A component mounter images suction states of components picked up by a suction nozzle, processes images of the suction states of the components to recognize the suction state of the component, and stores the images in a storage device with linking production information related to the components. An inspection machine images a mounted state of each component on a board, processes an image of mounted state of each component to recognize the mounted state of each component, and inspects whether a mounting error occurred for each component based on the recognition result. The inspection machine determines that a mounting error occurred for any of the components the image of the mounted state of the component for which a mounting error was determined to have occurred and a searched image of the suction state of the component are displayed on the display monitor in a comparative manner.

Disclosed herein is a system that includes a placement head, the placement head including a spindle assembly, the spindle assembly including a spindle capable of receiving one of a plurality of nozzles for attachment. The system includes a nozzle changer, the nozzle changer including a revolver capable of holding a plurality of nozzles. A position of the nozzle changer is changeable in response to movement of the spindle assembly. Further disclosed is a method of receiving and attaching nozzles with a nozzle changer.

A mounting order determination device for determining a mounting order of multiple electronic components prior to mounting work using a component mounting machine or a component mounting line, the mounting order determination device including a level setting section for setting level information, in which mounting order priorities are ranked, for each component type, the target of which being of at least one of a multilayer mounting component type group, including a component type of multiple electronic components having a possibility of being mounted in the up-down direction in layers, and a close-proximity mounting component type group.

A production data creation device includes an input unit and a setting unit. The input unit receives an input of one application from among a plurality of applications displayed on a screen. The setting unit sets one or more operation parameters used by a component mounter to mount a component on a board, on the basis of the input application.

A mounting head includes a first air passage and a second air passage through which air is capable of flowing; a first valve configured to switch air flowing through the first air passage between positive pressure and negative pressure; a second valve configured to switch air flowing through the second air passage between positive pressure and negative pressure; a common air passage configured to communicate with the tool, through which air to be supplied to the tool is capable of flowing; and a third valve configured to selectively cause the first air passage or the second air passage to communicate with the common air passage.

A component mounting machine including a component supply device to supply a component to a supply position; a component transfer device to use a component mounting tool to pick up the component from the supply position and mount the component on a board; a component detecting section to detect whether the component is present at the supply position before or while the component is being picked up by the component mounting tool; a holding detecting section to detect whether the component mounting tool is holding the component following pickup; and a remaining detecting section to detect whether the component remains at the supply position in a case in which it is detected by the holding detecting section that the component is not being held by the component mounting tool; and a dropped determining section to determine whether the component has dropped.

This bonding apparatus is provided with: a tape feeder module which takes out an electronic component from a carrier tape and transfers the electronic component thus taken out; a die supply module which has a die pick-up mechanism for picking up a semiconductor die from a semiconductor wafer bonded to a dicing sheet by pushing up the semiconductor die and which transfers the semiconductor die thus picked up; and a bonding module which arranges, on a circuit substrate, the semiconductor die supplied by the die supply module and/or the electronic component supplied by the tape feeder module.

The object is to provide a substrate processing machine facilitating checking the operation of a device in the interior of a housing from the exterior of the housing. The substrate processing machine includes a base and a module, disposed on the base, and has a device configured to perform a predetermined operation contributing to the production of a substrate. The module can be switched between a fabrication position where the substrate is produced and an offset position that deviates from the production position relative to the base. The device can operate in the production position and the offset position. The operation speed of the device in the offset position is slower than the operation speed of the device to in the production position.

Each of multiple component mounting machines constituting a component mounting line is configured to switch between a production mode in which a component is mounted on a circuit board that has been conveyed in and then conveyed out, a mounting accuracy measurement mode in which a mounting accuracy measurement component is mounted at a predetermined position on a mounting accuracy measurement board and the mounting accuracy is measured, and a pass mode in which a component is conveyed out without being mounted on the board conveyed in. When the control mode of two or more component mounters among the multiple component mounting machines is the mounting accuracy measurement mode, the mounting accuracy is measured by conveying the mounting accuracy measurement board along the board conveyance path, and the two or more component mounting machines sequentially use the mounting accuracy measurement board to measure the mounting accuracy.

A system for transferring a micro LED includes a micro LED dropped into a solution. The system further includes a micro LED grip body immersed in the solution, the micro LED grip body including a porous member having pores, and gripping the micro LED with a grip surface where the pores are provided. An upper surface of the porous member is configured with a seating recess having a guide inclined portion on which the micro LED is mounted and a shielding portion provided around the seating recess.