Provided are an electrodeposited copper foil, an electrode comprising the same, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a drum side and a deposited side opposing the drum side, wherein at least one of the drum side and the deposited side exhibits a void volume value (Vv) in the range of 0.17 μm.sup.3/μm.sup.2 to 1.17 μm.sup.3/μm.sup.2; and an absolute value of a difference between a maximum height (Sz) of the drum side and a Sz of the deposited side is in the range of less than 0.60 μm.

Provided are an electrodeposited copper foil, a current collector, an electrode, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a deposited side and a drum side opposite the deposited side. In a first aspect, ΔRS between the deposited side and the drum side is at most about 95 MPa, and the deposited side exhibits a Vv in a range from about 0.15 μm.sup.3/μm.sup.2 to about 1.35 μm.sup.3/μm.sup.2. In a second aspect, the deposited side has a Sku of about 1.5 to about 6.5 and the deposited side exhibits a Vv in a range from about 0.15 μm.sup.3/μm.sup.2 to about 1.35 μm.sup.3/μm.sup.2. The characteristics are beneficial to improve the quality of the electrodeposited copper foil, thereby extending the charge-discharge cycle life of a lithium-ion secondary battery comprising the same.

A display apparatus includes a display panel having a display substrate on which a plurality of pad terminals is disposed, and a driving unit having a plurality of driving terminals electrically connected to the plurality of pad terminals. Each of the plurality of pad terminals includes a stepped groove that faces a corresponding driving terminal of the plurality of driving terminals or each of the plurality of pad terminals includes an opening hole that faces the corresponding driving terminal of the plurality of driving terminals.

A method for manufacturing a touch panel includes the steps of: forming a first imprint layer; forming a first wire forming groove portion; forming a first wire; forming a spacer layer so that the spacer layer is placed over a surface of the first imprint layer in which the first wire forming groove portion has been formed and overlaps a part of the first wire; forming a second imprint layer so that the spacer layer is sandwiched between the first imprint layer and the second imprint layer; forming a second wire forming groove portion; forming a second wire; and delaminating the spacer layer from the first imprint layer and removing, together with the delaminated portion, a portion of the second imprint layer that overlaps the delaminated portion.

A conductor trace structure reducing insertion loss of circuit board, the circuit board laminates an outer layer circuit board, an inner layer circuit board and a glass fiber resin films which arranged between each board; before laminated process, the conductor traces of the inner layers had formed by etching of imaging transfer process and conductor traces had been roughed process for making the glass fiber resin films having good adhesive performance during laminating; before etching of imaging transfer process that forms the conductor traces of the outer layers or solder resist coat process or coating polymer materials, the conductor traces have been roughed process to make insulating resin layer of the solder resist coat or polymer materials to has better associativity; wherein a smooth trench is formed by physical or chemical process constructed on the roughed conductor traces surface to guide electric ions transmitted on these smooth trench surface to enhance electric ions transmission rate, resulting in reducing the impedance so as to achieve reducing insertion loss.

A printed circuit board includes a substrate and at least one electrical circuit provided at least partially on a surface layer of thee printed circuit board. The electrical circuit includes an electrical trace that is in electrical connection with a test pad provided for accessibility on the surface layer, the test pad being sized and shaped for probing to test an aspect of the circuit, the test pad having a conductive probe surface that is structured to provide at least one vertical surface that extends from the probe surface toward the surface layer and thus providing an edge between the vertical surface and the probe surface, the probe surface having a coating of a material to protect the conductive probe surface from corrosion.

The present disclosure relates to a laminated-type chip component, and more particularly, to a laminated-type chip component which can be more stably bonded by forming a groove filled with solder in a region in which an external electrode terminal of the laminated-type chip is soldered and thereby increasing the area of soldering.

A printed circuit board includes a substrate and at least one electrical circuit provided at least partially on a surface layer of the printed circuit board. The electrical circuit includes an electrical trace that is in electrical connection with a test pad provided for accessibility on the surface layer, the test pad being sized and shaped for probing to test an aspect of the circuit, the test pad having a conductive probe surface that is structured to provide at least one vertical surface that extends from the probe surface toward the surface layer and thus providing an edge between the vertical surface and the probe surface, the probe surface having a coating of a material to protect the conductive probe surface from corrosion.

A display apparatus includes a display panel having a display substrate on which a plurality of pad terminals is disposed, and a driving unit having a plurality of driving terminals electrically connected to the plurality of pad terminals. Each of the plurality of pad terminals includes a stepped groove that faces a corresponding driving terminal of the plurality of driving terminals or each of the plurality of pad terminals includes an opening hole that faces the corresponding driving terminal of the plurality of driving terminals.

A printed circuit board includes a substrate and at least one electrical circuit provided at least partially on a surface layer of the printed circuit board. The electrical circuit includes an electrical trace that is in electrical connection with a test pad provided for accessibility on the surface layer, the test pad being sized and shaped for probing to test an aspect of the circuit, the test pad having a conductive probe surface that is structured to provide at least one vertical surface that extends from the probe surface toward the surface layer and thus providing an edge between the vertical surface and the probe surface, the probe surface having a coating of a material to protect the conductive probe surface from corrosion.