H05K13/0409

SUCTION NOZZLE
20170291308 · 2017-10-12 · ·

In a suction nozzle 66 which sucks and holds a component 150 on a suction surface by using negative pressure air and detaches the sucked and held component from the suction surface by using positive pressure air, the positive pressure air and the negative pressure air used when the component is held and detached selectively flow through through-holes 90, 94 and 96, air flow path 116, or the like. In addition, a rod 110 is held to be capable of being advanced and retracted toward the suction surface in an inside section of the suction nozzle. The rod protrudes from the suction surface by the positive pressure air flowing through the air flow path and is retracted to the inside section of the suction nozzle when the negative pressure flows through the air flow path. In other words, the through-hole, the air flow path, or the like is shared as a mechanism for moving the rod and a mechanism for sucking and holding the component by the suction nozzle. Accordingly, it is possible to make the device compact, simple or the like and to improve practicality of the suction nozzle.

Method for managing and device for managing nozzle cleaning period

A nozzle cleaning period management device is provided with a cleaning device that cleans suction nozzles that are used in order to perform vacuum retention of an electronic component, a flow rate measurement device for measuring a flow rate that flows through the suction nozzles, a reduction amount calculation device for calculating a unit flow rate reduction amount of the flow rate of the suction nozzle per a number of times of mounting of electronic components on the basis of a flow rate difference before and after cleaning, which is measured by the flow rate measurement device, and an estimation device for estimating a cleaning period, which subsequently cleans the suction nozzles, on the basis of the unit flow rate reduction amount, which is calculated by the reduction amount calculation device, and a flow rate after cleaning.

Substrate working machine that selects which lifting and lowering section to pick up a component

A board work machine that includes a rotary head with multiple positions is provided for lowering nozzle holders and is able to continue operating even though it is determined that the nozzle holder cannot be lowered at one of the multiple positions. In step S1 in a Z shaft updating process, when determining based on Z shaft table that a lifting and lowering operation function is not effective and that an assigned Z shaft is not used for lifting and lowering, CPU lifts up and lowers a Z shaft that differs from the assigned Z shaft in step S11. Mounter can continue mounting work by using the Z shaft that differs from the assigned Z shaft.

Component mounting machine
11432444 · 2022-08-30 · ·

A component mounting machine includes a head including multiple nozzles; a negative pressure supply device supplying negative pressure from a negative pressure source individually to suction openings of the multiple nozzles; a raising and lowering device to individually raise and lower the multiple nozzles; and a control device performing a first pickup operation of controlling the raising and lowering device to lower one of the nozzles and controlling the negative pressure supply device to supply negative pressure to pick up the component using the suction opening of that nozzle, and a second pickup operation of controlling the raising and lowering device to lower multiple of the nozzles simultaneously and controlling the negative pressure supply device to supply negative pressure to the suction openings of those multiple nozzles to pick up the components simultaneously using the suction openings of those multiple nozzles.

Electronic component mounting machine and electronic component mounting method
11432446 · 2022-08-30 · ·

A holder including syringe configured to move up and down as the lifting and lowering section moves up and down, a first displacement portion configured to move up and down with respect to the syringe and to which the component holding section is attached, and a second displacement portion provided separately from the first displacement portion and configured to move up and down with respect to the syringe and the first displacement portion. The second displacement portion includes an engaging portion configured to engage the first displacement portion urged downward by the first urging portion in a vertical direction, and a target detection portion coupled to the engaging portion and positioned above the syringe. The contact determination section determines that an electronic component has contacted the circuit board when displacement of the target detection portion is detected with the sensor.

NOZZLE STORAGE

In a palette accommodation device in which a nozzle palette to which a suction nozzle can be installed is stored, a plurality of storage sections (parts on one pair of comb teeth which are positioned at the same height) for storing the nozzle palette, are installed to be aligned in the vertical direction. In addition, a support arm moves in the vertical direction, and moves in the direction of approaching the storage section and in the direction of being separated from the storage section.

NOZZLE STATION INSTALLATION DEVICE

A nozzle station installation device capable of installing multiple nozzle stations, which hold multiple suction nozzles that are used in an electronic component mounting machine, in a nozzle cleaning device or the like, is provided. The nozzle station installation device is provided with multiple reference bases, and intermediate bases that are provided to be attachable and detachable on each of the multiple reference bases and on which multiple nozzle stations are capable of being placed, positioning sections which position intermediate bases are provided at a common position on the multiple reference bases, a positioning and fixing device that positions and fixes each of the multiple nozzle stations to be attachable and detachable is provided on each of the multiple intermediate bases, and 2D codes are disposed in a fixed positional relationship with the positioning sections in each of the multiple nozzle stations.

Spindle module, bank, and method

A pick-and-place spindle module comprises: a modular body structure including a first receiving location configured to receive a spindle; a first z-axis motor configured to move a spindle received in the first receiving location in a z-axis; a first theta motor configured to rotate a spindle received in the receiving location; a first motion control chip each attached to the body structure, the first motion control chip configured to control the first z-axis motor and the first theta motor; and a mechanical attachment mechanism, the mechanical attachment mechanism configured to facilitate attachment of the modular body structure to a spindle bank.

Component-mounting device and work system

A component-mounting device includes a base, a board positioner which positions a board, a feeder carriage which is attachable to and detachable from the base, a part feeder which supplies a component, a mounting head which mounts the component on the board positioned by the board positioner, a nozzle replacement table which holds a replacement nozzle attached to or detached from the mounting head, a replacement table holder which holds the nozzle replacement table at a predetermined holding position within a movable range of the mounting head, and a placing table on which the nozzle replacement table is placed before the replacement table holder holds the nozzle replacement table. The component-mounting device delivers the nozzle replacement table between the replacement table holder and the placing table in a state where the feeder carriage is connected to the base.

Component mounting apparatus

The image including both of the component and the nozzle that is being lowered toward the component is captured. The target height at which the nozzle is stopped in the mounting process is controlled based on this image. This enables the target height at the time of lowering the nozzle toward the component to be controlled regardless of a flow rate of air sucked from the nozzle.