An electronic component having thermal insulation properties and insulation resistance, which is capable of being used for modularization by injection molding or the like. The electronic component has a circuit board on which an electronic element is mounted and a coating layer for coating the surface of the circuit board, wherein the coating layer contains at least a thermoplastic resin and hollow particles; and the coating layer has a concentration gradient of hollow particles in the thickness direction such that the content of the hollow particles in the coating layer is lower on the face side in contact with the circuit board.

A transparent conductor, a method of fabricating the same, and an optical display, the transparent conductor including a base layer; and a conductive layer on the base layer, the conductive layer including metal nanowires and a matrix, wherein the matrix is prepared from a matrix composition, the matrix composition including inorganic hollow particles, a fluorine-containing monomer, or a mixture thereof.

A method of direct printing or writing of a metallic material involves depositing, with a printing device or writing device, an ink comprising of at least undercooled liquid metallic particles dispersed in a carrier fluid. The ink is deposited on any substrate surface to deposit the undercooled liquid metal particles thereon as one or more layers that can form a desired pattern or layered structure.

An electronic device may have housing structures, electrical components, and other electronic device structures. Adhesive may be used to join electronic device structures. Adhesive may be dispensed as liquid adhesive and cured to form adhesive joints. Adhesive joints may be debonded. Chain reactions may be initiated by applying a localized initiator such as a chemical or localized energy to the adhesive. Once initiated, the chain reaction may spread throughout the adhesive to cure the adhesive, to globally change adhesive viscosity, or to weaken the adhesive to facilitate debonding. Local changes to adhesive may also be made such as local increases and decreases to adhesive viscosity. Chain reaction curing may be used to cure adhesive or debond adhesive that is hidden from view within gaps in the electronic device structures. Viscosity changes may be used to control where adhesive flows.

A circuit board may include at least one layer of resin and a plurality of microparticles distributed throughout the at least one layer of resin.

To improve electric characteristics of a dielectric for use for a high frequency band. A dielectric 2 formed by lamination of fluorine resin includes a base main layer 3b containing a base material 3a and made of melting fluorine resin, a pair of base cover layers 3c made of melting fluorine resin and formed on both surfaces of the base main layer 3b, and a pair of functional layers 5 made of fluorine resin mixed with hollow fillers 5a and laminated on the outer surfaces of the base cover layers 3c.

A printed wiring board includes a first conductor layer, a resin insulating layer including inorganic particles and resin, a second conductor layer including a seed layer and an electrolytic plating layer, and a via conductor connecting the first conductor layer and second conductor layer and including the seed layer and electrolytic plating layer extending from the second conductor layer. The inorganic particles include first particles, second particles, third particles and fourth particles formed such that the first and second particles are solid particles, the third and fourth particles are hollow particles, the first and third particles form an inner wall surface of the opening in the resin insulating layer, the second and fourth particles are embedded in the resin insulating layer, the first particles have shapes that are different from shapes of the second particles, and the third particles have shapes that are different from shapes of the fourth particles.