A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.

An example apparatus includes a first printed circuit board (PCB) having a power layer, a ground layer, and a slot. The slot includes a first power electrical contact that is electrically connected to the power layer and a first ground electrical contact that is connected to the ground layer. The slot extends orthogonally or obliquely through multiple layers of the first PCB. A second PCB includes a second power electrical contact, a second ground electrical contact, and capacitors electrically connected between the second power electrical contact and the second ground electrical contact. The second PCB is configured for insertion into the slot to form an electrical connection between the first power electrical contact and the second power electrical contact and between the first ground electrical contact and the second ground electrical contact.

A conductive bump electrode structure includes a substrate, an elastic circuit layer, at least two conductive bumps, and an insulating layer. The elastic circuit layer is mounted on the substrate, and includes at least one elastic circuit. The at least two conductive bumps are mounted on the elastic circuit layer, and are electrically connected to each other through the at least one elastic circuit. The insulating layer is mounted on the elastic circuit layer, and includes at least two holes. Since there is a gap between the conductive bumps, the conductive bump electrode structure is easy to be bent and fit body curves of various parts of a user. The elastic circuit can stretch or compress along with the user's movement due to its elasticity, thereby increasing suitability of the conductive bump electrode structure to the human body.

A wiring substrate includes a resin insulating layer, a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer, a conductor pad formed on the resin insulating layer and connected to the via conductor, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post formed on the conductor pad and protruding from the coating insulating layer. The via conductor is formed such that the via conductor is increased in diameter toward the conductor pad, and the metal post is formed such that the metal post is increased in diameter toward the conductor pad.

A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.

Example human-machine interface (HMI) assemblies are disclosed. An example human-machine interface assembly can include a fascia. The human-machine interface assembly can further include a printed circuit board (PCB). The printed circuit board can have a light emitting diode (LED) to emit light through the fascia. The human-machine interface assembly can further include a backer that can be attached to the fascia.

An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals.

A circuit board includes a board body, a first electrode, and a second electrode. The board body contains a resin material. The first electrode is disposed on a first main surface of the board body and includes a first electrode base and a first coating film that covers at least a part of an outer surface of the first electrode base. The second electrode is disposed on the first main surface of the board body and includes a pillar-shaped structure that includes a second electrode base, a first plating film that is disposed on the second electrode base, and a first plating structure having a first end directly connected to the first plating film, and a second coating film that covers at least a part of an outer surface of the pillar-shaped structure.

A circuit board including a substrate, a patterned conductive layer, a patterned insulating layer, a conductive terminal, and a dummy terminal is provided. The patterned conductive layer is disposed on the substrate. The patterned insulating layer is disposed on the substrate and at least covers a portion of the patterned conductive layer. The conductive terminal is disposed on the patterned conductive layer and has a first top surface. The dummy terminal is disposed on the patterned conductive layer and has a second top surface. A first height between the first top surface and the substrate is greater than a second height between the second top surface and the substrate.

A contacting device for resiliently contacting a printed circuit board with a contact element for a solenoid or a sensor for a vehicle system, including a contacting apparatus, including: a helical spring element, which is formed such that it can be clamped in between the printed circuit board and the contact element; and a printed-circuit-board fastening element with a fastening surface and a centering surface opposite the fastening surface, wherein the fastening surface is formed such that it is fastened or can be fastened on the printed circuit board and, in an operating state of the contacting device, at least one portion of the centering surface is arranged so as to protrude into an interior-space portion of an interior space of the spring element in order to guide and/or to center the spring element. Also described are a related vehicle system, a method, a device, and a storage medium.