The present disclosure provides a composite conductive substrate exhibiting enhanced properties both in the folding endurance and the electric conductivity and a method of manufacturing the composite conductive substrate. A composite conductive substrate according to an exemplary embodiment of the present disclosure includes: an insulating layer; a metal nanowire structure embedded beneath one surface of the insulating layer; and a metal thin film coupled to the metal nanowire structure. The composite conductive substrate may be fabricated in an order of the insulating film, the metal nanowire structure, and the metal thin film, or vice versa.

A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

A metal-on-ceramic substrate comprises a ceramic layer, a first metal layer, and a bonding layer joining the ceramic layer to the first metal layer. The bonding layer includes thermoplastic polyimide adhesive that contains thermally conductive particles. This permits the substrate to withstand most common die attach operations, reduces residual stress in the substrate, and simplifies manufacturing processes.

The present invention relates to an ultra large area nanowire transparent electrode, including a transparent insulating substrate, and a metal nanowire network, wherein R.sub.m denoting an average sheet resistance of a nanowire transparent electrode having a width of 10 cm and a length of 2 m is 55 Ω/sq., or less, and each sheet resistance in 500 divided regions defined by evenly dividing the entire region of the nanowire transparent electrode having a width of 10 cm and a length of 2 m into an area of 2 cm×2 cm satisfies 0.5R.sub.m to 1.5R.sub.m.

Disclosed is a silver nanowire patterning method including patterning an adhesive conductive polymer thin-film on a substrate, fabricating a polydimethylsiloxane (PDMS) stamp coated with a silver nanowire thin-film, and bonding the substrate patterned with the conductive polymer thin-film to the PDMS stamp coated with the silver nanowire thin-film and then separating the two bonded substrates.

A halogen-free low dielectric resin composition is provided. The halogen-free low dielectric resin composition includes: (A) a polyphenylene ether which has an unsaturated functional group; (B) a cross-linking agent which has an unsaturated functional group; and (C) a phosphorus-containing compound represented by the following formula (I), ##STR00001##

Embodiments of the present technology are directed at systems and methods for impregnating PCBs with CNT traces to create functional CNT-based PCBs. The functional CNT-based PCBs exhibit high structural stability and improved electrical and thermal properties. Based on fixed impregnation and densification techniques, perfect or near-perfect alignment of CNT traces on the PCB substrates is achieved. For example, application of the disclosed technology results in traces of CNTs aligned on a PCB substrate in parallel to one another in a butt-jointed arrangement from end-to-end of the PCB substrate. Advantageously, the disclosed methods eliminate occurrence of misorientation or misalignment of the CNT traces. Sensors and electrical/electronic devices built with PCBs using CNT traces provide significant advances for SWaP (reduced Size, Weight, and Power consumption).

The present invention relates to the production of a layer structure, comprising the following process steps: i) coating a substrate with a composition at least comprising silver nanowires and a solvent; ii) at least partial removal of the solvent, thereby obtaining a substrate that is coated with an electrically conductive layer, the electrically conductive layer at least comprising the silver nanowires; iii) bringing into contact selected areas of the electrically conductive layer with an etching composition, thereby reducing the conductivity of the electrically conductive layer in these selected areas, wherein the etching composition comprises an organic compound capable of releasing chlorine, bromine or iodine, a compound containing hypochloride, a compound containing hypo-bromide or a mixture of at least two of these compounds. The invention also relates to a layer structure obtainable by this method, a layer structure, the use of a layer structure, an electronic component and the use of an organic compound.

The device intended to be thermoformed comprises a substrate capable of being thermoformed and an electrically conductive member integral with the said substrate. The electrically conductive member comprises: electrically conductive particles, an electrically conductive material, electrically conductive elements of elongated shape. The electrically conductive material has a melting point which is strictly less than the melting point of the electrically conductive particles and than the melting point of the elements of elongated shape.

The devices and methods described herein push forward the resolution limits of directed self-assembly (DSA) technology for advanced device applications. Specifically described herein, are compositions of bioinspired DSA materials and methods using these bioinspired DSA materials to form sub-7 nm line-space patterns and to achieve functional nanoscopic structures, e.g., conducting nanowires on a substrate.