An interconnect substrate includes a core layer including a resin layer mainly composed of a non-photosensitive thermosetting resin and a through interconnect extending through the resin layer, the core layer having no reinforcement member contained therein, a first interconnect structure laminated on a first side of the core layer and including first interconnect layers and first insulating layers mainly composed of a photosensitive resin, and a second interconnect structure laminated on a second side of the core layer and including second interconnect layers and a single second insulating layer mainly composed of a photosensitive resin, wherein the first interconnect layers are electrically connected to the second interconnect layers via the through interconnect, wherein the core layer has greater rigidity than the first interconnect structure and the second interconnect structure, and wherein a thickness of the second interconnect structure is greater than a thickness of each of the first insulating layer.

The casing of an electronic control device includes a casing-side contact surface in contact with the end of a printed-circuit board. A cover includes a cover-side contact surface holding the end of the printed-circuit board together with the casing-side contact surface by being in contact with the end of the printed-circuit board. In the printed-circuit board, a held portion held between the casing-side contact surface and the cover-side contact surface is provided with a through-hole via.

A metal-clad laminate is provided. The metal-clad laminate includes: a dielectric layer, which has a first reinforcing material and a dielectric material formed on the surface of the first reinforcing material, wherein the dielectric material includes 60 wt % to 80 wt % of a first fluoropolymer and 20 wt % to 40 wt % of a first filler; an adhesive layer, which is disposed on at least one side of the dielectric layer and includes an adhesive material, wherein the adhesive material has 60 wt % to 70 wt % of a second fluoropolymer and 30 wt % to 40 wt % of a second filler; and a metal foil, which is disposed on the other side of the adhesive layer that is opposite to the dielectric layer, wherein the melting point of the second fluoropolymer is lower than the melting point of the first fluoropolymer.

A resin composition, a metal laminate, and a printed circuit board which use the resin composition are disclosed. A method for manufacturing the metal laminate is also disclosed. The resin composition contains at least one elastomer selected from the group consisting of a fluoroelastomer or a styrene-based elastomer; a fluororesin filler; and an inorganic filler.

A composition for forming a protective coating on an electronic device that is in the form of a non-Newtonian fluid that exhibits both viscous and elastic properties, and that forms at least one coating that is hydrophobic, oleophobic, or oleophilic is disclosed. The viscous and elastic properties associated with the non-Newtonian fluid allows the composition to redistribute after being applied as a coating an electronic device. Methods for protecting an electronic device from liquid contaminants by applying the disclosed composition and electronic devices comprising the composition are also disclosed. An electronic device, such as a printed circuit board, having a film made of the composition is also disclosed.

A coupling structure in a wiring board including a printed wiring board and a flexible printed wiring board overlaid on the printed wiring board. The printed wiring board includes a first conductive line on a surface adjacent to the flexible printed wiring board. The flexible printed wiring board includes a second conductive line on a surface on an opposite side from the printed wiring board. The flexible printed wiring board includes a conduction-purpose through hole adjacent to the second conductive line and in which a section of the first conductive line is disposed. The first conductive line of the printed wiring board and the second conductive line of the flexible wiring board are electrically connected to each other with a conductive member disposed in the conduction-purpose through hole. The conductive member is covered with a resin having an insulating property.

Disclosed are liquid crystal polymer particles capable of reducing dielectric loss tangent while suppressing surface roughness of the resin film, when added to a resin film. The liquid crystal polymer particles have a melting point of 270° C. or higher, wherein cumulative distribution 50% diametre D.sub.50 in the particle size distribution is 20 μm or less, and cumulative distribution 90% diametre D.sub.90 is 2.5 times or less of D.sub.50.

The printed circuit board according to the embodiment includes a first insulating layer; a first circuit pattern disposed on a lower surface of the first insulating layer or inside the first insulating layer; a second circuit pattern disposed on an upper surface of the first insulating layer; and a second insulating layer disposed on the upper surface of the first insulating layer and to surround the second circuit pattern; wherein the second circuit pattern is an outermost circuit pattern, wherein the second circuit pattern and the second insulating layer are disposed to protrude on the upper surface of the first insulating layer, and wherein a height of the second circuit pattern is greater than a height of the second insulating layer.

A circuit board according to an embodiment comprises: an insulating layer; a circuit pattern disposed above the top surface of or below the bottom surface of the insulating layer; and a buffer layer disposed between the insulating layer and the circuit pattern, the buffer layer comprising carbon atoms, nitrogen atoms, oxygen atoms, silicon atoms, sulfur atoms, and metal atoms, wherein: the ratio of the carbon atoms to the metal atoms ((carbon atom/copper atom)*100) is 5-7; the ratio of the nitrogen atoms to the metal atoms ((nitrogen atom/copper atom)*100) is 1.5-7; the ratio of the oxygen atoms to the metal atoms ((oxygen atom/copper atom)*100) is 1.1-1.9; and the ratio of the silicon atoms to the metal atoms ((silicon atom/copper atom)*100) is 0.5-0.9; and the ratio of the sulfur atoms to the metal atoms ((sulfur atom/copper atom)*100) is 0.5-1.5.

A resin composition that allows production of laminated sheets excellent in heat resistance and processability is disclosed. The resin composition comprises: a) a block copolymer, where the block copolymer comprises at least one polymer block comprising polymerized acyclic conjugated diene units, such as butadiene units, and at least one polymer block containing units like a conjugated cyclic diene such as 1,3-cyclohexadiene or monomer units characterized by unit Tg above 100° C., b) a curing initiator, and c) optionally diene-based polymer selected from a polybutadiene polymer and the copolymer of butadiene with styrene or other styrenic monomers, c) optional additives comprising but not limited to a multi-functional co-curable additive, a diene based rubber, a halogenated or non halogenated flame retardant, an inorganic or organic filler or fiber, an antioxidant, a adhesion promotor, a film forming.