A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.

A connector includes a flexible connector having a first plurality of solder bumps arranged in a first pattern, and a base connector having a second plurality of solder bumps arranged in a second pattern concentric with and of a different size than the first pattern. A method of interconnecting a flexible connector to a base connector includes providing the flexible connector with a first plurality of solder bumps arranged in a first pattern, and providing the base connector with a second plurality of solder bumps arranged in a second pattern. The flexible and base connectors are aligned by aligning the first and second pluralities of solder bumps.

Certain aspects of the present disclosure generally relate to a circuit board with ground vias offset from associated ground bumps. One example circuit board generally includes a first signal connection terminal configured to connect a signal line of the circuit board to an integrated circuit (IC); a ground plane having a first ground connection terminal disposed adjacent to the first signal connection terminal, the first ground connection terminal being configured to provide a ground connection between the ground plane and the IC; and a first ground via associated with and disposed adjacent to the first ground connection terminal and coupled to the ground plane, wherein, from an overhead view of the circuit board, the first ground via is located at a position that is offset from a first axis on which the first signal connection terminal and the first ground connection terminal are disposed.

An apparatus, system and method for dispensing underfill to components on a printed circuit board. The apparatus, system and method may include an underfill chamber having an input through which the printed circuit board is received; at least one dispensing robot capable of dispensing the underfill to the components; a lower heater suitable to substantially evenly heat at least half of or the entirety of an underside of the printed circuit board once the printed circuit board is within the underfill chamber; and an overhead heater capable of heating up to half of a topside of the printed circuit board once the printed circuit board is within the underfill chamber.

A system includes a top printed circuit (PCB) including an array of contact pads, a bottom PCB including an array of contact pads, at least one interposer positioned between the top and bottom PCBs, including: an array of top connectors configured to contact the array of contact pads of the top PCB; an array of bottom connectors configured to contact the array of contact pads of the bottom PCB; and interconnections configured to electrically connect the top connectors and the bottom connectors, at least one spacer element positioned between the top PCB and the bottom PCB and configured to contribute to maintaining a specified distance between the top PCB and the bottom PCB; and at least one fastener of the top PCB and the bottom PCB. The system further includes fasteners configured to press the top PCB, the interposer, the bottom PCB, and the spacer layer together.

A connector includes a flexible connector having a first plurality of solder bumps arranged in a first pattern, and a base connector having a second plurality of solder bumps arranged in a second pattern concentric with and of a different size than the first pattern. A method of interconnecting a flexible connector to a base connector includes providing the flexible connector with a first plurality of solder bumps arranged in a first pattern, and providing the base connector with a second plurality of solder bumps arranged in a second pattern. The flexible and base connectors are aligned by aligning the first and second pluralities of solder bumps.

A printed circuit board includes a first insulating layer; a first wiring layer having at least a portion buried in one surface side of the first insulating layer and having at least a portion of one surface exposed from the one surface of the first insulating layer; a metal post disposed on the exposed one surface of at least the portion of the first wiring layer; and a second wiring layer disposed on the other surface of the first insulating layer. A width of a first surface, connected to the exposed one surface of at least a portion of the first wiring layer, of the metal post, is greater than a width of a second surface of the metal post opposing the first surface.

A circuit board and a method of manufacturing the same are provided. The method includes the following steps of providing a first conductive layer; providing an adhesive material and at least one conductive bump, in which the adhesive material is electrically conductive; adhering at least one conductive bump to a surface of the first conductive layer using the adhesive material; providing an insulation layer; disposing the insulation layer on the surface of the first conductive layer and at least one conductive bump; and disposing a second conductive layer on the insulation layer.

An example apparatus includes a first printed circuit board (PCB) having a power layer, a ground layer, and a slot. The slot includes a first power electrical contact that is electrically connected to the power layer and a first ground electrical contact that is connected to the ground layer. The slot extends orthogonally or obliquely through multiple layers of the first PCB. A second PCB includes a second power electrical contact, a second ground electrical contact, and capacitors electrically connected between the second power electrical contact and the second ground electrical contact. The second PCB is configured for insertion into the slot to form an electrical connection between the first power electrical contact and the second power electrical contact and between the first ground electrical contact and the second ground electrical contact.

In an example, a communication module such as an optoelectronic communication module may include an integrated circuit (IC), an electrical interconnect, and an interposer circuit. The electrical interconnect may include a radio frequency (RF) interconnect or a direct current (DC) interconnect. The interposer circuit may be electrically coupled between the IC and the electrical interconnect.