A current sensor is provided on a bus bar via which a reactor is connected to a power module. The reactor is separated from the current sensor by a partition made of metal having a magnetic shielding effect. An output terminal of the reactor is provided on either one of a surface of the reactor on a first side and a surface of the reactor on a second side, the first side being farther from a mounting surface of a power converter across a plane passing through the center of the reactor, the second side being closer to the mounting surface from the plane.

A circuit board assembly for association with an aircraft includes a circuit board and an electromagnetic interference component connected to the circuit board. The circuit board assembly may further include an enclosure having an electromagnetic signal permissive layer and an electromagnetic signal blocking layer. The electromagnetic signal permissive layer may include a housing that define a volume. The housing may enclose the electromagnetic interference component on the circuit board. The electromagnetic signal blocking layer defines a conductive barrier about the electromagnetic interference component.

An electrical device comprises a printed circuit board, a first contact portion, a second contact portion, a first conductive wall and a second conductive wall. The printed circuit board has a first surface and a second surface, on which the first contact portion and the second contact portion are disposed, respectively. The first conductive wall and the second conductive wall are in electrical contact with the first contact portion and the second contact portion, respectively. The first contact portion and the second contact portion are offset from one another in a direction parallel to at least one of the first surface and the second surface.

A wireless communication module with improved performance and a mobile object that is equipped with the wireless communication module with the improved performance are provided. The mobile object is equipped with a wireless communication module. The wireless communication module includes a substrate, a first element, and a second element. The substrate includes ground layers. The first element is arranged on the substrate and amplifies an input RF signal. The second element is arranged on the substrate and different from the first element. Each of the ground layers has a groove formed between the first element and the second element.

Embodiments may relate to a microelectronic package or a die thereof which includes a die, logic, or subsystem coupled with a face of the substrate. An inductor may be positioned in the substrate. Electromagnetic interference (EMI) shield elements may be positioned within the substrate and surrounding the inductor. Other embodiments may be described or claimed.

A shielding cover is provided. The shielding cover is adapted to be disposed on a circuit board and covers at least one electronic element. The shielding cover includes a cover body and a first spacer. The cover body includes a top sheet and a plurality of sidewalls, wherein a plurality of sidewall connecting portions are formed on the sidewalls. The first spacer includes a first spacer body, a first connection portion and a second connection portion, wherein the first connection portion and the second connection portion are formed on two ends of the first spacer body, and the first connection portion and the second connection portion are detachably connected to the sidewall connecting portions.

An assembly comprising a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, a frame coupled to the substrate such that the frame at least partially surrounds the first integrated device and the second integrated device, and a step heat sink coupled to the frame, such that the step heat sink is located over the first integrated device and the second integrated device. The assembly may further include a shield coupled to the frame such that the shield is located between the frame and the step heat sink. The shield may include a step shield. The assembly may further include a heat pipe coupled to the step heat sink.

An electrical or electronic device with a housing which includes a rear wall and a side wall peripherally surrounding the rear wall, contains a first region and a second region. The first region includes a shielding from the second region with respect to electromagnetic compatibility (EMC). The housing includes a stepped projection on an inner side of the side wall and/or of the rear wall. The shielding for electromagnetic compatibility includes a shielding plate, by means of which the first region is delimited from the second region. An electrical connection of the shielding plate to the side wall and/or to the rear wall is formed in that a peripheral region that delimits the shielding plate areally overlaps the stepped projection, at least along most of its length, and is fastened on it.

Electronic equipment includes a printed board having a front surface on which a ground pattern is formed and a shield member disposed opposed to the front surface of the printed board. The shield member has a strip-shaped region that is opposed to the ground pattern and protrudes toward the printed board, and is fastened to the printed board by screws that pass through a respective one of a plurality of screw holes made in the strip-shaped region. Either one of the shield member and the printed board has a protruding part that is formed projectingly toward the other and causes the strip-shaped region and the ground pattern to get contact with each other at a position sandwiched by adjacent two screw holes in the strip-shaped region in plan view.

An electronic component module includes: electronic components mounted on a substrate, each of the electronic components having terminals located on a side, upper, and/or lower surface thereof; and a shield that is located on the substrate, has side plates surrounding the electronic components, and is supplied with a ground potential, wherein in an electronic component closest to one side plate of the side plates among one or more electronic components, in each of which at least one terminal of the terminals is located on the side and/or upper surface, a terminal a first distance of which to the one side plate is shortest among the at least one terminal is a first terminal supplied with the ground potential, and a second distance each of second terminals not supplied with the ground potential to the one side plate is greater than the first distance.