An electronic component mounting method including a preparatory imaging step of storing preparation position information of component holding sections obtained based on preparation images imaged with no electronic component held by the component holding sections and with a rotary head indexed to multiple indexing angles; a pick-up step of picking up electronic components; an angle information acquisition step of acquiring indexing angle information of the rotary head; a component imaging step of imaging the electronic components with the indexing angle of the rotary head made to coincide with an indexing angle of the rotary head that corresponds to the specific positional information; and a measurement step of measuring a positional deviation amount between a position of the multiple component holding sections that is recognized from the specific positional information and a position of the electronic component that is recognized from the component image obtained in the component imaging step.

An analysis device is a device for use for a component mounting device including a pickup member configured to be moved relative to a board by means of a moving device and a contact detection sensor configured to detect that a component picked up by the pickup member is brought into contact with the board to analyze a mounting state of the component mounting device. The analysis device includes a storage device configured to store multiple detection result data relating to detection results obtained by the contact detection sensor when the component is mounted on the board in association with mounting conditions when the detection results are obtained by the contact detection sensor, and an output device configured to count the multiple detection result data stored in the storage device by at least two conditions in the mounting conditions and output the multiple detection result data so counted.

A component mounter for mounting electronic components includes a mounting head with at least two suction nozzles in the multiple suction nozzles are lowered simultaneously so as to pick up at least two electronic components simultaneously. A control device, which is configured to control electronic component pickup and mounting operations, causes the mounting head to move so as to position the at least two suction nozzles that are lowered simultaneously in an electronic component pickup operation step to be located individually on at least two trays on the pallet, causes the at least two suction nozzles to be lowered simultaneously, and causes electronic components on the at least two trays to be picked up simultaneously.

A component mounting machine including a component supply device to supply a component to a supply position; a component transfer device to pick up the component from the supply position and mount the component on a board; a component detecting section to detect whether the component is present at the supply position before or while the component is being picked up by the component mounting tool; a holding detecting section to detect whether the component mounting tool is holding the component following pickup; and a retry performing section to determine whether to perform a retry operation of attempting to pick up the component again using the component mounting tool based on a detection result of the component detecting section and a detection result of the holding detecting section, and to perform the retry operation in accordance with a result of the determining of whether to perform the retry operation.

A substrate working device includes a working unit that performs work on a substrate on which a component is mounted, an imager capable of imaging a correction mark for position correction, and a mark projector that projects the correction mark. The correction mark includes a first correction mark and a second correction mark. The mark projector projects the first correction mark to a first height and projects the second correction mark to a second height.

The component mounting method is a method for mounting a component using a component mounter including a mounting head, a component camera as an imaging device configured to image a component, a first component holding section provided on the mounting head and capable of holding a first component, and a second component holding section capable of holding a second component at a position lower than the first component, the component mounting method having steps wherein the first component holding section picks up the first component, the imaging device images the first component, the second component holding section picks up the second component while the first component holding section holds the first component, and the second component is imaged while the first component holding section holds the first component and the second component holding section holds the second component.

A mounting shaft device comprises a spline shaft including a supply passage for air pressure that extends through a shaft hole in a support, a conduit in communication with a valve and allowing the air pressure from the valve to be introduced to the supply passage, a component retainer disposed at an axial end of the spline shaft and configured to hold an electronic component by using the air pressure applied through the supply passage, a spline nut connected to the spline shaft through a spline mechanism, and a bearing supporting the spline shaft in the shaft hole in the support both in a linearly movable manner in an axial direction and in a rotatable manner about an axis thereof. The bearing, the conduit, and the spline nut are arranged on an axis of the spline shaft in this order from the component retainer.

A component placing device to place a component on a board, including: a shaft having a lower portion and an upper portion; a component holder that is attached to the lower portion of the shaft in a state of being vertically displaceable and has a suction hole for holding the component by a negative pressure; an elastic body that biases the component holder downward with respect to the shaft; a servo motor that raises and lowers the shaft; and a controller that sets a thrust limit value for limiting a thrust of the servo motor and limits the thrust of the servo motor to be equal to or lower than the thrust limit value when the component holder is lowered toward the board. The thrust limit value is set within a range in which a load is smaller than a force by which the elastic body biases the component holder.

A component mounting machine including a head unit that has a head main body configured to hold multiple pickup members each capable of picking up a component at a predetermined interval along a predetermined circumference and to be capable of rotating forward and reverse directions; a moving device configured to move the head unit; a lifting and lowering device configured to lift and lower a pickup member; a component supply device configured to be capable of supplying the component to the pickup member; and a control device configured to control those described above. The control device performs a control such that the pickup members pick up the components supplied by the component supply device, and each component is mounted on a board after a completion of the pickup, while performing an operation of rotating the head main body and an operation of moving the head unit together.

A device for and method of hot swapping one or more electronic devices from an immersion cooling tank having a first opening, the device including a condensing device removably locatable in the first opening of the immersion cooling tank, the condensing device having a condensing coil forming a second opening through which the electronic device(s) is removable and an apparatus coupled to the condensing device for selectively adjusting a height and/or a location of the condensing device about the first opening of the immersion cooling tank.