A multilayer wiring board includes first and second insulating layers, a first conductive wiring layer on the first insulating layer, a second conductive wiring layer on a surface the second insulating layer facing the first insulating layer, an interlayer connection conductor including an intermetallic compound and penetrating through the first insulating layer to interconnect the first and second conductive wiring layers, a first intermetallic compound layer between the first conductive wiring layer and the interlayer connection conductor, and a second intermetallic compound layer between the second conductive wiring layer and the interlayer connection conductor, wherein the intermetallic compounds in the first and second intermetallic compound layers have a composition different from that of the intermetallic compound in the interlayer connection conductor, and the first intermetallic compound layer at a level different from a level of an interface between the first conductive wiring layer and the first insulating layer.

This application discloses a circuit board and a manufacturing method thereof, and a terminal device, and relates to the technical field of terminals, to resolve the problem of low reliability of connection between a radio frequency front-end circuit and a radio frequency back-end circuit in a circuit board of a terminal device in a related technology. The circuit board includes a substrate and a liquid metal body, where the substrate is provided with a radio frequency front-end circuit, a radio frequency back-end circuit, and a pad group, where the pad group includes a first pad electrically connected to the radio frequency front-end circuit and a second pad electrically connected to the radio frequency back-end circuit, and the second pad is spaced apart from the first pad; and the liquid metal body is arranged at a position of the pad group and connects the first pad to the second pad, so as to electrically connect the radio frequency front-end circuit to the radio frequency back-end circuit. This application may be applied to a terminal device such as a mobile phone.

A film shielding against electromagnetic interference comprises an insulating layer, a silver layer, and a conductive adhesive layer. The insulating layer is made of polyimide. The metal layer is formed on the insulating layer. The conductive adhesive layer is coated on the metal layer and is very thin but renders the film less prone to bubbling and rupturing when in place.

A method of manufacturing a printed wiring assembly PWA on a substrate, includes the following steps: receiving assembly data associated with said PWA; dispensing, onto said substrate, and in accordance with the assembly data, a conductive ink; curing the dispensed conductive ink; reducing, by plasma treatment, the cured conductive ink; depositing a solder material on top of at least a portion of the reduced conductive ink; picking and placing, in accordance with the assembly data, one or more components on the deposited solder material; and performing reflow soldering, by heating, of the deposited solder material, the one or more placed components, and the reduced conductive ink, forming an intermetallic compound therebetween.

A method is disclosed for applying an electrical conductor to a solar cell, which comprises providing a flexible membrane with a pattern of groove formed on a first surface thereof, and loading the grooves with a composition comprising conductive particles. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back of a solar cell. A pressure is then applied between the solar cell and the membrane(s) so that the composition loaded to the grooves adheres to the solar cell. The membrane(s) and the solar cell are separated and the composition in the groove is left on the solar cell surface. The electrically conductive particles in the composition are then sintered or otherwise fused to form a pattern of electrical conductor on the solar cell, the pattern corresponding to the pattern formed in the membrane(s).

A method is disclosed for applying an electrical conductor to an electrically insulating substrate, which comprises providing a flexible membrane with a pattern of groove formed on a first surface thereof, and loading the grooves with a composition comprising conductive particles. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back of the substrate. A pressure is then applied between the substrate and the membrane(s) so that the composition loaded to the grooves adheres to the substrate. The membrane(s) and the substrate are separated and the composition in the groove is left on the surface of the electrically insulating substrate. The electrically conductive particles in the composition are then sintered to form a pattern of electrical conductors on the substrate, the pattern corresponding to the pattern formed in the membrane(s).

An apparatus is disclosed for transferring a pattern of a composition containing particles of an electrically conductive material and a thermally activated adhesive from a surface of a flexible web to a surface of a substrate. The apparatus comprises: respective drive mechanisms for advancing the web and the substrate to a nip through which the web and the substrate pass at the same time and where a pressure roller acts to press the surfaces of the web and the substrate against one another, a heating station for heating at least one of the web and the substrate prior to, or during, passage through the nip, to a temperature at which the adhesive in the composition is activated, a cooling station for cooling the web after passage through the nip, and a separating device for peeling the web away from the substrate after passage through the cooling station, to leave the pattern of composition adhered to the surface of the substrate.

The invention relates to a method of manufacturing an electronic device. The method comprises the steps of: preparing a substrate comprising an electrically conductive layer; applying a conductive paste on the electrically conductive layer; wherein the conductive paste comprises 100 parts by weight of a metal powder, 5 to 20 parts by weight of a solvent, and 0.07 to 3 parts by weight of a branched higher fatty acid; mounting an electrical component on the applied conductive paste; and heating the conductive paste to bond the electrically conductive layer and the electrical component. The invention also provides the conductive paste.

This application discloses a circuit board and a manufacturing method thereof, and a terminal device, and relates to the technical field of terminals, to resolve the problem of low reliability of connection between a radio frequency front-end circuit and a radio frequency back-end circuit in a circuit board of a terminal device in a related technology. The circuit board includes a substrate and a liquid metal body, where the substrate is provided with a radio frequency front-end circuit, a radio frequency back-end circuit, and a pad group, where the pad group includes a first pad electrically connected to the radio frequency front-end circuit and a second pad electrically connected to the radio frequency back-end circuit, and the second pad is spaced apart from the first pad; and the liquid metal body is arranged at a position of the pad group and connects the first pad to the second pad, so as to electrically connect the radio frequency front-end circuit to the radio frequency back-end circuit. This application may be applied to a terminal device such as a mobile phone.

A stretchable mounting board that includes: a stretchable substrate; a mounting electrode portion on a main surface side of the stretchable substrate and containing a conductive filler and a resin; a solder portion connected to the mounting electrode portion; and an electronic component electrically connected to the mounting electrode portion with the solder portion interposed therebetween. The mounting electrode portion has a first main surface on a stretchable substrate side thereof, a second main surface on a solder portion side thereof, a first region including the first main surface, and a second region including the second main surface, and wherein, in a cross-section along a thickness direction of the mounting electrode portion passing through the first region and the second region, a sectional area of the conductive filler in the second region is larger than a sectional area of the conductive filler in the first region.