A printed wiring board for camera module includes: first and second mounting regions for first and second image pickup devices respectively provided on one and the other sides in a front surface of the printed wiring board, the first and second mounting regions respectively provided with first and second conductive patterns configured to be electrically connected to the first and second image pickup devices, respectively, and a component mounting region provided between the first mounting region and the second mounting region, the component mounting region provided with a third conductive pattern, the third conductive pattern configured to be electrically connected to a signal processing component, amounting density of the third conductive pattern in the component mounting region being higher than that of the first conductive pattern in the first mounting region or a mounting density of the second conductive pattern in the second mounting region, in a plan view.

An enhanced prepreg for printed circuit board (PCB) laminates includes a substrate and a resin applied to the substrate. The resin includes a curable polymer and a polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species. This resin composition eliminates possible volatile loss of the free radical initiator during all processing steps in the preparation of PCB laminates. The resin may additionally include a cross-linking agent, flame retardant and viscosity modifiers. In one embodiment, a sheet of woven glass fibers is impregnated with the resin and subsequently dried or cured. The glass cloth substrate may include a silane coupling agent to couple the resin to the substrate. In another embodiment, resin coated copper (RCC) is prepared by applying the resin to copper and subsequently curing the resin.

The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer provided on the surface of the copper foil is favorably suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is favorably suppressed. The surface treated copper foil, comprising a copper foil, and a roughening treatment layer on at least one surface of the copper foil, wherein a surface of the side of the roughening treatment layer of the surface treated copper foil satisfies one or more selected from the following items (1-1) to (1-8), and (1-1) a roughness Ra is 0.08 to 0.20 m, (1-2) a roughness Rz is 1.00 to 2.00 m, (1-3) a roughness Sq is 0.16 to 0.30 m, (1-4) a roughness Ssk is 0.6 to 0.35, (1-5) a roughness Sa is 0.12 to 0.23 m, (1-6) a roughness Sz is 2.20 to 3.50 m, (1-7) a roughness Sku is 3.75 to 4.50, (1-8) a roughness Spk is 0.13 to 0.27 m,
a glossiness of a TD of the surface of the side of the roughening treatment layer of the surface treated copper foil is 70% or less.

The invention provides a surface treated copper foil with which transmission loss is favorably suppressed even if the surface treated copper foil is used for a high frequency circuit board.

A surface treated copper foil has a surface treated layer formed on at least one surface, the total deposition amount of Co, Ni, and Mo is 1000 g/dm.sup.2 or less in the surface treated layer, the surface treated layer includes a particle having three or more projections, the number of the particles per m.sup.2 in the surface treated layer is 0.4 or more, and the surface roughness Rz on a side of the surface treated layer measured by a contact type roughness meter is 1.3 m or less.

A circuit board according to an embodiment includes an insulating layer; and a circuit pattern disposed on the insulating layer, wherein the circuit pattern includes a copper foil layer disposed on the insulating layer, a first plating layer disposed on the copper foil layer, and a second plating layer disposed on the first plating layer, and wherein the copper foil layer has a thickness in a range of 2 ?m to 5 ?m.

There is provided a resin-coated copper foil including a resin layer having excellent dielectric characteristics suitable for high frequency applications, exhibiting high interlayer adhesion and heat resistance in the case where the resin layer is used in a copper-clad laminate or printed circuit board. The resin-coated copper foil of the present invention includes a copper foil and a resin layer on at least one side of the copper foil. The resin layer comprises a resin mixture containing an epoxy resin, a polyimide resin, and an aromatic polyamide resin; and an imidazole curing catalyst.

A resin composition of the present invention contains: a maleimide compound (A) having a transmittance of 5% or more at a wavelength of 405 nm (h-line); a particular carboxylic acid containing compound (B); and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).

A method of producing at least one connection carrier includes: A) providing a carrier plate with a planar top face; B) applying at least one electrically insulating insulation strip to the top face and cohesively connecting the carrier plate and the insulation strip; and C) applying at least one electrically conductive conductor strip to an adhesive surface of the insulation strip and cohesively connecting the insulation strip and the conductor strip, wherein the conductor strip and the carrier plate are electrically insulated from one another by the insulation strip.

A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f.sub.3t.sub.3)/(f.sub.2t.sub.2)=>1 wherein t.sub.2 (mm) is a thickness of the copper foil, f.sub.2 (MPa) is a stress of the copper foil under tensile strain of 4%, t.sub.3 (mm) is a thickness of the resin layer, f.sub.3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2: 1<=33f.sub.1/(FT) wherein f.sub.1 (N/mm) is 180 peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite, wherein a Cr oxide layer is formed at an coating amount of 5 to 100 g/dm.sup.2. is formed on a surface of the copper foil on which the resin layer is not laminated.

The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 pm to 3.0 pm and a lightness value of not more than 30 on one surface of an electrolytic copper foil (A), and form a layer of a resin composition (B) containing a block copolymerized polyimide resin (a) having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.