The thermosetting resin composition for LDS of the invention includes a thermosetting resin, an inorganic filler, a non-conductive metal compound that forms a metal nucleus upon irradiation with active energy rays, and a coupling agent, in which the non-conductive metal compound includes one or more selected from the group consisting of a spinel-type metal oxide, a metal oxide having two or more transition metal elements in groups adjacent to each other, the groups being selected from groups 3 to 12 of the periodic table, and a tin-containing oxide, and the coupling agent includes one or more selected from the group consisting of mercaptosilane, aminosilane, and epoxysilane.

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110 C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than 40 C.

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110 C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than 40 C.

A resin composition contains a polyphenylene ether compound (A) having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in the molecule, a curing agent (B), a titanate compound filler (C), and a silica filler (D), in which the content ratio of the titanate compound filler (C) to the silica filler (D) is 10:90 to 90:10 as a mass ratio.

##STR00001##

In Formula (1), p represents 0 to 10, Ar represents an arylene group, and R.sub.1 to R.sub.3 each independently represent a hydrogen atom or an alkyl group.

##STR00002##

In Formula (2), R.sub.4 represents a hydrogen atom or an alkyl group.

Provided is a bismaleimide composition including: a bismaleimide resin (A) having a structure derived from an aromatic tetracarboxylic acid (a1), a dimer diamine (a2), and a maleic anhydride (a3); and silica particles (B) surface-treated with phenylaminosilane, in which the silica particles (B) have an average particle diameter of 100 nm or less, the silica particles (B) have an maximum aggregation particle size of 20 ?m or less, and a content of the silica particles (B) is 15% by mass or less based on a total solid content of the composition.

The present invention provides a resin composition including: nanoparticles (A) of alumina and/or boehmite having an average particle size of 1.0 nm to 100 nm; fine particles (B) having an average particle size of 0.20 m to 100 m; and a thermosetting resin (C), wherein the nanoparticles (A) have their surfaces treated with a polysiloxane-based modifier.

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecraft and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110 C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than 40 C.

Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110 C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than 40 C.

Provided is a conductor connection structure (10) in which two conductors (21, 31) are electrically connected by a copper connection part (11). The connection part (11) comprises a material containing mainly copper. The connection part (11) also comprises a plurality of holes. An organosilicon compound is present within the holes. The connection part preferably has a structure in which a plurality of gathered particles are melted and bonded together and the particles have a necking section therebetween. In addition, the connection structure (10) preferably has a structure in which a plurality of large copper particles having a relatively large particle size and a plurality of small copper particles having a particle size smaller than that of the large copper particles are melted and bonded together such that the large copper particles and the small copper particles are bonded together, the small copper particles are bonded together, and a plurality of small copper particles are positioned around one large copper particle.

A wiring board includes a substrate including a first surface and a second surface positioned on an opposite side from the first surface. The substrate includes a first layer particle positioned on a surface layer on a first surface side, a second layer particle adjacent to the first layer particle on a second surface side, a metal layer positioned at least between the first layer particle and the second layer particle, a first adhesion layer positioned between the first layer particle and the metal layer and in contact with the first layer particle and the metal layer, and a second adhesion layer positioned between the second layer particle and the metal layer and in contact with the second layer particle and the metal layer.