A thermally expandable material includes microcapsules and a binder having a conducting property, each microcapsule including a shell having an insulating property, and a thermally expandable component contained in the shell and having a property of expanding by heating, the shell deforming due to expansion of the thermally expandable component to come in contact with another capsule and have an insulating state with the other capsule.

A microcapsule includes a shell including a conducting component, and a thermally expandable component contained in the shell and having a property of expanding by heating. The shell is deformable in accordance with expansion of the thermally expandable component when the thermally expandable component is heated.

A method for manufacturing a mounting body comprising: a mounting step of mounting an electronic component onto a wiring board via an anisotropic conductive film containing a binder having an epoxy resin as a primary constituent and conductive particles having a compressive hardness (K) of 500 kgf/mm.sup.2 or more when compressively deformed by 10%, wherein a relation between a thickness (A) of the binder and an average particle diameter (B) is 0.6B/A1.5 and an elastic modulus of the binder after curing is 50 MPa or more at 100 C.; and a remounting step of mechanically peeling to detach the electronic component and the wiring board in the case of a problem occurring in mounting of the mounting step and reusing the wiring board to perform the mounting step.

Disclosed are a conductive particle, an anisotropic conductive film, a display device, and a method for fabricating the same so as to detect the extent to which the conductive particles are cracked in a heating and pressurizing process, to thereby improve the ratio of finished products while the display device is being manufactured. A core of the conductive particle is a fluorescent resin core. In the conductive particle according to this disclosure, the core of the conductive particle is a fluorescent resin core, and the extent to which the conductive particle is cracked can be detected by detecting varying fluorescence in a heating and pressuring process, to thereby alleviate such a phenomenon from taking place that the conductive particle has a poor electrical conductivity due to an insufficient pressure, or the conductive particle is cracked, and thus loses its electrical conductivity, due to an excessive pressure.

The present invention provides a bio-electrode composition including: a resin containing a urethane bond in a main chain and a silsesquioxane in a side chain; and an electro-conductive material, wherein the electro-conductive material is a polymer compound having one or more repeating units selected from fluorosulfonic acid salts shown by the following general formulae (1)-1 and (1)-2, sulfonimide salts shown by the following general formula (1)-3, and sulfonamide salts shown by the following general formula (1)-4. This can form a living body contact layer for a bio-electrode that is excellent in electric conductivity and biocompatibility, light in weight, manufacturable at low cost, and free from large lowering of the electric conductivity even when it is wetted with water or dried. The present invention also provides a bio-electrode in which the living body contact layer is formed from the bio-electrode composition, and a method for manufacturing the bio-electrode. ##STR00001##

An exemplary assembly includes a top circuit substrate; a bottom circuit assembly that underlays the top circuit substrate and is attached to the top circuit substrate by an adhesive layer as a stiffener, the adhesive layer, and a plurality of conductive balls. The top circuit substrate includes a plurality of upper vias that extend through the top circuit substrate. The bottom circuit assembly includes a plurality of lower vias that extend through the bottom circuit assembly. The adhesive layer includes internal connections that electrically connect the upper vias to the lower vias. The conductive balls are housed in the lower vias. The bottom circuit assembly has an elastic modulus at least six times the elastic modulus of the top circuit substrate, and has a coefficient of thermal expansion at least two times the coefficient of thermal expansion of the top circuit substrate.

A circuit board is formed from a catalytic laminate having a resin rich surface with catalytic particles dispersed below a surface exclusion depth. Trace channels and apertures are formed into the catalytic laminate, electroless plated with a metal such as copper, filled with a conductive paste containing metallic particles, which are then melted to form traces. In a variation, multiple circuit board layers have channels formed into the surface below the exclusion depth, apertures formed, are electroless plated, and the channels and apertures filled with metal particles. Several such catalytic laminate layers are placed together and pressed together under elevated temperature until the catalytic laminate layers laminate together and metal particles form into traces for a multi-layer circuit board.

A fabrication method achieves bump bonds (to connect two electronic devices) with a pitch of less than 20 m using UV-curable conductive epoxy resin cured with an array of nano-LEDs. Nano-LEDs are devices with sizes less than or equal to 5 m, typically arranged in an array. After deposition of the uncured conductive epoxy layer, the nano-LED array enables a fast curing of the bumps with high spatial resolution. Next, the uncured resin is washed off and the chips are assembled, before final thermal curing takes place.

A microcapsule includes a shell including a conducting component, and a thermally expandable component contained in the shell and having a property of expanding by heating. The shell is deformable in accordance with expansion of the thermally expandable component when the thermally expandable component is heated.

A multi-layer circuit board is formed multiple layers of a catalytic layer, each catalytic layer having an exclusion depth below a surface, where the cataltic particles are of sufficient density to provide electroless deposition in channels formed in the surface. A first catalytic layer has channels formed which are plated with electroless copper. Each subsequent catalytic layer is bonded or laminated to an underlying catalytic layer, a channel is formed which extends through the catalytic layer to an underlying electroless copper trace, and electroless copper is deposited into the channel to electrically connect with the underlying electroless copper trace. In this manner, traces may be formed which have a thickness greater than the thickness of a single catalytic layer.