A flake-less molecular ink suitable for printing (e.g. screen printing) conductive traces on a substrate has 30-60 wt % of a C.sub.8-C.sub.12 silver carboxylate or 5-75 wt % of bis(2-ethyl-1-hexylamine) copper (II) formate, bis(octylamine) copper (II) formate or tris(octylamine) copper (II) formate, 0.1-10 wt % of a polymeric binder (e.g. ethyl cellulose) and balance of at least one organic solvent. Conductive traces formed with the molecular ink are thinner, have lower resistivity, have greater adhesion to a substrate than metal flake inks, have better print resolution and are up to 8 times less rough than metal flake inks. In addition, the shear force required to remove light emitting diodes bonded to the traces using Loctite 3880 is at least 1.3 times stronger than for commercially available flake-based inks.

A composite includes a plastic substrate and an electrical insulator layer formed on the plastic substrate. The electrical insulator layer contains boron nitride nanotubes (BNNTs), which may be unmodified or modified BNNTS. The composite is suitable for use in making printed electronic devices. A process includes providing a plastic substrate and forming on at least a portion of a surface of the plastic substrate a layer that contains the BNNTs. A metallic ink trace is formed on a portion of the layer, such that the metallic ink trace is spaced-apart from the substrate. Using photonic or thermal sintering techniques, the metallic ink trace is then sintered.

Applying a solderable surface to conductive ink may include partially curing a conductive ink trace; applying, to the partially cured conductive ink trace, a conductive paste comprising conductive particles; and curing the partially cured conductive ink trace and the conductive paste.

Provided is a bidirectional neural interface having excellent elasticity and electrical conductivity improved by deformation, and further having self-healability and a method of manufacturing the same. The bidirectional neural interface includes a first elastic substrate, a neural electrode disposed on the first elastic substrate and including a conductive polymer composite, and a second elastic substrate disposed on the neural electrode, wherein the conductive polymer composite includes a matrix formed of a self-healing polymer material, and a plurality of electrical conductor clusters distributed in the matrix, wherein each of the electrical conductor clusters includes particles of a first electrical conductor, and a plurality of particles of a second electrical conductor formed of the same material as that of the first electrical conductor, distributed around each of the particles of the first electrical conductor and having smaller sizes than sizes of the particles of the first electrical conductor.

A method for selective metallization includes: selectively adsorbing catalytic nanoparticles onto an imprint mold to form a selectively adsorbed catalytic nanoparticle (SACN) mold; using the SACN mold in an imprinting process to synchronously transfer a pattern and the catalytic nanoparticles onto a film; separating the film from the SACN mold; and selectively depositing metal onto the film based on the pattern transferred to the film.

[Summary]

The present invention relates to a multilayered printed circuit board having excellent durability while having a thin thickness, a method for manufacturing the same, and a semiconductor device using the same.

The present invention provides a bio-electrode composition including: a resin containing a urethane bond in a main chain and a silsesquioxane in a side chain; and an electro-conductive material, wherein the electro-conductive material is a polymer compound having one or more repeating units selected from fluorosulfonic acid salts shown by the following general formulae (1)-1 and (1)-2, sulfonimide salts shown by the following general formula (1)-3, and sulfonamide salts shown by the following general formula (1)-4. This can form a living body contact layer for a bio-electrode that is excellent in electric conductivity and biocompatibility, light in weight, manufacturable at low cost, and free from large lowering of the electric conductivity even when it is wetted with water or dried. The present invention also provides a bio-electrode in which the living body contact layer is formed from the bio-electrode composition, and a method for manufacturing the bio-electrode. ##STR00001##

Provided is an ink for use in manufacturing electronic components via inkjet printing, the ink being capable of stably maintaining silver nanoparticle dispersibility for extended periods, even in the presence of oxygen, and can be sintered to obtain a sintered body exhibiting superior electrical conductivity. The ink according to the present invention is an inkjet printing ink comprising surface-modified silver nanoparticles (A) and a dispersion solvent (B), wherein the (A) are surface-modified silver nanoparticles having a configuration in which surfaces of the silver nanoparticles are coated with a protective agent containing an amine; an amount of the (A) (in terms of silver) is not less than 30 wt. % of the ink; and the (B) comprises a secondary alcohol and/or a tertiary alcohol (b-1), and a hydrocarbon (b-2), wherein a total amount of the (b-1) and the (b-2) is not less than 70 wt. % of a total amount of the dispersion solvent (B).

A resin film according to one aspect of the present invention is a resin film having polyimide as a main component, the resin film including a modified layer formed in a depth direction from at least one side of the resin film; and a non-modified layer other than the modified layer, wherein a ring-opening rate of an imide ring of the polyimide in the modified layer is higher than a ring-opening rate of an imide ring of the polyimide in the non-modified layer, and an average thickness of the modified layer from the one side of the resin film is greater than or equal to 10 nm and less than or equal to 500 nm.

A base material for a printed circuit board includes: an insulating base film; a sintered layer that is layered on at least one side surface of the base film and that is formed of a plurality of sintered metal particles; an electroless plating layer that is layered on a surface of the sintered layer that is opposite to the base film; and an electroplating layer that is layered on a surface of the electroless plating layer that is opposite to the sintered layer, wherein an arithmetic mean height Sa of the surface of the electroless plating layer opposite to the sintered layer is greater than or equal to 0.001 m and less than or equal to 0.5 m.