A circuit board includes a first insulating layer; a first wiring pattern and a second wiring pattern each formed to be side to side with each other on an upper surface of the first insulating layer; a second insulating layer formed on the upper surface of the first insulating layer to cover the first and second wiring patterns; a third wiring pattern formed on an upper surface of the second insulating layer to overlap the first wiring pattern in a vertical direction; a fourth wiring pattern formed on the upper surface of the second insulating layer to overlap the second wiring pattern in the vertical direction; a first via passing through the second insulating layer and connecting the first and fourth wiring patterns; and a second via passing through the second insulating layer and connecting the second and third wiring patterns.

A conductive pattern has been disclosed. The conductive pattern includes a pair of conductive traces. Each of the conductive traces comprises a linear portion and a terminal portion. The terminal portions are arranged adjacent to each other and comprises a pair of circular arc profile with a pair of complementary notches facing toward each other.

An edge connector includes a first row of golden fingers and a second row of golden fingers. The first row of golden fingers is adjacent to a plugging end of the edge connector, and the second row of golden fingers is adjacent to the first row of golden fingers. In a plugging direction of the edge connector, each golden finger in the first row of golden fingers has a first end proximate to the plugging end and a second end opposite to the first end. A first end of a grounded golden finger in the first row of golden fingers is protruded from other golden fingers, and second ends of two or more than two golden fingers in the first row of golden fingers are not aligned with each other.

A flexible circuit board includes a flexible substrate, a chip and a patterned circuit layer. A surface of the flexible substrate is separated into a working area and a nonworking area according to a cutting line. The chip is disposed on the working area. The patterned circuit layer is disposed on the surface and includes signal transmission wires and bypass wires, the bypass wires are not electrically connected to the chip. Each of the bypass wires includes a bypass transmission portion located on the working area and an anti-peeling portion located on the nonworking area. A blank area exists between the anti-peeling area and the bypass transmission portion, and the cutting line passes through the blank area. A distance between 100 um and 400 um exists from the anti-peeling portion to the cutting line.

A radio-frequency high-voltage waveguide device including an electrical conductor configured for operation with a radio frequency and a high voltage relative to a gaseous environment and/or a ground body, an electrically conductive contact unit that is in contact with the conductor at at least one point, the contact unit being arranged on an electrically insulating mount, and an electrically conductive field distribution assembly arranged on the electrically conductive contact unit, the assembly being electrically conductively connected to the contact unit and arranged at least partly in an inside of the mount.

Various embodiments of the disclosure relate to a printed circuit for transmitting a signal in a high-frequency band and an electronic device including the same. The printed circuit board may include a flexible circuit board configured to transmit a signal in a high-frequency band, and the flexible circuit board may include: first multiple layers including a power line configured to transmit power; and second multiple layers stacked in a first direction of the first multiple layers and including a first signal line and a second signal line configured to transmit a signal in the high-frequency band. The first multiple layers may include a first punched region in which at least a portion overlapping the first signal line and the second signal line is removed, the second multiple layers may include a second punched region in which at least a portion overlapping the power line is removed, and at least a portion of the second punched region and the first punched region overlap each other forming a slit penetrating the flexible circuit board in the first direction.

A suspension board with circuit including a first mounting region for mounting a slider and a second mounting region for mounting a piezoelectric element. The wiring circuit board includes a metal support layer, a base insulating layer, and a conductive layer. The conductive layer includes a first wiring pattern, a second wiring pattern, and a shield wiring pattern. The first wiring pattern includes a read wiring. The second wiring pattern includes a power supply wiring disposed at spaced intervals to the read wiring. The shield wiring pattern includes a shield wiring disposed between the read wiring and the power supply wiring.

A circuit board includes a first section on a left side of a third section in a signal-conductor-layer left-right direction and extending in parallel or substantially in parallel with the third section in a signal-conductor-layer front-back direction when viewed in a stacking direction. The first section includes first thin line portions and first thick line portions, each of the first thick line portions has a line width greater than a line width of each of the first thin line portions. The first thin line portions and the first thick line portions are alternately arranged in the signal-conductor-layer front-back direction. In the signal-conductor-layer left-right direction, center lines of the first thin line portions are positioned leftward relative to center lines of the first thick line portions.

Disclosed herein are dual-spiral common-mode filters, printed circuit boards (PCBs) comprising such dual-spiral common-mode filters, and devices comprising such dual-spiral common-mode filters and PCBs. A dual-spiral common-mode filter is patterned into the reference plane of a PCB. The dual-spiral common-mode filter comprises a first spiral portion connected to a second spiral portion. The spiral portions may be substantially identical, or mirror images of each other, or different from each other. One or more signal traces in a signal trace layer of the PCB pass over the dual-spiral common-mode filter. The disclosed dual-spiral common-mode filters can replace both conventional patterned ground structure (PGS) filters used for radio-frequency interference mitigation and the cutouts often used in the reference plane of a PCB to mitigate impedance mismatches due to DC blocking capacitors. Also disclosed herein are methods of making PCBs that include dual-spiral common-mode filters.

Disclosed is a portable communication device including a housing, a first printed circuit board (PCB) disposed in the housing, a wireless communication circuit mounted on the first PCB, and a second PCB including a connection part connected with the first PCB, a first PCB portion extended from the connection part and having greater flexibility than the connection part, a second PCB portion extended from the first PCB portion and having less flexibility than the first PCB portion, a third PCB portion extended from the second PCB portion and having greater flexibility than the second PCB portion, a fourth PCB portion extended from the third PCB portion and having less flexibility than the first PCB portion, a signal line extended to the connection part along the first, second, third, and fourth PCB portions, and vias arranged in at least a partial area of the second PCB portion or the fourth PCB portion, wherein a portion of the signal line is located between some of the vias.