A lighting unit for a vehicle has a light source carrier with an arrangement of data lines. The lighting unit also has a plurality of light sources positioned on the light source carrier, each of which has an integrated control unit and which are interconnected via the arrangement of data lines in order to exchange data according to a predefined protocol. The rear face of the light source carrier has a plurality of cavities. The front face of the light source carrier is light-conductive, at least in the region of the cavities. The arrangement of data lines is on the rear face of the light source carrier and the line ends of the data lines lead up to or into the number of cavities. At least one light source is fitted into each of the plurality of cavities, such that each light emission surface is oriented towards the floor of the cavity and the light source is electrically contacted and held in the cavity by electrical and mechanical contact with the line ends of the data lines.

A cable connection structure includes: a substrate that includes: an opening; and a core wire connection electrode that is arranged on one of a principle surface and an inner layer across the opening; a cable that is arranged on a principle surface side of the substrate and includes a core wire that is electrically connected to the core wire connection electrode, the core wire connection electrode being extended so as to be separated from the substrate, the core wire connection electrode being connected to the core wire.

The disclosure provides a method for manufacturing a circuit board, which includes: (1) providing a substrate, forming a through hole in the substrate; (2) filling the through hole with a conductor to form a conductive hole; (3) providing a peelable film to cover the substrate; (4) forming a groove by laser, the groove including a concave portion; (5) performing a surface treatment on a wall of the groove; (6) removing the peelable film; (7) forming a seed layer; (8) making a circuit layer to obtain a circuit board unit, the circuit layer including a connection pad, the connection pad shaped as a conductive protrusion which surrounds and is electrically connected to the conductor; (9) repeating step (1) to step (8) at least once; and (10) laminating the circuit board units. The disclosure also provides a circuit board.

A flexible cable may include a base member including a terminal portion, a conductor layer including a plurality of conductive lines disposed on the base member, and a protection layer disposed on the base member to cover at least prat of the conductor layer and to expose a portion of each of the plurality of conductive lines at the terminal portion. A length of each of the plurality of conductive lines may be longer than a length of the base member. A vibration device may include a vibration structure including a vibration layer, a first electrode layer disposed on a first surface of the vibration layer, and a second electrode layer disposed on a second surface of the vibration layer and a flexible cable electrically connected to the first electrode layer and to the second electrode layer of the vibration structure.

A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.

A PCB based electrochemical sensor includes a PCB having a first electrode on a first surface of the PCB, and a second electrode on a second surface. A sensing element, such as a conductive wire, is attached to the first electrode. The PCB includes one or more through holes, and the conductive wire is positioned proximate one or more of the one or more through holes. When the PCB based electrochemical sensor is positioned in a solution to be sensed, the solution fills the through holes. The ions within the solution provide a current pathway between the conductive wire and the second electrode through the through holes. A voltage potential between the two electrodes is measured. The measured voltage potential is used to determine a value associated with the solution, such as a pH value.

The invention relates to a circuit board (1), preferably for a circuit for operating a lighting means, comprising a retaining bow (2), which is arranged on a planar top side (11) of the circuit board (1) and mechanically connected to the circuit board (1); and comprising a through-bore (3), which is arranged at least partially below the retaining bow (2); wherein the through-bore (3) has at least one taper (31) and wherein a housing (5) for protecting the circuit board (1) can be mechanically fastened by means of the retaining bow (2) and the taper (31). The retaining bow (2) is arranged on the circuit board (1) by means of a solder joint (32). The invention further relates to a system for a circuit for operating a lighting means and to a method for fastening a housing (5) to a circuit board (1).

A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.

A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.

Substrates configured to route electrical signals may include a first dielectric material and an electrically conductive material located on a first side of the first dielectric material. A second dielectric material may be located on a second, opposite side of the first dielectric material. A series of voids may be defined by the second dielectric material extending from the first dielectric material at least partially through the second dielectric material. Footprints of at least some of the voids of the series of voids may at least partially laterally overlap with the electrically conductive material.