The carrier-foil-attached ultra-thin copper foil according to one embodiment of the present invention comprises a carrier foil, a release layer, a first ultra-thin copper foil, a Cu—Al bonding strength improvement layer, an Al layer, and a second ultra-thin copper foil, wherein the release layer may comprise a first metal (A3) having peeling properties, and a second metal (B3) and third metal (C3) facilitating the plating of the first metal (A3).

A method for manufacturing a wiring board includes preparing a core substrate having first and second surfaces, forming a first build-up structure including interlayer insulating layers and conductor layers on the first surface of the substrate, and forming a second build-up structure including interlayer insulating layers and one or more conductor layers on the second surface of the substrate. The forming of the first structure includes laminating the insulating layers and metal layers on first surface side of the substrate and forming the conductor layers from all of the metal layers on the first surface side, and the forming of the second structure includes laminating the insulating layers and metal layers on second surface side of the substrate, forming the one or more conductor layers from one or more of the metal layers on the second surface side, and entirely removing the other metal layers on the second surface side.

A power supply device includes a main unit and a power switching module. The main unit includes a primary circuit board, a transformer including a primary and a secondary coil, a primary-side circuit and a secondary-side circuit. The power switching module includes a separate PCB formed with at least two connection pads and two conductive tracks, and at least one power switching element disposed on the PCB and having two terminals respectively connected to the two connection pads through the two conductive tracks. The power switching module is in the form of a separate PCB that is electrically connected to the primary- or secondary-side circuits through the two connection pads.

Provided is a copper foil provided with a carrier in which the laser hole-opening properties of the ultrathin copper layer are good and which is suitable for producing a high-density integrated circuit substrate. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein the specular gloss at 60° in an MD direction of the intermediate layer side surface of the ultrathin copper layer is 140 or less.

A FPCB/FCCL replacing a tinned-copper welding strip as a photovoltaic module bus bar is a composite material including an insulating base material and a conductive layer, and the insulating base material is made from PI or PET, and the conductive layer is generally the copper foil. According to the present invention, when the flexible solar module adopts the FPCB/FCCL to replace the tinned-copper welding strip as the photovoltaic module bus bar, the product quality and product stability are greatly improved, and the FPCB/FCCL bus bar is also suitable for the double-glass solar module and the single-glass solar module. The copper foil of FPCB/FCCL may be integrated with circuits, or be the complete copper foil (without circuits), or the copper foil of FPCB/FCCL may simultaneously has the part with circuits and the part without circuits.

There is provided a metal-clad laminate in which the transmission loss of electrical signals can be reduced, a finer pitch of a circuit pattern is possible, a high precision and fine circuit can be formed, and the close adhesiveness of the metal film is excellent. The metal-clad laminate includes a coating film and a metal film laminated on a base material film in this order, wherein the metal film is a metal film formed by at least any formation method of plating, sputtering, and vapor deposition, and a surface roughness (Rz) of the coating film is 1 μm or less.

The present disclosure discloses a flexible circuit board and a speaker. The flexible circuit includes a substrate, a first cover film attached to a side of the substrate and including at least a silica gel layer, a second cover film attached to the other side of the substrate, and a copper foil layer sealed between the substrate and the first cover film or between the substrate and the second cover film. Compared with the related art, the flexible circuit disclosed by the present disclosure has a higher strength.

The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm.sup.2 of Ni and said Cr layer containing 10-100 μg/dm.sup.2 of Cr is provided.

According to this invention, an oriented copper plate which has a highly developed cube texture and has strength and breaking elongation greater than those of a conventional material having a cube texture, a copper-clad laminate, a flexible circuit board that is excellent in terms of folding flexibility, and an electronic device are provided, and a process for producing the oriented copper plate is established. This invention relates: an oriented copper plate, which contains 0.03% by mass to 1.0% by mass of Cr, the remainder of which is composed of copper and inevitable impurities, wherein the copper plate has a <100> main orientation so that the area percentage of a <100> preferred orientation region is not less than 60.0%, the region satisfying a condition that allows each of a thickness direction of the copper plate and a specific in-plane direction of the copper plate to have an orientation difference of not more than 15° with respect to a <100> basic copper crystal axis of unit lattice of copper, and wherein Cr precipitates having equivalent circle diameters of 4 nm to 52 nm are present at 300 precipitates/μm.sup.3 to 12000 precipitates/μm.sup.3; a copper-clad laminate and a flexible circuit board using the copper plate; and an electronic devices equipped with the flexible circuit board.

A support substrate (1), in particular a metal-ceramic substrate, as a support for electric components, comprising: —at least one metal layer (10) and—an insulating element (30), in particular a ceramic element, a glass element, a glass ceramic element, and/or a high temperature-resistant plastic element. The at least one metal layer (10) and the insulating element (30) extend along a main extension plane (HSE) and are arranged one over the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), wherein in a completed support substrate (1), a binding layer (12) is formed between the at least one metal layer (10) and the insulating element (30), and an adhesive layer (13) of the binding layer (12) has a surface resistance which is greater than 5 Ohm/sq.