A tiling display device comprises a plurality of display devices, and a main circuit board driving the plurality of display devices. Each of the plurality of display devices includes a display panel that displays an image, a plurality of flexible films bonded to a rear surface of the display panel, and a printed circuit board electrically connected to the plurality of flexible films. A plurality of printed circuit boards of the plurality of display devices are cascaded to each other and the plurality of printed circuit boards have a same shape. Therefore, the efficiency of a manufacturing process of the plurality of printed circuit boards provided in a tiling display device can be improved.

A wiring body includes an resin layer, a reticular electrode layer that includes first conductor wires arranged into the shape of a reticulation disposed on the resin layer, and a lead-out wiring layer connected to the reticular electrode layer disposed on the resin layer. The lead-out wiring layer includes a reticulation portion configured by gathering unit reticulations formed by being surrounded by second conductor wires. The second conductor wires are inclined with respect to an extending direction of the lead-out wiring layer. The unit reticulation includes an end portion that is an intersection point between the second conductor wires. The lead-out wiring layer includes a lateral end portion formed by arranging the unit reticulations side by side along the extending direction of the lead-out wiring layer. The lateral end portion of the lead-out wiring layer is closed by the second conductor wires.

The present disclosure discloses a wiring board used to connect a driving chip and a display panel, a flexible display panel and a display device. Signal output ends on the driving chip and signal input ends on the display panel may be arranged in pairs; and the wiring board may include fanout lines each of which is configured to connect a pair of signal output end and the signal input end. The wiring board may include a substrate; a plurality of segments of first connection lines having first resistivity is arranged on a first surface of the substrate; a plurality of segments of second connection lines having second resistivity is arranged on a second surface of the substrate opposite to the first surface. At least parts of the fanout lines are formed by connecting the first connection lines and the second connection lines.

A wiring substrate includes an insulating base that has a plate surface; a first circuit that is provided on the plate surface; a first terminal that is provided on the plate surface, and to which a mounting member is attached; a second terminal that is provided on the plate surface; a first wiring that connects the first circuit and the first terminal to each other; and a second wiring that connects the first terminal and the second terminal to each other, is electrically connected to the first wiring in the first terminal, and has a parallel section in which the second wiring is disposed close to and parallel to the first wiring without being electrically connected to the first wiring outside the first terminal.

A printed circuit board (1) with multiple electronic components (2, 2′, 2″, 2″′, 2″″) arranged on it in at least one group (G1, G2, G3), each of the electronic components (2, 2′, 2″, 2″′, 2″″) having a first and a second electrical component contact surface (3′, 3″) facing the printed circuit board (1), the component contact surfaces (3′, 3″) being connected with corresponding printed circuit board contact surfaces (6, 7, 8) arranged on the printed circuit board (1), successive electronic components (2, 2′, 2″, 2′″, 2″″) being connected in series to form a string, the string having a wave-shaped course, the electronic components (2, 2′, 2″, 2″′, 2″″) of the string being arranged on the printed circuit board (1) in the form of a matrix with at least two rows (Z1, Z2, Z3) and at least two columns (S1, . . . , S6), and the string alternately running up and down along columns (S1, . . . , S6) that are arranged next to one another.

A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.

An apparatus includes a first circuit board, a driving chip, and a second circuit board. The driving chip is coupled to the first circuit board, and the second circuit board is spaced apart from and electrically connected to the driving chip. At least part of the second circuit board is spaced apart from a first surface of the first circuit board.

Passive device assembly for accurate ground plane control is disclosed. A passive device assembly includes a device substrate conductively coupled to a ground plane separation control substrate. A passive device disposed on a lower surface of the device substrate is separated from an embedded ground plane mounted on a lower surface of the ground plane separation control substrate by a separation distance. The separation distance is accurately controlled to minimize undesirable interference that may occur to the passive device. The separation distance is provided inside the passive device assembly. Conductive mounting pads are disposed on the lower surface of the ground plane separation control substrate to support accurate alignment of the passive device assembly on a circuit board. By providing sufficient separation distance inside the passive device assembly, the passive device assembly can be precisely mounted onto any circuit board regardless of specific design and layout of the circuit board.

A semiconductor chip module includes a PCB including first and second faces; a buffer on the first face; a first chip on the first face, and including a first connection terminal and a second connection terminal, a first signal being provided to the first connection terminal, and a second signal being provided to the second connection terminal; a second chip on the second face, and including a third connection terminal to which the first signal is provided, and a fourth connection terminal to which the second signal is provided. The first connection terminal and the third connection terminal may receive the first signal from the buffer at the same time. The first connection terminal may be closer to the buffer as compared with the second connection terminal. The third connection terminal may be closer to the buffer as compared with the fourth connection terminal.

A printed circuit board (PCB) includes: a base substrate including a top surface including an electronic device mounting region; chip connection pads that are provided on the electronic device mounting region; a conductive pattern group that is provided on the top surface of the base substrate and includes an extended conductive pattern extending between two adjacent chip connection pads from among the chip connection pads, the extended conductive pattern being spaced apart from each of the two adjacent chip connection pads; and a solder resist layer that covers a part of the extended conductive pattern and is spaced apart from the chip connection pads.