A component mounting system includes a head to revolve multiple suction nozzles in a circumferential direction, a lifting and lowering device configured to lift and lower a suction nozzle at a predetermined revolving position, a storage device configured to store any one of multiple pieces of directionality information in association with identification information of the suction nozzle, and a control device configured to acquire corresponding directionality information from the storage device based on the acquired identification information of the suction nozzle and to perform pickup of the component supplied from the component supply device at the spinning position in accordance with the directionality information.

A device for handling components that is designed and equipped to handle components with multiple lateral surfaces and/or edges of the lateral surfaces. The device has at least one receiving tool, which is arranged on a turning device, for a respective component of the components, where the receiving tool is designed and equipped to receive the respective component on one of the component cover surfaces. The turning device is designed and equipped to rotate the receiving tool on a turning plane about a turning axis, and in the process optionally convey a component located on the receiving tool from a receiving position to one or more orientation positions, optionally one or more inspecting positions, a setting-down position, and optionally an ejecting position. The device also has a holding and supplying device, which faces the receiving position, for a component supply, and a discharge device.

A suction position adjustment device of a component mounter which includes a head having multiple pickup members and that executes simultaneous suction control for substantially simultaneously picking up multiple components with the multiple pickup members by moving the head to a target position that is determined to locate the multiple pickup members on the multiple components supplied from multiple feeders to a supply position. The suction position adjustment device includes an imaging device configured to image the supply position of the feeder from above, a display device, and a control device. The control device configured to control the imaging device so that an upper surface, at the supply position, in the multiple feeders of adjustment targets is captured and display, on the display device, captured multiple upper surface images and multiple pointers superimposed on the multiple upper surface images, when the target position is adjusted.

A component mounter includes a state recognition section configured to recognize a supply state of a component in a supply area based on a feature amount including at least one of a shape and an angle of each of multiple feature portions in image data on which image processing has been executed. The state recognition section determines whether one or more candidate feature portions included in a search range belong to an identical component together with a reference feature portion based on one of feature amounts of the candidate feature portion and a positional relationship between the reference feature portion and the candidate feature portion.

A mounting device of the present disclosure used in a mounting system, includes a supply section configured to hold a component, a mounting section configured to pick up the component from the supply section and perform a mounting process for the component on a mounting target, an inspection/imaging section configured to capture an image of the mounting target, and a control section configured to execute a missing component inspection process of detecting whether a component on the mounting target is missing or not by using a captured image of the mounting target, and, when a component is missing, control the mounting section to pick up the missing component from the supply section and dispose the missing component on the mounting target.

A component placement system is provided. The component placement system includes a placement head including a plurality of pipettes. Each of the plurality of pipettes is configured to pick and place components. The placement head includes a plurality of controllers, each of the plurality of controllers being configured to control a respective one of the plurality of pipettes.

A component placement system is provided. The component placement system includes a placement head including a plurality of pipettes. Each of the plurality of pipettes is configured to pick and place components. The component placement system also includes a vacuum source for providing vacuum to each of the plurality of pipettes for holding a component. The component placement system also includes a positive fluid source for selectively providing a positive fluid pressure for releasing the component from a respective one of the plurality of pipettes.

When a mounting head is moved upward of a rear side conveyor across and over a front side conveyor after a component suction operation, it is determined whether or not there is a possibility that a component sucked by a suction nozzle may interfere with a component mounted on a circuit board on the front side conveyor. When so determined, a head lifting mechanism is caused to lift up the mounting head to a position where the component sucked by the suction nozzle does not interfere with the mounted component. Thereafter, the mounting head is moved upward of the rear side conveyor, and the head lifting mechanism is caused to lower down the mounting head to an initial height position. Thereafter, the component is mounted on a circuit board on the rear side conveyor.

A maintenance management device comprises: an inspection device configured to inspect an exchangeable element in a component mounting machine configured to mount a component on a circuit board; and an information management section configured to store statistical information in which results of multiple inspections with the inspection device are linked to identification information for each of multiple exchangeable elements targeted for inspection.

A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis; and a second motion system for carrying the first bond head array independent of the second bond head array.