A method for manufacturing a touch panel includes the steps of: forming a first imprint layer; forming a first wire forming groove portion; forming a first wire; forming a spacer layer so that the spacer layer is placed over a surface of the first imprint layer in which the first wire forming groove portion has been formed and overlaps a part of the first wire; forming a second imprint layer so that the spacer layer is sandwiched between the first imprint layer and the second imprint layer; forming a second wire forming groove portion; forming a second wire; and delaminating the spacer layer from the first imprint layer and removing, together with the delaminated portion, a portion of the second imprint layer that overlaps the delaminated portion.

A printed circuit board according to one embodiment of the present invention comprises an insulation board and a plurality of metal electrodes disposed on the insulation board, wherein: the plurality of metal electrodes include a first electrode and a second electrode; the first electrode includes a first surface parallel to an upper surface of the insulation board, a second surface facing the first surface, a first side surface disposed between the first surface and the second surface, and a second side surface facing the first side surface; a part of the first side surface and a part of the second side surface protrude toward the outside of the first electrode in the direction parallel to the upper surface of the insulation board; the first side surface protrudes farther in an area adjacent to the first surface than in an area adjacent to the second surface; and the second side surface protrudes farther in the area adjacent to the second surface than in the area adjacent to the first surface.

Disclosed is a stretchable electronic device, including: a stretchable board having a surface for mounting one or more electric parts; and a stretchable conductive connecting body provided on the stretchable board, extended in a three-dimensional stereoscopic structure in the direction away from the surface, and having stretchability. The stretchable conductive connecting body comprises a conductive connecting part for attaching the upper surface of the stretchable conductive connecting body to the electric part so as to be electrically connected to an electrode of the electric part.

An electronic device and manufacturing method thereof are disclosed. The manufacturing method of the electronic device comprises following steps: forming at least a thin-film conductive line on the substrate by a thin-film process; forming at least an electrical connection pad on the substrate by a printing process, wherein the electrical connection pad is electrically connected with the thin-film conductive line; and disposing at least an electronic element on the substrate, wherein the electronic element is electrically connected with the thin-film conductive line through the electrical connection pad. The electronic device has a lower manufacturing cost and a higher component configuration density, and the production yield and reliability of the electronic device are improved by the configuration of the electrical connection pad.

Disclosed is a method for manufacturing a stretchable electronic device, including: manufacturing and connecting a stretchable board and a stretchable conductive connecting body constituting the stretchable electronic device, the stretchable board having a surface for mounting one or more electric parts, the stretchable conductive connecting body being provided on the stretchable board, extended in a three-dimensional stereoscopic structure in the direction away from the surface, and having stretchability, wherein the stretchable conductive connecting body comprises a conductive connecting part for attaching the upper surface of the stretchable conductive connecting body to the electric part so as to be electrically connected to an electrode of the electric part; and attaching one or more electric parts to the stretchable conductive connecting body.

Electrodeposited copper foils having properties suitable for use as current collectors in lithium-ion secondary batteries are disclosed. The electrodeposited copper foils include a drum side and a deposited side. At least one of the deposited side or the drum side exhibits a void volume (Vv) value in the range of 0.17 to 1.17 m.sup.3/m.sup.2.

Electrodeposited copper foils having properties suitable for use as negative electrode current collectors in lithium-ion secondary batteries are disclosed. The copper foil has a yield strength in the range of 11 to 45 kg/mm.sup.2, and a difference in residual stress between the drum side and the deposited side of at most 95 MPa. Negative electrode current collectors for lithium-ion secondary battery, a lithium-ion secondary battery incorporating the negative electrode, and batteries containing the negative electrode current collector are also disclosed.

Disclosed is a stretchable electronic device, including: a stretchable board having a surface for mounting one or more electric parts; and a stretchable conductive connecting body provided on the stretchable board, extended in a three-dimensional stereoscopic structure in the direction away from the surface, and having stretchability. The stretchable conductive connecting body comprises a conductive connecting part for attaching the upper surface of the stretchable conductive connecting body to the electric part so as to be electrically connected to an electrode of the electric part.

A semiconductor device and a method for manufacturing the semiconductor device. The semiconductor device includes an insulating substrate, a semiconductor chip, a plate member, and a cooler. The insulating substrate includes insulating ceramics serving as an insulating plate, and conductive plates provided on opposite surfaces of the insulating ceramics. The semiconductor chip is provided on an upper surface of the insulating substrate. The plate member is bonded to a lower surface of the insulating substrate. The cooler is bonded to a lower surface of the plate member. At least one of bonding between a lower surface of the insulating substrate and the plate member and bonding between a lower surface of the plate member and the cooler is performed via a bonding member composed mainly of tin. Also, a cyclic stress of the plate member is smaller than a tensile strength of the bonding member.

A circuit board includes a board body and pair of connection portions disposed at both ends of the board body. Each of the pair of connection portions is inserted into a connector. Each of the pair of connection portions includes a connection terminal electrically connected to the connector, and at least one of the pair of connection portions includes an extending portion extending from the connection terminal to an insertion leading end of the at least one of the pair of connection portion. The extending portion is disposed at a position to avoid a virtual line extending in an insertion direction through a position where the connector and the connection terminal are electrically connected.