Lighting device for a motor vehicle including a light source and/or an optical part. A substrate including electrical tracks, the light source and/or optical part being fastened to the substrate, and a part forming an electrical ground for the electrical tracks. The substrate includes a cut-out forming a tab, electrical tracks of the substrate extending onto the tab, at least one of the tracks on the tab making electrical contact with the ground-forming part.

Example human-machine interface (HMI) assemblies are disclosed. One example HMI assembly includes a fascia, a touch film having a first raised contact, a PCB having a second raised contact, and a piercing member passing through the first and second contacts to electrically couple the first and second contacts.

A connection arrangement for forming a component carrier structure is disclosed. The connection arrangement includes a first electrically conductive connection element and a second electrically conductive connection element. The first connection element and the second connection element are configured such that, upon connecting the first connection element with the second connection element along a connection direction, a form fit is established between the first connection element and the second connection element that limits a relative motion between the first connection element and the second connection element in a plane perpendicular to the connection direction. A component carrier and a method of forming a component carrier structure are also disclosed.

A display device according to an embodiment includes a first substrate including a connection line; a second substrate facing the first substrate; and a connection pad connected to a side of surface of the first substrate and a side surface of the second substrate, wherein the connection pad includes a first portion contacting the side of the first substrate and the side surface of the second substrate, and a second portion that is disposed in each of the first substrate and the second substrate and contacting the connection wiring.

A contacting device for resiliently contacting a printed circuit board with a contact element for a solenoid or a sensor for a vehicle system, including a contacting apparatus, including: a helical spring element, which is formed such that it can be clamped in between the printed circuit board and the contact element; and a printed-circuit-board fastening element with a fastening surface and a centering surface opposite the fastening surface, wherein the fastening surface is formed such that it is fastened or can be fastened on the printed circuit board and, in an operating state of the contacting device, at least one portion of the centering surface is arranged so as to protrude into an interior-space portion of an interior space of the spring element in order to guide and/or to center the spring element. Also described are a related vehicle system, a method, a device, and a storage medium.

A circuit board utilizing thermocouples for improved heat dissipation performance from circuit boards includes a heat dissipation module which itself includes a first circuit substrate, a thermocouple, and a second circuit substrate. The first circuit substrate includes a first wiring layer comprising first and second wiring portions. The thermocouple includes a P-type and an N-type semiconductor. The second circuit substrate includes a second wiring layer with a third wiring portion. Conductive members electrically connect the P-type semiconductor with the first wiring portion, connect the P-type semiconductor with the third wiring portion, connect the N-type semiconductor with the second wiring portion, and connect the N-type semiconductor with the third wiring portion, to transfer away heat generated by working elements mounted on the board.

There is provided a printed circuit board in which an amount of molten solder adhering over electrodes adjacent to each other is increased in flow soldering. The printed circuit board according to the present invention includes: a first insulating substrate (6) having a mounting hole (15) that penetrates through the first insulating substrate (6) from a first surface (6a) to a second surface (6b); a second insulating substrate (18) including a connection portion (23a) that penetrates through the mounting hole (15) from the first surface (6a) side and protrudes from the second surface (6b); first electrodes (7 and 9) that are provided on the second surface (6b) and are arranged at an edge of the mounting hole (15); and second electrodes (19 and 25) provided on the connection portion (23a). The first electrodes (7 and 9) and the second electrodes (19 and 25) are joined by solder. The printed circuit board further includes a coating film (31) that is disposed at least on a front end side of the connection portion (23a) than a portion where the second electrodes (19 and 25) are joined to the first electrodes (7 and 9) by the solder.

To provide a surface-treated copper foil that can favorably decrease the transmission loss even used in a high frequency circuit board, and has improved acid resistance. A surface-treated copper foil containing a copper foil, and a surface treatment layer containing a roughening treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains Ni, the surface treatment layer has a content ratio of Ni of 8% by mass or less (excluding 0% by mass), and an outermost surface of the surface treatment layer has a ten-point average roughness Rz of 1.4 μm or less.

Described herein is a multilayer flex circuit having a first dual flex circuit and a second dual flex circuit where each one comprises an outer metal layer, a base insulation layer, and an inner metal layer. The base insulation layer is disposed between the outer metal layer and the inner metal layer. The inner metal layer of the first dual flex circuit is configured to face toward the inner metal layer of the second dual flex circuit. The multilayer flex circuit also includes a coupling layer that adhesively couples the inner metal layer of the first dual flex circuit to the inner metal layer of the second dual flex circuit. The multilayer flex circuit also comprises an electrically conductive material that electrically connects the inner metal layer of the second dual flex circuit to the inner metal layer of the first dual flex circuit.

A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.