A processor substrate includes: an electrically insulating material having a first main side and a second main side opposite the first main side; a plurality of electrically conductive structures embedded in the electrically insulating material and configured to provide an electrical interface for a processor at the first main side of the electrically insulating material and to provide electrical connections from the electrical interface to the second main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material and which exceeds a voltage limit of the processor substrate to a voltage that is within an operating range of the processor and below the voltage limit of the processor substrate. An electronic system that includes the processor substrate is also described.

A multi-layer circuit board is formed multiple layers of a catalytic layer, each catalytic layer having an exclusion depth below a surface, where the cataltic particles are of sufficient density to provide electroless deposition in channels formed in the surface. A first catalytic layer has channels formed which are plated with electroless copper. Each subsequent catalytic layer is bonded or laminated to an underlying catalytic layer, a channel is formed which extends through the catalytic layer to an underlying electroless copper trace, and electroless copper is deposited into the channel to electrically connect with the underlying electroless copper trace. In this manner, traces may be formed which have a thickness greater than the thickness of a single catalytic layer.

A multi-layer circuit board is formed multiple layers of a catalytic layer, each catalytic layer having an exclusion depth below a surface, where the cataltic particles are of sufficient density to provide electroless deposition in channels formed in the surface. A first catalytic layer has channels formed which are plated with electroless copper. Each subsequent catalytic layer is bonded or laminated to an underlying catalytic layer, a channel is formed which extends through the catalytic layer to an underlying electroless copper trace, and electroless copper is deposited into the channel to electrically connect with the underlying electroless copper trace. In this manner, traces may be formed which have a thickness greater than the thickness of a single catalytic layer.

A coated particle according to the present invention is a coated particle containing a conductive metal-coated particle having a metal film formed on a surface of a core material, the conductive metal-coated particle coated with an insulation layer containing a polymer, wherein the insulation layer has a phosphonium group. The insulation layer preferably contains an insulating fine particle and the fine particle has a phosphonium group on a surface thereof, or the insulation layer is preferably a film having a phosphonium group. In addition, the metal is preferably at least one selected from nickel, gold, nickel alloys, and gold alloys. The polymer constituting the insulation layer is preferably at least one polymerized product selected from styrenes, esters, and nitriles.

An interposer for a processor includes: an electrically insulating material having a first main side and a second main side opposite the first main side; a plurality of electrically conductive structures embedded in the electrically insulating material and configured to provide an electrical interface for a processor substrate at the first main side of the electrically insulating material and to provide electrical connections from the electrical interface to the second main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material to a lower voltage at the first main side of the electrically insulating material.

A processor substrate includes: an electrically insulating material having a first main side and a second main side opposite the first main side; a plurality of electrically conductive structures embedded in the electrically insulating material and configured to provide an electrical interface for a processor at the first main side of the electrically insulating material and to provide electrical connections from the electrical interface to the second main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material and which exceeds a voltage limit of the processor substrate to a voltage that is within an operating range of the processor and below the voltage limit of the processor substrate. An electronic system that includes the processor substrate is also described.

The invention relates to a process of fabricating a beaded path on the surface of a substrate, the process comprising: preparing a dispersion of particles in a liquid; supplying the prepared dispersion to at least one electrically conductive microcapillary in a continuous manner; forming and maintaining a convex meniscus of the dispersion at the outlet end of the microcapillary positioned above and/or below the surface of a substrate; applying alternating voltage to the microcapillary so that a beaded structure is formed between the dispersion meniscus and the surface of the substrate; and moving the microcapillary relative to the substrate and/or the substrate relative to the microcapillary so as to deposit the particles of the formed beaded structure on the surface of the substrate and simultaneously rebuild the beaded structure formed between the dispersion meniscus and the surface of a substrate. The invention also relates to a system for realizing this process and the use of the beaded path fabricated in accordance with the process of the invention for the production of electrodes in photovoltaic cells, new generation clothing, electronic components, including flexible electronics, artificial flagella, photonic and optomechanical materials, as well as for the regeneration of damaged paths on the surface of a substrate. The present invention also relates to a kit comprising a substrate and a beaded path fabricated on the surface of that substrate according to this process. The invented process is simple, efficient, hence economical, and enables fabricating beaded paths that retain their properties after turning off the voltage initially used to form a beaded structure. Moreover, the process occurs outside a liquid environment and enables fabricating of paths in a continuous manner, that is, through the formation of the beaded structure and its simultaneous depositing on the surface of a substrate allowing the fabrication of beaded paths of arbitrary length.

An exemplary assembly includes a top circuit substrate; a bottom circuit assembly that underlays the top circuit substrate and is attached to the top circuit substrate by an adhesive layer as a stiffener, the adhesive layer, and a plurality of conductive balls. The top circuit substrate includes a plurality of upper vias that extend through the top circuit substrate. The bottom circuit assembly includes a plurality of lower vias that extend through the bottom circuit assembly. The adhesive layer includes internal connections that electrically connect the upper vias to the lower vias. The conductive balls are housed in the lower vias. The bottom circuit assembly has an elastic modulus at least six times the elastic modulus of the top circuit substrate, and has a coefficient of thermal expansion at least two times the coefficient of thermal expansion of the top circuit substrate.

A method for manufacturing connection structure, the method includes arranging conductive particles and a first composite on a first electrode located on a first surface of a first member, arranging a second composite on a region other than the first electrode of the first surface, arranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other, pressing the first member and the second member; and curing the first composite and the second composite.

A circuit board is formed from a catalytic laminate having a resin rich surface with catalytic particles dispersed below a surface exclusion depth. Trace channels and apertures are formed into the catalytic laminate, electroless plated with a metal such as copper, filled with a conductive paste containing metallic particles, which are then melted to form traces. In a variation, multiple circuit board layers have channels formed into the surface below the exclusion depth, apertures formed, are electroless plated, and the channels and apertures filled with metal particles. Several such catalytic laminate layers are placed together and pressed together under elevated temperature until the catalytic laminate layers laminate together and metal particles form into traces for a multi-layer circuit board.