Patent classifications
H05K13/0409
ROTARY HEAD TYPE COMPONENT MOUNTER
In rotary head type component mounter, provided at two locations around rotary head are Z1-axis drive mechanism and Z2-axis drive mechanism that lower suction nozzles, and in a case in which the interval between two suction nozzles is a multiple two times or greater than the arrangement pitch of components in tray, component mounter performs consecutive simultaneous pickup operation repeatedly for a quantity corresponding to the quantity of component arrangement pitches between the two suction nozzles, the consecutive simultaneous pickup operation being that of lowering the two suction nozzles simultaneously such that two of the components on tray are picked up simultaneously, then rotating rotary head by one nozzle pitch, moving rotary head in the arrangement direction of the components on tray by one component arrangement pitch, and then lowering the next two suction nozzles simultaneously such that another two of the components on tray are picked up simultaneously.
Component placement device as well as a method for picking up a component and placing a component on a substrate
A component placement device for picking up a component and placing a component on a substrate device comprises a holder which is movable at least in a main direction, as well as a nozzle for picking up a component. The nozzle is movable at least in a direction opposite the main direction relative to the holder. The component placement device comprises a fluid flow channel which opens or closes upon movement of the nozzle in the direction opposite the main direction relative to the holder, detection means for detecting the opening or closing of the fluid flow channel as well as means for controlling the movement of the holder in at least the main direction on the basis of a signal delivered by the detection means concerning the opening or closing of the fluid flow channel.
Electronic circuit component mounting head
An electronic circuit component mounting head which mounts electronic circuit components to a circuit substrate is provided. The mounting head includes a rotating/raising/lowering axis held on a head main body as to be capable of rotation and of being raised/lowered, a suction nozzle held on the rotating/raising/lowering axis as to be capable of being raised/lowered and not capable of being rotated relatively, and the rotating/raising/lowering axis and suction nozzle can be rotated as necessary by an electric motor. A raising/lowering driving member is held on head main body as to be capable of being raised/lowered, and is raised/lowered by a first linear motor. A first engaging section of the raising/lowering driving member is engaged with the rotating/raising/lowering axis, and a second engaging section of a second linear motor is held on the raising/lowering driving member engaged with suction nozzle.
NOZZLE REPLACEMENT TABLE UNIT
A nozzle replacement table unit includes a nozzle container configured to accommodate multiple nozzles for replacement, a pedestal to which the nozzle container is detachably attached, a fixing mechanism configured to fix the nozzle container to the pedestal, and an operation section configured to release fixing by the fixing mechanism. The operation section is provided in the nozzle container.
ELECTRONIC COMPONENT MOUNTING DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING STRAP
An electronic component mounting device is provided for mounting, at different intervals from each other on attachments, a plurality of electronic components which have been placed in a predetermined portion. The electronic component mounting device comprises a removal mechanism for removing some of the plurality of the electronic components being placed in the predetermined portion, a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components such that, before reaching the attachments, the plurality of the electronic components are at the different intervals at which they will be mounted on the attachments, and transporting the electronic components to the attachments, and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.
ACTUATOR SYSTEM
An actuator system that picks up workpieces aims to shorten tact time and to reduce damages to workpieces. The actuator system includes an actuator that picks up a workpiece, an external force detection sensor that detects a physical quantity that is correlated with an external force that is applied to the workpiece, a head unit that is connected to the actuator and the external force detection sensor without a communication network, the head unit being configured to control the actuator based on a sensing result from the external force detection sensor when a pickup request signal that is a signal requesting pickup of the workpiece is received, and a control device that is connected to the head unit over the communication network, the control device being configured to transmit the pickup request signal to the head unit.
Component mounting device
A component mounting device mounts an electronic component on a printed circuit board, and includes a sideview camera which takes an image of a side surface of a target, a mounting head having a nozzle shaft, and a driving device which moves the mounting head to a planar direction on a base. The nozzle shaft includes a shaft main body movably supported to a vertical direction with respect to the mounting head, and a suction nozzle attached at a tip of the shaft main body to suction and hold the electronic component, and an identification mark which identifies the suction nozzle is provided on a side surface of the suction nozzle.
Mounter air controller
The present invention provides a mounter air controller capable of executing appropriate air control associated with replacement of a nozzle without stopping operation of a mounter. This mounter air controller includes: a flow rate adjustment mechanism 4 mounted on a head module HM of the mounter; and control means 5 that controls this flow rate adjustment mechanism 4. The flow rate adjustment mechanism 4 is interposed between a positive-pressure region and a nozzle n and has a function capable of continuously changing a flow rate of passing air. The control means 5 is configured to bring the nozzle n to have a negative pressure and then control the flow rate in the flow rate adjustment mechanism 4 on the basis of an applied voltage or an applied current, which is determined in advance, so as to supply the air to the nozzle n.
ACTUATOR
The present invention reduces tact time for a pick-and-place operation by an actuator. In a housing of the actuator, an air passage being a passage of air when sucking air from a hollow part of a shaft is provided. Furthermore, a sucking valve that sucks air from the hollow part of the shaft through the air passage and a suction detecting sensor to detect that a workpiece is suctioned onto a tip of the shaft are provided in the air passage. Then, in the housing, the air passage is disposed at a position on a side opposite to a linear motion motor that moves the shaft in an axial direction of the shaft, via the shaft.
Dispensing head, nozzle and method
A pick-and-place dispensing head comprises: a body structure having a z-axis motor attachment location and a linear track; a z-axis motor attached to the body structure at the axis motor attachment location, the z-axis motor configured to exact movement in a z-axis; a body attached to the linear track and operably connected to the z-axis motor such that the body moves along the linear track when the z-axis motor is actuated; a theta motor operably connected to the first body; a receiving location operably connected to the body; and an optical detector extending from the first body configured to detect upward z-axis movement of a received pick-and-place spindle relative to the body.