A microelectronic device includes a substrate, a first component thermally coupled to the substrate at a first area, a second component thermally coupled to the substrate at a second area, a heat source thermally coupled to the substrate at a third area, and a thermal sink thermally coupled to the substrate at a fourth area. A thermal path extends from the first, second, and third areas to the fourth area. The thermal path includes a low thermal conductivity region between the fourth area and the first, second, and third areas. A programmable thermal shunt is disposed across the low thermal conductivity region. The programmable thermal shunt is configured in one of a high thermal conductance state or a low thermal conductance state. The thermal conductance state may be changed from the high thermal conductance state to the low thermal conductance state to the other state, or vice versa.

An image forming apparatus includes an image forming unit configured to form an image on a recording material, and a printed circuit board including a voltage generation unit mounted thereon which is configured to generate a voltage to be applied to the image forming unit. A conductive member is provided on the printed circuit board, to which the voltage generated by the voltage generation unit is applied. An elastic member, including an arm portion biased toward the conductive member and configured to connect the conductive member and the image forming unit to each other. A holding unit is configured to hold the arm portion of the elastic member at a position where the arm portion is not in contact with the conductive member.

A wired circuit board, including a metal supporting layer; an insulating layer formed on one side of the metal supporting layer in a thickness direction thereof; and a conductive layer having a plurality of terminal portions placed to be spaced apart from each other and formed on one side of the insulating layer in the thickness direction. The insulating layer has a first opening which is formed to include the plurality of terminal portions, and the metal supporting layer includes a second opening formed to include the plurality of terminal portions, when projected in the thickness direction. The wired circuit board further includes at least one reinforcing insulating portion which is placed between the plurality of terminal portions in the first opening, and/or at least one reinforcing metal supporting portion which is placed between the plurality of terminal portions in the second opening, when projected in the thickness direction.

An electronic device having a circuit board and a battery is disclosed. The circuit board may include a through hole and an electrical pad surrounding the through hole. In order to electrically couple the circuit board to the battery, and in particular, an electrode of the battery, a tab (or plaque) is placed between the electrical pad and the electrode. The tab electrically couples with the electrical pad by a soldering operation. To couple (electrically and mechanically) the tab with the electrode, a welding operation is used. The welding operation may include a laser weld providing thermal energy through a laser beam. In this regard, the laser beam passes through the through hole, thereby (partially) melting the tab and forming a weld between the tab and the electrode. Accordingly, the tab covers the through hole such that the tab is positioned to receive the laser beam.

Embodiments provide a multilayer printed circuit board intended to connect electronic components, the board comprising a stack of a plurality of conductive layers, the conductive layers comprising two surface layers and one or more internal layers, the board comprising one or more counterbored holes, each counterbored hole comprising a portion with metallization opening onto one of the two surface layers and a portion without metallization opening onto the other surface layer; the multilayer printed circuit board may advantageously comprise one or more metal pads, each metal pad being joined to one of the two surface layers so as to occult the portion without metallization of a corresponding counterbored hole.

Methods of depositing a film selectively onto a first substrate surface relative to a second substrate surface. Methods include soaking a substrate surface comprising hydroxyl-terminations with a silylamine to form silyl ether-terminations and depositing a film onto a surface other than the silyl ether-terminated surface.

A vehicular wiring board includes: a panel attached to a vehicle body and partitioning a vehicle interior and a front compartment of the vehicle body, an electric wiring disposed on a surface of the panel and integrated with the panel; and a box-shaped body disposed on the surface of the panel and integrated with the panel. The box-shaped body includes an electric circuit.

A method of producing at least one connection carrier includes: A) providing a carrier plate with a planar top face; B) applying at least one electrically insulating insulation strip to the top face and cohesively connecting the carrier plate and the insulation strip; and C) applying at least one electrically conductive conductor strip to an adhesive surface of the insulation strip and cohesively connecting the insulation strip and the conductor strip, wherein the conductor strip and the carrier plate are electrically insulated from one another by the insulation strip.

An image forming apparatus includes an image forming unit configured to form an image on a recording material, a printed circuit board including a voltage generation unit mounted thereon and configured to generate a voltage to be applied to the image forming unit, a conductive member provided on the printed circuit board, to which the voltage generated by the voltage generation unit is applied, an elastic member including an arm portion configured to be biased toward the conductive member, and configured to connect the conductive member and the image forming unit, and a holding unit configured to hold the arm portion of the elastic member at a position where the arm portion is not in contact with the conductive member.

An example stretchable device is described that includes electrical contacts and an interconnect coupling the electrical contacts. The interconnect has a meander-shaped configuration that includes at least one nested serpentine-shaped feature. The interconnect can be conductive or non-conductive. The meander-shaped configuration can be a serpentine structure, providing a serpentine-in-serpentine configuration.