to a graphite sheet. The spring is at first location corresponding to a heat source in an assembled device. The graphite sheet extends over at least a middle portion of the spring and over portions of the heat plate. The graphite sheet is coupled to a thermal pad positioned above a given surface of the heat source. The spring provides a compressive force on the thermal pad when the device is in an assembled state. The compressive force enhances thermal conductivity between the heat source and the heat transfer assembly. The heat plate may be positioned within and thermally coupled to a cover of the device. Principally by use of the thermal pad, graphite sheet, and thermal plate, heat generated by the heat source is transferred to the cover and then to the external environment.

A display device includes a display panel; a chassis disposed at a rear side of the display panel; a control circuit board disposed on the chassis; a shield case disposed on the control circuit board; and a fan disposed on the chassis and adjacent to the shield case. The shield case includes a main portion spaced apart from the control circuit board in a third direction, and side portions extending toward the chassis from opposite sides of the main portion. Dimples are formed in an inner surface of the main portion facing toward the control circuit board.

An optoelectronic device comprises a substrate, an optoelectronic element mounted on the substrate, a shielding cap providing electromagnetic shielding, at least one optical element attached to the shielding cap, and a detection element configured to detect if the shielding cap is mounted on the substrate.

An electronic device including an antenna according to various embodiments comprises: a printed circuit board disposed in a first area of the electronic device; a battery disposed in a second area of the electronic device; a heat dissipation member including a thermally conductive material disposed on the upper part of the printed circuit board and the battery; a first antenna disposed in the first area on the heat dissipation member; and a second antenna disposed in the second area on the heat dissipation member, wherein the frequency bands and the dielectric constants of the first antenna and the second antenna may be configured differently.

Particular embodiments described herein provide for an electronic device can include a support structure, a radiation source on the support structure, a radiation shield around the radiation source, and a hook and loop radiation shield securing mechanism to removably secure the radiation shield to the support structure, where the hook and loop radiation shield securing mechanism includes a hook portion with a plurality of hooks and a loop portion that includes a plurality of loops, where an angle of a retention hook for each of the plurality of hooks is less than about eighty degrees.

A cost-effective process and structure is provided for a thermal dissipation element for semiconductor device packages incorporating antennas that can incorporate RF/EMI shielding from the antenna elements. Certain embodiments provide incorporated antenna element structures as part of the same process. These features are provided using a selectively-plated thermal dissipation structure that is formed to provide shielding around semiconductor device dies that are part of the package. In some embodiments, the thermal dissipation structure is molded to the semiconductor device, thereby permitting a thermally efficient close coupling between a device die requiring thermal dissipation and the dissipation structure itself.

Disclosed is an electronic device having a space formed between front and rear surfaces thereof, the electronic device comprising: a first cover arranged on the front surface; a second cover arranged on the rear surface; a frame surrounding the first cover and the second cover; and a multilayered circuit board coupled to the second cover so as to constitute the housing of the electronic device, wherein the multilayered circuit board may comprises an insulated metal layer having a surface coupled to the second cover and a substrate-structured antenna device having a surface coupled to the insulated metal layer.