H05K2201/0245

Stretchable Interconnects for Flexible Electronic Surfaces

A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

Stable PCB for solid state light source application

The invention provides a lighting device (1000) comprising (i) a light source (100) configured to generate light source light (101), wherein the light source (100) comprises a solid state light source, and (ii) a support (200) configured to support the light source (100), wherein the support (200) comprises a metal based thermally conductive material (201), wherein the lighting device (1000) further comprises (iii) a layered element (300), configured in physical contact with the support (200), wherein the layered element (300) comprises one or more layers (310), wherein the layered element (300) at least comprises an electrically insulating first layer (311), wherein at least part of the layered element (300) is configured between the light source (100) and the support (200) such that during operation part of the light source light (101) irradiates the layered element (300), wherein the layered element (300) comprises light reflective particles (410), wherein at least 50 wt. % of the particles have a flake-like shape.

Dry method of metallizing polymer thick film surfaces
10588220 · 2020-03-10 · ·

A method of manufacturing includes bonding a paste material to an organic substrate by a polymer thick film (PTF) process to form a PTF trace, coating a sinterable material over the PTF trace, and sintering the sinterable material to the PTF trace.

Electrical conductors, electrically conductive structures, and electronic devices including the same

An electrical conductor including: a first conductive layer including a plurality of metal nanowires; and a second conductive layer disposed on a surface of the first conductive layer, wherein the second conductive layer includes a plurality of metal oxide nanosheets, wherein in the first conductive layer, a metal nanowire of the plurality of metal nanowires contacts at least two metal oxide nanosheets of the plurality of metal oxide nanosheets, and wherein the plurality of metal oxide nanosheets includes an electrical connection between contacting metal oxide nanosheets.

Identifier-providing device for computer device

A mass produced electrically conductive device with sufficiently high yield, even when forming a conductive layer pattern having an extremely small thickness/minimum area using a minimum amount of silver paste. The identifier-providing device has a conductive layer pattern formed on a rear surface of a base material as an insulator. The silver paste forming the conductive layer pattern contains only silver flakes, as silver particles, that have a particle size in a range of 3.0 to 5.0 m and that has a thickness of 100 nm at a largest thickness portion, while having a thickness of 50 nm at a smallest thickness portion. The conductive layer pattern is formed to have a film thickness of 10 m or less by laminating the silver flakes in the thickness direction. The silver flakes forming the conductive layer are in a fused state or an aggregating/cohering state at the smallest thickness portion.

Dispersing Element, Method for Manufacturing Structure with Conductive Pattern Using the Same, and Structure with Conductive Pattern

A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element (1) contains a copper oxide (2), a dispersing agent (3), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2).


0.0001(reductant mass/copper oxide mass)0.10(1)


0.0050(dispersing agent mass/copper oxide mass)0.30(2)

The dispersing element containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.

Sensor and method for operating sensor

The present invention provides a sensor comprising: a substrate; an antenna pattern formed in a spiral shape on the substrate; first and second electrodes formed on the substrate and spaced apart from each other in parallel; a circuit wiring formed to be connected to each of the first and second electrodes; and an element bonded to the antenna pattern and the circuit wiring, wherein cross sections of the first and second electrodes have a curvature.

Methods, apparatus, and systems for fabricating solution-based conductive 2D and 3D electronic circuits

This work develops a novel microfluidic method to fabricate conductive graphene-based 3D micro-electronic circuits on any solid substrate including, Teflon, Delrin, silicon wafer, glass, metal or biodegradable/non-biodegradable polymer-based, 3D microstructured, flexible films. It was demonstrated that this novel method can be universally applied to many different natural or synthetic polymer-based films or any other solid substrates with proper pattern to create graphene-based conductive electronic circuits. This approach also enables fabrication of 3D circuits of flexible electronic films or solid substrates. It is a green process preventing the need for expensive and harsh postprocessing requirements for other fabrication methods such as ink-jet printing or photolithography. We reported that it is possible to fill the pattern channels with different dimensions as low as 10?10 ?m. The graphene nanoplatelet solution with a concentration of 60 mg/mL in 70% ethanol, pre-annealed at 75? C. for 3 h, provided ?0.5-2 kOhm resistance. The filling of the pattern channels with this solution at a flow rate of 100 ?L/min created a continuous conductive graphene pattern on flexible polymeric films. The amount of graphene used to coat 1 cm.sup.2 of area is estimated as ?10 ?g. A second method regarding the transfer of graphene material-based circuits with small features size (5 ?m depth, 10 ?m width) from any solid surface to flexible polymeric films via polymer solvent casting approach was demonstrated. This method is applicable to any natural/synthetic polymer and their respective organic/inorganic solvents.

Prepreg and metallic clad laminate

A prepreg and a metallic clad laminate are provided. The prepreg includes a reinforcing material and a thermosetting resin layer. The thermosetting resin layer is formed by immersing the reinforcing material in a thermosetting resin composition. The thermosetting resin composition includes a polyphenylene ether resin, a liquid polybutadiene resin, a crosslinker, and fillers. Based on a total weight of the thermosetting resin composition being 100 phr, an amount of the fillers ranges from 50 phr to 70 phr. The fillers include a granular dielectric filler and a flaky thermal conductive filler. The metallic clad laminate is formed by disposing at least one metal layer onto the prepreg.

PATTERNED NANO GRAPHENE PLATELET-BASED CONDUCTIVE INKS
20190380201 · 2019-12-12 · ·

A nano graphene platelet-based conductive ink comprising: (a) nano graphene platelets (preferably un-oxidized or pristine graphene), and (b) a liquid medium in which the nano graphene platelets are dispersed, wherein the nano graphene platelets occupy a proportion of at least 0.001% by volume based on the total ink volume and a process using the same. The ink can also contain a binder or matrix material and/or a surfactant. The ink may further comprise other fillers, such as carbon nanotubes, carbon nano-fibers, metal nano particles, carbon black, conductive organic species, etc. The graphene platelets preferably have an average thickness no greater than 10 nm and more preferably no greater than 1 nm. These inks can be printed to form a range of electrically or thermally conductive components or printed electronic components.