A foil structure with electrical functionality and external contacting includes a region containing an electrical transmission path and a contacting region for the external contacting of the electrical transmission path. At least one electrically conductive layer, which is provided with a material mixture of silver and carbon, is contained in the contacting region of the foil structure. The electrically conductive layer can be extended from the contacting region of the foil structure into the region containing the electrical transmission path and can form the electrical transmission path. The electrically conductive layer can be disposed on a conductor track in the contacting region. The electrically conductive layer is mechanically and climatically stable by virtue of the mixture of silver and carbon.

A signal attenuation reduction structure for a flexible circuit board includes at least one conductive paste coating zone formed on surfaces of signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to at least one signal line or covers a plurality of signal lines. A resin-based conductive adhesive layer is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The resin-based conductive adhesive layer is pressed to bond between the conductive paste coating zone and a top insulation layer such that the conductive paste coating zone and the resin-based conductive adhesive layer achieve electrical connection therebetween.

An object of the present invention is to provide a thermosetting material capable of forming a reinforcing member with which a flexible printed circuit board can be reinforced at a level high enough to prevent, for example, detachment of components even without using a reinforcing metal plate, which increases the thickness of an electronic device or the like. The present invention relates to a thermosetting material used for reinforcing a flexible printed circuit board. The thermosetting material has a modulus of tensile elasticity (1) of 50 to 2,500 MPa at 25 C. A heat-cured product of the thermosetting material has a modulus of tensile elasticity (2) of 2,500 MPa or more at 25 C.

An anisotropic conductive film which suppresses occurrence of short circuit at the time of anisotropic conductive connection, prevents reduction in capturing capability of electrically conductive particles, enables favorable pushing of electrically conductive particles and exhibits not only favorable initial conductivity but also favorable conduction reliability, contains a first electrically conductive particle group and a second electrically conductive particle group, each including a plurality of electrically conductive particles, in an insulating binder. The first electrically conductive particle group and the second electrically conductive particle group are present in a first region and a second region, respectively, which differ from each other in the thickness direction of the anisotropic conductive film and are parallel to the plane direction. Moreover, the first electrically conductive particle group and the second electrically conductive particle group differ from each other in an existence state of the electrically conductive particles.

According to embodiments of the present invention, an ink composition is provided. The ink composition includes a plurality of nanostructures distributed in at least two cross-sectional dimension ranges, wherein each nanostructure of the plurality of nanostructures is free of a cross-sectional dimension of more than 200 nm. According to further embodiments of the present invention, a method for forming a conductive member and a conductive device are also provided.

A conductive paste contains at least a conductive powder, glass frit, and an organic vehicle. The conductive powder contains a noble metal powder such as an Ag powder and a base metal powder containing Cu and/or Ni, and the base metal powder has a specific surface area of less than 0.5 m.sup.2/g. The content of the base metal powder with respect to the total amount of the conductive powder is, in ratio by weight, 0.1 to 0.3 when the base metal powder contains Cu as its main constituent, 0.1 to 0.2 when the base metal powder contains Ni as its main constituent, and 0.1 to 0.25 when the base metal powder contains a mixed powder of Cu and Ni as its main constituent.

The device intended to be thermoformed comprises a substrate capable of being thermoformed and an electrically conductive member integral with the said substrate. The electrically conductive member comprises: electrically conductive particles, an electrically conductive material, electrically conductive elements of elongated shape. The electrically conductive material has a melting point which is strictly less than the melting point of the electrically conductive particles and than the melting point of the elements of elongated shape.

A solder paste including a metal component consisting of a first metal powder and a second metal powder having a melting point higher than that of the first metal, and a flux component. The first metal is Sn or an alloy containing Sn, the second metal is one of (1) a CuMn alloy in which a ratio of Mn to the second metal is 5 to 30% by weight and (2) a CuNi alloy in which a ratio of Ni to the second metal is 5 to 20% by weight, and a ratio of the second metal to the metal component is 36.9% by volume or greater.

A sheet-fed system designed to print multilayer PCBs is introduced. The system consists of four main blocks; a drilling station, a patterning station, a stacking/bonding station, and a sintering zone. The substrate PCB is shuttled between these various stations, to have vias drilled, to be attached to stacks of previously-processed layers, to be covered with conductive paths by means of the aforementioned ink, and to have the ink sintered under a controlled temperature and atmosphere. Patterning is accomplished by means of a novel two-step method involving both high-temperature conductive elements, low-temperature conductive elements, and flux. Two such compositions are successively applied and individually sintered to form a single conductive path; the second application serves to fill the porosities of the first layer. By this method, a highly-conductive trace is obtained without requiring high temperatures, which in turn allows use of common substrates including polymers.

An object of the present disclosure is to provide a paste that can suppress fluctuations in viscosity at a printing temperature to perform printing without unevenness, and is sintered fast even in an inert gas atmosphere such as nitrogen to form a highly accurate conductive wiring and a joined structure excellent in joining strength. The present disclosure provides an adhesive conductive paste for forming a conductive wiring and/or a joined structure to connect electronic elements, the adhesive conductive paste including a conductive particle and a solvent. The adhesive conductive paste contains, as the conductive particle, a silver particle (A) having an average particle size of 1 nm or greater and less than 100 nm and a silver particle (B) having an average particle size of 0.1 m or greater and 10 m or less, the silver particle (A) being a silver nanoparticle having a configuration in which a surface is coated with a protective agent containing amine, and the adhesive conductive paste contains, as the solvent, a compound (C) represented by Formula (I) below:
R.sup.aO(XO).sub.nR.sup.b(I) where in Formula (I), R.sup.a represents a monovalent group selected from a hydrocarbon group having from 1 to 6 carbon atom(s) and an acyl group, X represents a divalent group selected from a hydrocarbon group having from 2 to 6 carbon atoms, R.sup.b represents a hydrogen atom or a monovalent group selected from a hydrocarbon group having from 1 to 6 carbon atom(s) and an acyl group, R.sup.a and R.sup.b may be the same, n represents an integer from 1 to 3.